Technology Articles

2015-04 Power Infineon Technologies

[Apr 5 2015] Infineon Technologies AG announced the expansion of its silicon-based gallium nitride (GaN) technology and product portfolio. Today, Infineon offers enhanced mode and cascaded mode GaN platforms optimized for high-performance devices requiring ultra-high energy efficiency, including switching power applications such as servers, telecommunications equipment, mobile power supplies, and consumer ele ...

2015-04 Power Silicon Labs

[Apr 4 2015] Silicon Labs has announced a new complete line of receiver/audio processors and multi-standard digital radio ics, designed to deliver the best AM/FM and digital radio performance for the global automotive radio market. The Si479xx AM/FM receiver and digital radio tuner family with on-chip audio processing sets a new benchmark for in-car radio reception performance at the lowest system cost. The n ...

2015-04 Connectors Silicon Labs

[Apr 4 2015] Silicon Labs has announced the introduction of a new family of high-performance digital set-top box (STB) tuner ics designed to reduce the cost, complexity and power consumption of wired, terrestrial, hybrid terrestrial/satellite and IP-based STB products. Silicon Labs' new Si2144 and Si2124 digital tuner ics help STB designers reduce board area and bill of materials (BOM) costs with superior sin ...

2015-04 Connectors Teledyne LeCroy

[Apr 3 2015] Teledyne LeCroy releases the industry's first PAM4 signal analysis software for oscilloscopes. The new analysis suite, capable of measuring all three eye patterns, jitter, and noise of PAM4 signals, is needed by engineers designing the next generation of electrical and optical links to seek speed doubling by utilizing PAM4 signals. PAM4 encodes 2 bits of information for each Symbol by using a 4-l ...

2015-04 Power STMicroelectronics

[Apr 3 2015] STMicroelectronics introduces four new quad-core system-on-chip (SoC) for the Ultra HD p60 market in China, the new products STiH314/318 and STiH414/418 are part of ST's Cannes/ Monaco series, which is popular in the HD market. At present, a number of major Oems have begun to use these system chips to develop a new generation of ultra-high-definition products. Philippe Notton, Vice President and ...

2015-04 Power ams

[Apr 2 2015] Ams announces an integrated power management unit, the AS3701. The device has a very small footprint, making it ideal for use in wearables and other space-constrained devices. The AS3701 is a chip scale package (WL-CSP) miniature PMIC with low static current, multiple power output, power saving, battery charging, battery protection and start-up functions in one package, measuring 2mm x 2mm x 0.4m ...

2015-04 Semiconductors ON Semiconductor

[Apr 2 2015] ON Semiconductor's latest power management technologies include new LLC current mode power supplies for computers and LED TVS, significant advances in GaN, and motor driven controllers without position sensors. On introduces its first Current mode LLC controller, the NCP1399, highlighting its safety features and the inherent benefits of current mode control solutions. The power supply reference d ...

2015-04 Optoelectronics Molex

[Apr 1 2015] Molex introduces Polymicro Technologies fiber bundle assemblies. The fiber bundle assembly is custom-configured to meet the needs of scientific and industrial optics including biotechnology and pharmaceutical diagnostic instruments, semiconductor manufacturing and inspection, and laser welding and marking. Teodor Tichindelean, global product Manager for Polymicro Technologies at Molex, said: "Qua ...

2015-04 Power Industrial Fiberoptics

[Apr 1 2015] Imagination Technologies and Chukong Technologies have announced that the latest version of Cocos2d-x has been fully optimized for Imagination MIPS cpus or PowerVR Gpus. Runs efficiently on devices with both Imagination IP cores built in. Touch Tech is the developer and maintainer of Cocos2d-x, an open source game engine that is currently widely used in the market. More than 400,000 developers wo ...

2015-03 Connectors CUI

[Mar 31 2015] CUI Inc. announced the launch of the highest current digital Point of Load POL series NDM3Z-90. Designed to meet the rapidly growing power demands of today's most advanced integrated circuit products, these devices are non-isolated modules in ultra-low side high vertical and horizontal packages with an output current of 90 A. The product family provides reference levels while integrating a range ...

2015-03 Connectors Microchip Technology

[Mar 31 2015] Microchip Technology Inc., a global leader in integrated microcontroller, mixed-signal, emulator and flash memory patented solutions, announced the launch of the new SST11CP225 compliant with IEEE 802.11ac ultra-high data rate Wi-Fi standard GHz Power Amplifier module (PAM). The new PAM has a linear output power of 19 dBm at 1.8% dynamic EVM(error vector amplitude) and MCS9 80 MHz bandwidth modul ...

2015-03 Connectors TE Connectivity

[Mar 30 2015] TE Connectivity announced the launch of three new board-to-board (BTB) connectors, including a 0.4 mm fine-pitch EMI(Electromagnetic interference) shielded board-to-FPC (flexible Printed circuit) connector, a 0.4 mm pitch board-to-board connector, and a 0.35 mm pitch board-to-board connector with a locking latch. Further expanded the board-to-board product portfolio for the Internet of Things (Io ...