Technology Articles

2020-04 Semiconductors Toshiba Semiconductor and Storage

[Apr 3 2020] Toshiba Electronic Components & Storage Corporation announced the introduction of the "TC78B027FTG" three-phase brushless motor control predrive IC, which uses Intelligent Phase Control (InPAC) technology to achieve optimal operating efficiency in a wide range of applications such as high-speed server fans, blowers and pumps. In recent years, the capacity and performance of servers have increased ...

2020-04 Connectors Microchip Technology

[Apr 2 2020] As the industry adopts the latest generation of PoE technology to manage data and power over a single Ethernet line, users need to work with pre-standard power receiving devices within their existing Ethernet infrastructure alongside new IEEE 802.3bt-2018 compliant power receiving devices. To adapt to this change, Microchip Technology has introduced PoE suppliers and mid-span devices that comply ...

2020-04 Sensors ams

[Apr 2 2020] Ams has introduced a new sensor solution, the TCS3408, to help mobile phone rear cameras with rolling shutter image sensors eliminate effects such as banding and other image artifacts caused by blinking artificial light sources. With the widespread use of leds, mobile phone photography is increasingly plagued by flickering light sources. ams' new TCS3408 color sensor offers increased accuracy and ...

2020-04 Power Semtech

[Apr 1 2020] Semtech, a leading provider of high-performance analog and mixed-signal semiconductor products and advanced algorithms, announced: As a leading provider of end-to-end automation solutions for smart gas, water and electricity meters, Hanbit has developed a new ultrasonic water meter (UWM) solution based on Semtech's LoRa devices and the LoRaWAN protocol. Hanbit's ultrasonic water meter products ut ...

2020-04 Semiconductors Maxim Integrated

[Apr 1 2020] Maxim Integrated Products announced the launch of the MAX17853 battery Monitor IC, a single-chip solution for automotive applications that enables safer, more productive battery management systems through ASIL-D certification. The MAX17853 optimizes the design of medium and large battery packs for electric and hybrid vehicles, and uses Maxim's unique Flexpack flexible architecture, enabling custo ...

2020-03 Power Microchip Technology

[Mar 31 2020] Spacecraft electronics developers typically use radiation-resistant (RT) field-programmable gate arrays (FPgas) to develop onboard systems to meet the demanding performance requirements of future space missions, withstand violent launch processes, and operate continuously and reliably in the harsh space environment. Microchip Technology introduces the optimized radiation-resistant RT PolarFire FP ...

2020-03 Connectors Diodes Incorporated

[Mar 31 2020] Diodes announced the introduction of the PI3WVR648GEAEX five-channel MIPI 2:1 switch, capable of switching physical layers that comply with the C-PHY or D-PHY serial interface specification (as defined by industry standard specifications) for smart phone image sensors and cameras, as well as mobile product application displays. As smartphone and portable device manufacturers combine camera module ...

2020-03 Power STMicroelectronics

[Mar 30 2020] STMicroelectronics introduces the latest generation of transient Voltage suppression (TVS) diodes with market-leading power density, rated at 600W and transient power up to 1500W in SMB Flat packages. The SMA Flat package, which is only 1.0mm thick, has a rated and transient power of 400W and 600W, respectively. STMicroelectronics' new 1500W SMB Flat package is not only thin, the transient power ...

2020-03 Semiconductors NXP

[Mar 30 2020] NXP Semiconductors announced the full availability of its full range of RF Power multi-chip modules (MCM) portfolio to support the development of massive MIMO active antenna systems for 5G base stations. NXP's 5G Airfast solution is more integrated, reducing power amplifier size, shortening design cycles and simplifying manufacturing processes. Paul Hart, senior vice president and general manager ...

2020-03 Connectors Molex

[Mar 29 2020] Molex introduces the Impact zX2 backplane connector system, which offers industry-leading speed and signal integrity (SI) performance while supporting data rates up to 28 Gbps in a modular design. The system uses Impel's patented ground shielding and footprint technology to enhance SI performance. For customers looking to upgrade their line cards to meet increasing data rate requirements, this ca ...

2020-03 Passive Components Vishay

[Mar 29 2020] Vishay Intertechnology has announced the launch of a new series of 3.0-V reinforced ENYCAP electric double-layer energy storage capacitors, the 235 EDLC-HVR ENYCAP, for energy harvesting and backup power applications in harsh, high-humidity environments. Vishay BCcomponents 235 EDLC-HVR ENYCAP capacitors are the first in the industry to have a service life of 2000 hours at +85 °C and a maximum ra ...

2020-03 Power Trinamic Motion Control GmbH

[Mar 28 2020] Using TMCM-0013-xA to test the phase current of a motor coil, TRINAMIC offers a cost-effective alternative to test and debug setup. Using standard probe clips or SMA-2-BNC connectors, engineers can now find the best current for their motors and applications without the need for expensive current clips. On October 7, TRINAMIC Motion Control Inc. announced the launch of its latest laboratory tool, ...