Technology Articles

2020-12 Semiconductors Dialog Semiconductor GmbH

[Dec 5 2020] Dialog Semiconductor announced a partnership with TDK, a global leader in smart society electronics solutions, to combine Dialog's GreenPAK technology in TDK's latest µPOL™ power solution family to create the world's first monolithic integrated system power timing solution. Traditional discrete solutions on the market today require a range of components, take up more board space, affect system re ...

2020-12 Connectors Maxim Integrated

[Dec 5 2020] Maxim Integrated announced the launch of the MAX32666 microcontroller (MCU) with wireless connectivity, helping designers reduce the cost of BOM for button battery-powered Internet of Things (IoT) products by one-third, and significantly save space and extend battery life. Featuring a floating-point computing unit (FPU) and Bluetooth Low Energy 5.2 (BLE 5.2), this ultra-low-power dual-core Arm® C ...

2020-12 Sensors ams

[Dec 5 2020] Ams launches the world's smallest integrated ambient light sensor (ALS) and proximity detection module to serve the mid-market for handset Oems to develop mobile devices with edge-to-edge displays. Compared to similar devices on the market today, the TMD2755 module is 40% smaller in area and 64% smaller in volume. The TMD2755 provides a complete integrated three-in-one sensor solution that simpli ...

2020-12 Sensors TDK

[Dec 4 2020] TDK's SmartBug™ (MD-42688-P) is a multi-sensor wireless module that utilizes TDK MEMS sensors and algorithms to meet a wide range of IoT applications. The module combines six sensors, a powerful wireless (BLE) MCU, seven algorithm-driven functions and a rechargeable battery in a small ladybug enclosure. It also comes with an add-on board option that includes a Wi-Fi module, an SD card slot, and T ...

2020-12 Power Microchip Technology

[Dec 4 2020] The combination of Microchip Technology Inc. 's digital Signal Controller (DSC) and EPC Power Conversion Corporation's (EPC) ultra-efficient gallium nitride field-effect transistor (eGaN®FET) enables the optimal power density (730 W/in3) for efficient, low-cost DC-DC conversion. EPC announced the launch of the 1/16 brick, 300 W DC/DC Voltage Regulator (EPC9143). The EPC9143 power module integrate ...

2020-12 Semiconductors Infineon Technologies

[Dec 4 2020] Infineon Technologies further expands its portfolio of products for battery management systems with the introduction of a new sensing and balancing IC (TLE9012AQU). The device is specifically designed for batteries in hybrid and electric vehicles, but is also suitable for other applications. It can measure the voltage of up to 12 cells, and over its lifetime, the device is capable of measuring ac ...

2020-12 Power TE Connectivity

[Dec 3 2020] Design engineers no longer have to worry about missing parts, difficult assembly or unattainable order quantities thanks to new, affordable options for high-voltage terminals and connectors from TE Connectivity, the global leader in connectivity and sensors. The new hybrid and electric vehicle solution suite includes all the reliable parts TE has always offered for harness assembly, but now in on ...

2020-12 Power Power Integrations

[Dec 3 2020] Power Integrations has announced the start of production of the InnoSwitch™3-AQ, an AEC-Q100 certified flyback switching IC with an integrated 750 V MOSFETs and secondary side detection. The newly certified device family is suitable for electric vehicle applications such as traction inverters, OBCs (on-board chargers), EMS (Energy Management DC/DC bus converters) and BMS (battery management syste ...

2020-12 Power STMicroelectronics

[Dec 3 2020] To simplify the complex software development challenges faced by iot node developers, ST has introduced the B-L4S5I-IOT01A STM32 Discovery Suite. The new suite includes the standards-certified FreeRTOS™ operating system programming interface, which is fully integrated within the STM32Cube development ecosystem and directly connects to Amazon Web Services (AWS). Hardware tools include an STM32L4+ ...

2020-12 Power Infineon Technologies

[Dec 2 2020] Infineon Technologies AG has added a 62mm industry standard module package to its 1200 V CoolSiC™ MOSFET module family. It uses a proven 62mm device half-bridge topology design, as well as grooved gate chip technology, to open the door for medium power applications in silicon carbide above 250kW (the power density limit of silicon IGBT technology in 62mm packages). Based on the traditional 62mm I ...

2020-12 Power STMicroelectronics

[Dec 2 2020] STMicroelectronics cooperated with Fingerprint Cards AB (Fingerprints), the world's leading biometric technology company, to develop advanced biometric system-on-card solution (BSoC) based on fingerprint recognition technology. In response to market demands to improve the security and convenience of non-receiving payment cards. The BSoC integrated system integrates the latest generation of secure ...

2020-12 Passive Components Vishay

[Dec 2 2020] Vishay Intertechnology has announced the launch of seven small ENYCAP double-layer energy storage capacitors for energy harvesting and backup power applications, with dimensions ranging from 10 mm x 20 mm to 12.5 mm x 40 mm and capacities ranging from 5 F to 22 F. The latest small ENYCAP series of capacitors, including standard 220 EDLC, reinforced 225 EDLC-R, high-voltage 230 EDLC-HV and reinfor ...