Technology Articles

2015-04 Power ams

[Apr 2 2015] Ams announces an integrated power management unit, the AS3701. The device has a very small footprint, making it ideal for use in wearables and other space-constrained devices. The AS3701 is a chip scale package (WL-CSP) miniature PMIC with low static current, multiple power output, power saving, battery charging, battery protection and start-up functions in one package, measuring 2mm x 2mm x 0.4m ...

2015-04 Semiconductors ON Semiconductor

[Apr 2 2015] ON Semiconductor's latest power management technologies include new LLC current mode power supplies for computers and LED TVS, significant advances in GaN, and motor driven controllers without position sensors. On introduces its first Current mode LLC controller, the NCP1399, highlighting its safety features and the inherent benefits of current mode control solutions. The power supply reference d ...

2015-04 Optoelectronics Molex

[Apr 1 2015] Molex introduces Polymicro Technologies fiber bundle assemblies. The fiber bundle assembly is custom-configured to meet the needs of scientific and industrial optics including biotechnology and pharmaceutical diagnostic instruments, semiconductor manufacturing and inspection, and laser welding and marking. Teodor Tichindelean, global product Manager for Polymicro Technologies at Molex, said: "Qua ...

2015-04 Power Industrial Fiberoptics

[Apr 1 2015] Imagination Technologies and Chukong Technologies have announced that the latest version of Cocos2d-x has been fully optimized for Imagination MIPS cpus or PowerVR Gpus. Runs efficiently on devices with both Imagination IP cores built in. Touch Tech is the developer and maintainer of Cocos2d-x, an open source game engine that is currently widely used in the market. More than 400,000 developers wo ...

2015-03 Connectors CUI

[Mar 31 2015] CUI Inc. announced the launch of the highest current digital Point of Load POL series NDM3Z-90. Designed to meet the rapidly growing power demands of today's most advanced integrated circuit products, these devices are non-isolated modules in ultra-low side high vertical and horizontal packages with an output current of 90 A. The product family provides reference levels while integrating a range ...

2015-03 Connectors Microchip Technology

[Mar 31 2015] Microchip Technology Inc., a global leader in integrated microcontroller, mixed-signal, emulator and flash memory patented solutions, announced the launch of the new SST11CP225 compliant with IEEE 802.11ac ultra-high data rate Wi-Fi standard GHz Power Amplifier module (PAM). The new PAM has a linear output power of 19 dBm at 1.8% dynamic EVM(error vector amplitude) and MCS9 80 MHz bandwidth modul ...

2015-03 Connectors TE Connectivity

[Mar 30 2015] TE Connectivity announced the launch of three new board-to-board (BTB) connectors, including a 0.4 mm fine-pitch EMI(Electromagnetic interference) shielded board-to-FPC (flexible Printed circuit) connector, a 0.4 mm pitch board-to-board connector, and a 0.35 mm pitch board-to-board connector with a locking latch. Further expanded the board-to-board product portfolio for the Internet of Things (Io ...

2015-03 Semiconductors Cypress Semiconductor

[Mar 30 2015] Cypress Semiconductor, a market leader in static random access memory (SRAM), announced that network equipment manufacturer Exablaze selected Cypress's QDR-IV SRAM for its ExaLINK Fusion network switches. The switch uses a modular design that interconnects the Xilinx Ultrascale FPGA with QDR-IV memory. ExaLINK Fusion features Cypress's fastest QDR-IV device at 1066 MHz, the highest random access ...

2015-03 Connectors Texas Instruments

[Mar 29 2015] Texas Instruments has introduced the industry's first 80V, 10A integrated Gallium nitride (GaN) field-effect transistor (FET) power stage prototype. The prototype consists of a high-frequency driver in a quad flat leadless (QFN) package and two GaN FETs in a half-bridge configuration, making it very easy to design. The new LMG5200 GaN FET power stage prototype will help accelerate the marketizati ...

2015-03 Connectors Texas Instruments

[Mar 29 2015] Texas Instruments and LGS Innovation, a leading provider of advanced networking and communications solutions to the U.S. government, announced a partnership in LGS Innovation's next generation of stationary and portable deployable communications and wireless solutions. By leveraging the combination of TI's Keystone-based systems on chip, including the TCI6630K2L, for improved performance and redu ...

2015-03 Power Linear Technology/Analog Devices

[Mar 28 2015] Linear Technology Corporation's SmartMesh IP™ wireless sensor networking products now directly provide programming for the Industrial Internet of Things on embedded ARM Cortex-M3 running Micrium's μC/OS-II real-time operating system (IoT) application capabilities. Users no longer need a separate processor for sensor interface and edge data analysis, reducing the cost, footprint and power consumpt ...

2015-03 Power Infineon Technologies

[Mar 28 2015] Infineon Technologies AG and Panasonic announced that the companies have entered into an agreement to jointly develop GaN devices using Panasonic's normally closed (enhanced) silicon substrate gallium nitride (GaN) transistor architecture, packaged with Infineon's surface Mount (SMD). In this context, Panasonic granted Infineon a license to use its normally closed GaN transistor structure. Under ...