Technology Articles

2024-01 Sensors TDK

[Jan 23 2024] TDK Corporation is pleased to introduce the demo kit for the mechanically decoupled ultrasonic sensor module USSM1.0 PLUS-FS. It is ideal for obstacle detection and distance measurement applications under harsh conditions, such as bright light and transparent object detection, and is widely used in autonomous mobile robots (AMR) or autonomous guided vehicles (AGV). The demo kit includes a TDK dem ...

2024-01 Connectors Infineon Technologies

[Jan 23 2024] Modern power systems require efficient and compact regulators. To address this challenge, Infineon Technologies AG has launched the TDA388xx family for the server, AI, data communications, telecommunications and storage markets. The latest 12 A and 20 A synchronous step-down regulators use a fast constant on-time (COT) control mode to optimize performance. This approach ensures fast transient res ...

2024-01 Sensors Melexis Technologies NV

[Jan 22 2024] Melexis has announced the launch of the MLX90830, the first pressure sensor chip using the newly patented Triphibian technology. This MEMS pressure sensor is designed in unprecedented miniaturization to robustly measure pressure in gas and liquid media from 2 to 70bar. The device is factory-calibrated by Melexis to measure absolute pressure and provide a proportional analog output signal. The MLX ...

2024-01 Power Renesas Electronics America

[Jan 22 2024] Renesas Electronics announced the launch of the DA14592 Bluetooth Low Energy (LE) system-on-chip (SoC), Renesas' lowest power consumption and smallest multi-core (Cortex-M33, Cortex-M0+) Bluetooth Low energy product. Thanks to the careful trade-off between on-chip memory (RAM/ROM/ flash) and SoC chip size (which determines cost), the DA14592 is well suited for a wide range of applications includi ...

2024-01 Connectors Microchip Technology

[Jan 19 2024] Microchip Technology has announced the introduction of its next-generation LAN969x Ethernet switching chip. The series features time-sensitive networking (TSN), scalable bandwidth from 46 Gbps to 102 Gbps, and a powerful 1 GHz single-core Arm® Cortex®-A53 CPU. For applications requiring greater redundancy, the LAN969x series Ethernet switching chips can be configured with High Availability Seamle ...

2024-01 Connectors Transphorm

[Jan 19 2024] Transphorm has announced two new SuperGaN devices in the 4-pin TO-247 package (TO-247-4L). The newly released TP65H035G4YS and TP65H050G4YS FET devices have 35 milliohm and 50 milliohm on-resistance, respectively, and are equipped with a Kelvin source extreme to provide customers with more comprehensive switching capabilities with lower energy losses. The new products will use Transphorm's proven ...

2024-01 Passive Components TDK

[Jan 18 2024] TDK Corporation introduces the latest inductor series KLZ2012-A with dimensions of 2.0mm (L)x 1.25mm (W)x 1.25mm (H). Designed to meet the needs of automotive audio bus (A2B) applications, this series of stacked inductors offers a wide operating range, high durability and excellent inductance tolerances. The series will begin mass production this month, in January 2024. The new low-resistance sof ...

2024-01 Connectors Infineon Technologies

[Jan 17 2024] Edge computing and inference on the satellite enable near real-time data analysis and decision making. This is becoming increasingly important as the number of connected devices and the amount of data they generate continues to grow. To meet the demand of space application of the high performance computing, infineon technologies co., LTD's InfineonTechnologiesLLCMemorySolution recently announced ...

2024-01 Passive Components Littelfuse

[Jan 17 2024] Littelfuse Corporation is an industrial technology manufacturing company dedicated to powering a sustainable, connected and safer world. The company announced the launch of MATE-12B magnetic spring switch series. Compared to existing 12.7mm magnetic spring switches, these ultra-small magnetic spring switches have a longer service life and higher reliability, enabling millions of cycles. Its servi ...

2024-01 Sensors TDK

[Jan 16 2024] TDK announced at CES 2024 the launch of two high-performance MEMS sensors for consumer and industrial applications. The new InvenSense SmartMotion ICM-42370-P is a 3-axis accelerometer for consumer applications that require low noise and high sensitivity. InvenSense SmartInduscial IIM-42653 is a high FSR, 6-axis IMU for industrial applications. The new SmartMotion ICM-42370-P accelerometer is ide ...

2024-01 Power Display Visions

[Jan 16 2024] Japanese semiconductor equipment giant Disco has developed a new SiC (silicon carbide) wafer cutting equipment DFG8541, which can process silicon and silicon carbide wafers with a maximum size of 8 inches, and increase the cutting speed of SiC wafers to 10 times. Silicon carbide (SiC) as a semiconductor material has high power efficiency, but the material is hard and difficult to process. Disco w ...

2024-01 Power TDK

[Jan 15 2024] TDK Corporation and Goodyear Tire & Rubber Company have announced a partnership to drive next-generation tire solutions designed to accelerate the development and adoption of integrated intelligent hardware and software in the tire and automotive ecosystem. The two companies plan to combine TDK's software, sensor and electronic component expertise with Goodyear's expertise in tire development, sm ...