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Technology Articles

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Harwin will introduce rugged multi-port coaxial connectors

2020-03 Connectors Harwin Inc.
[Mar 28 2020] Harwin continues to strengthen its portfolio of interconnect solutions for harsh application environments by adding new products to its flagship Datamate Hi-Rel product family. In response to space-constrained RF/wireless designs, each member of the Datamate Coax family includes multiple (linked) coaxial contacts in a compact housing. Because they provide access to multiple coaxial lines through ...
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Infineon has developed a 60 GHz radar chip

2020-03 Power Infineon Technologies
[Mar 27 2020] With the development of technologies such as artificial intelligence, augmented reality and the Internet of Things, by 2020, there will be 5 billion people around the world using smart devices to sense their surroundings. Infineon Technologies AG has developed a 60 GHz radar chip that enables a whole new way of human-computer interaction. With an integrated antenna system, it can accurately sense ...
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Diodes releases High Speed Dual channel flash LED drivers

2020-03 Connectors Diodes Incorporated
[Mar 27 2020] Diodes announced the AL3644, a high-speed dual-channel flash LED driver designed to support advanced camera flash and flashlight functions for the latest smartphones and other portable consumer devices. Key features include independent control of the output current, which can be set through an I2C compatible interface, and the ability to combine two devices (each with a different device identific ...
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Next generation payment system chip to improve payment performance and protection

2020-03 Power STMicroelectronics
[Mar 26 2020] STMicroelectronics announces next-generation STPay System-on-chip (SoC) payment solutions that leverage state-of-the-art technology to improve unconnected payment performance and protection, reduce power consumption requirements, and significantly improve user experience. The new STPay-Topaz family of solutions can be directly embedded in smart cards, pre-installed payment applications running on ...
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Molex introduces the Micro-Latch 2.00mm wire-to-board connector system

2020-03 Connectors Molex
[Mar 26 2020] Molass announced the launch of the Micro-Latch 2.00mm wire-to-board connector system, which is suitable for customers in the industrial automation, consumer goods and automotive markets. Connector systems are ideal for compact applications that require a high temperature resistant design, meeting a variety of standard requirements while still providing excellent reliability. Unique functional fea ...
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High quality, high reliability MJD power automotive bipolar transistor

2020-03 Passive Components Nexperia
[Mar 25 2020] Nexperia introduces A new high quality, high reliability MJD 3 A and 8 A power automotive bipolar transistor (compliant with AEC-Q101 and consumer/industry standards). The portfolio includes eight components that support both 80 V and 100 V, as well as NPN and PNP types. These general-purpose components in industry-standard sizes now complement Nexperia's existing portfolio of high-performance bi ...
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Vishay introduces three new automotive-grade IHLP inductors in size 1212

2020-03 Connectors Vishay
[Mar 25 2020] Vishay has introduced three new automotive grade IHLP ultra-thin, high-current inductors - the IHLP-1212AZ-5A, IHLP-1212BZ-A1 and IHLP-1212BZ-5A - that are the smallest of the company's automotive products to date. Vishay Dale IHLP-1212AZ-5A, IHLP-1212BZ-A1 and IHLP-1212BZ-5A inductors are available in 3.3mm x 3.3mm 1212 form factors, saving space for next generation Advanced Driver assistance sy ...
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NXP launches online library of RF circuits for immediate engineering support

2020-03 Semiconductors NXP
[Mar 24 2020] NXP Semiconductor announced the launch of the RF Circuit Online Library, which provides engineers with online access to more than 400 RF power reference circuits and documentation, enabling engineers to accelerate the development of RF power amplifiers. In addition, the introduction of reference circuit design documents will help reduce time to market in the 5G wireless infrastructure, Industry 4 ...
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Bluetooth product series covering ultra-remote to indoor positioning and other scenarios

2020-03 Power United Chemi-Con
[Mar 24 2020] Following the signing of an asset purchase agreement with Rigado to acquire its Bluetooth module business, u-blox Corporation, a leading global provider of positioning and wireless communications technologies, announced the launch of new Bluetooth modules BMD-341, BMD-345 and BMD-360 to further expand its BMD product range. This underscores u-blox's commitment to exploring Bluetooth low-power inn ...
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The first Adaptec smart storage solution to include an open source toolkit

2020-03 Power Microchip Technology
[Mar 23 2020] Public and private cloud infrastructure vendors are leveraging open source tools to simplify the configuration, deployment, and management of server storage platforms. But so far, they have faced challenges in developing their own storage adapters and embedded solutions for the tool management platform. Microchip Technology is the first company in the industry to address these challenges with the ...
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Infineon introduces an efficient NFC programming method for LED drivers

2020-03 Power Infineon Technologies
[Mar 23 2020] For fast and cost-effective NFC programming of LED drivers, Infineon Technologies has developed the NFC-PWM series NLM0011 and NLM0010 solutions. NFC programming is an emerging technology that aims to replace labor-intensive "plug-in resistance" current setting with a non-contact NFC interface. It improves operational efficiency by automating programming in the production line, while also bringin ...
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3D position Hall sensor with stray field compensation and SPI interface

2020-03 Sensors TDK
[Mar 22 2020] Micronas, a subsidiary of TDK Corporation, has expanded its line of Hall position sensors with the previously released masterHAL family and its new member, the HAL 39xy family. The new HAL 3900 supports true 3D magnetic field measurement and 2D stray field compensation, which can be obtained through a high-speed SPI interface. This enables the sensor to fully meet the needs of the automotive and ...