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Trinamic's powerful servo driver TMCM-1636 is the ideal platform for three-phase BLDC motors and DC motors
2020-12
Power
Trinamic Motion Control GmbH
[Dec 1 2020] TRINAMIC Motion Control Ltd. announces the TMCM-1636. The TMCM-1636 was developed for drives with power up to 1000W and 60A RMS, making it ideal for use in robotics, laboratory and factory automation, manufacturing, patient care equipment (such as motorized bed chairs), and industrial drives. By embedding Trinamic's TMC4671 and TMC6100 integrated circuits, the new module enables high current loop ...

Infineon develops advanced hydrogen sulfide protection to extend the lifetime of IGBT modules
2020-12
Power
Infineon Technologies
[Dec 1 2020] Durability determines the service life and reliability of modules in harsh environments. Especially when exposed to hydrogen sulfide (H2S), the life of electronic components can be greatly affected. To counter this threat, Infineon Technologies has developed a unique protection feature. The EconoPACK™+ module with TRENCHSTOP™ IGBT4 chipset is the first in the Econo family to feature this new prot ...

The STMicroelectronics STM32WB wireless microcontroller now supports Zigbee 3.0
2020-12
Connectors
STMicroelectronics
[Dec 1 2020] The STM32WB55 wireless microcontroller now supports Zigbee 3.0, which is based on the Zigbee PRO protocol stack, enabling developers to take advantage of the interoperate, energy efficient Zigbee networking technology to develop home automation, smart lighting, smart buildings, and other broader iot connectivity projects. Zigbee 3.0 integrates the networking capabilities of consumer electronics a ...

KEMET introduces three new series of thin film capacitors
2020-11
Passive Components
KEMET
[Nov 30 2020] KEMET(" KEMET "or the" Company "), a subsidiary of Yageo Corporation(" Yageo "), a leading global supplier of electronic components, announced three new families of metallized polypropylene dielectric film capacitors :C44U-M, C44P-R and R75H. With an aluminum can design, both the C44U-M and C44P-R power film series meet the growing demand for high-power conversion systems in green energy and indu ...

Intel introduces the new Thunderbolt 4, redefining the world of efficient and simple PC connectivity
2020-11
Power
Intel
[Nov 30 2020] Intel has unveiled new details about Thunderbolt™ 4, its next-generation universal cable connectivity solution, which aims to increase minimum performance requirements, expand functionality, and better meet USB4 specification requirements. Thunderbolt 4 will be groundbreaking in offering docking stations with up to four Thunderbolt ports and up to 2 meters of universal cable. Thunderbolt 4 will b ...

Renesas introduces sensor signal conditioning chip with integrated LIN output interface
2020-11
Sensors
Renesas Electronics America
[Nov 30 2020] Renesas Electronics has announced the launch of the ZSSC4132, an automotive pressure sensor solution with an integrated LIN v2.2a interface and automotive grade certification. The single-package sensor Signal conditioning chip (SSC) is a compact form factor that offers superior performance, a highly flexible design, and a cost-effective solution for applications such as HVAC (heating, ventilation ...

TE introduces KILOVAC K250 high voltage DC contactor
2020-11
Connectors
TE Connectivity
[Nov 29 2020] TE Connectivity (TE), a global connectivity and sensor leader, will introduce the KILOVAC K250 high voltage DC contactor. TE's new contactors are designed for harsh environments with a fully sealed design and deliver higher current carrying capacity and isolation voltage than other contactors of the same size and weight on the market. The KILOVAC K250 contactor has a continuous current rating of ...

TE introduces XRC, SRC, and ML-XT connectors as well as XRC terminals
2020-11
Connectors
TE Connectivity
[Nov 29 2020] TE Connectivity has added ultra-rugged Circular connectors (XRC), Sealed Rectangular connectors (SRC), ML-XT connectors and XRC terminals to its connectivity solutions portfolio. These connector products (formerly manufactured by Molex) are ideal for harsh environment applications. As a global industry technology leader in building a safer, sustainable, efficient and connected future, TE will con ...

Vishay has introduced a new 30V n-channel MOSFET half-bridge power stage module
2020-11
Passive Components
Vishay
[Nov 29 2020] Vishay Intertechnology introduces a new 30 V N-channel MOSFET half-bridge power stage This power stage combines high-end TrenchFET MOSFETs and low-end SkyFET MOSFETs with Schottky diodes in a compact PowerPAIR 3.3mm x 3.3mm package. For power conversion in computing and telecommunications applications, the Vishay Siliconix SiZF300DT offers higher power density and efficiency while reducing the nu ...

TE Connectivity's SMI pressure sensors offer a low pressure sensing range
2020-11
Sensors
TE Connectivity
[Nov 28 2020] There is a growing demand for low-voltage sensing capabilities in the industrial and medical markets. From heating ventilation and air conditioning (HVAC) and airflow to continuous positive airway pressure (CPAP), ventilation and patient monitoring applications, the ability to detect small pressure changes is critical. This demand requires pressure sensors to be highly accurate, to provide long-t ...

STMicroelectronics Introduces Stackforce's wM-Bus smart meter bus protocol stack
2020-11
Connectors
STMicroelectronics
[Nov 28 2020] STMicroelectronics and licensed partner Stackforce Corporation have jointly released a wireless remote meter reading system M-Bus(wM-Bus) bus software stack. Using the sub-GHz RF module integrated with the STM32WL microcontroller and various supported modulation schemes, the communication protocol stack can collect meter data wirelessly and remotely, saving material costs and improving design fle ...

Renesas Electronics' leading in-vehicle SOCs are used by Continental in its high-performance computer body
2020-11
Power
Renesas Electronics America
[Nov 28 2020] Renesas Electronics has announced that Continental has adopted the Renesas high-performance System-on-chip (SoC) R-Car M3 for its first generation body high-performance computer (HPC). HPC serves as an on-board computing platform that provides centralized control of vehicle systems and is equipped with security gateway capabilities to enable cloud connectivity. The R-Car M3 supports online (OTA) ...