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Power monitoring IC with enhanced isolation and programmable AC/DC monitoring
2023-06
Semiconductors
Allegro MicroSystems, LLC
[Jun 13 2023] With the continuous development of the Internet and digital technology, as well as the rapid improvement of semiconductor technology, there are more and more new smart electrical devices around us, which have penetrated into various fields such as automotive, industrial, consumer and communication. People realize that power monitoring for these devices is becoming more and more important. On the ...
Infineon Technologies has introduced a new family of dual-channel electrically isolated EiceDRIVER gate driver ics
2023-06
Semiconductors
Infineon Technologies
[Jun 13 2023] Today, 3.3 kW switching power supplies (SMPS) use the latest technologies such as superjunction (SJ silicon) power MOSFETs and silicon carbide (SiC) power MOSFETs in the totem pole PFC stage, as well as gallium nitride (GaN) power switches that meet high voltage DC-DC power conversion requirements. The power density can reach 100 W/inch3. Digital control of PFC and DC-DC is as critical to energy ...
Infineon introduces an easy-to-use LCC design tool that enables efficient LED driver design
2023-06
Optoelectronics
Infineon Technologies
[Jun 13 2023] Lighting accounts for a large proportion of global electricity consumption, so energy saving in the lighting sector is crucial. The PFC + LCC resonant topology has proved to be an excellent solution for LED lighting applications such as commercial lighting, outdoor lighting and plant lighting, etc. In order to facilitate the design of engineers, Infineon has introduced the LCC design tool to make ...
Infineon introduces the new OptiMOS 7 40V MOSFET family for automotive applications, which improves on-resistance, switching efficiency and design robustness
2023-06
Power
Infineon Technologies
[Jun 13 2023] Infineon Technologies introduces the OptiMOS 7 40V MOSFET family. As Infineon's latest generation of power MOSFETs for automotive applications, the OptiMOS 7 40V MOSFETs offer a variety of pin-free, robust power packages. The 300-mm thin wafer technology and innovative package offer significant performance advantages over other devices in miniature packages. This makes the new MOSFETs ideal for a ...
How to update the HPC power of electric vehicles to solve the heat dissipation problem?
2023-06
Power
Xilinx
[Jun 12 2023] With the help of DC fast charging technology, up to 350kW high-power DC fast charging (HPCDC), electric vehicles can achieve similar fuel car "stop refueling" in a short time to complete the charge, the driver's range anxiety will be greatly, HPC goal is to support 300km mileage charging time compressed to 10 minutes. Electric vehicles are revolutionizing transportation, powertrain electrificatio ...
The first silicon carbide FETs with RDS below 10mΩ with higher efficiency and lower losses
2023-06
Power
United Chemi-Con
[Jun 12 2023] New power semiconductor company United Silicon Carbide Corporation (UnitedSiC) announced that it will introduce four new SiC FETs with RDS(ON) values as low as 7mΩ and offer unprecedented performance and high efficiency. Suitable for high-power applications such as electric vehicle (EV) inverters, high-power DC/DC converters, high-current battery chargers and solid-state circuit breakers. Of the ...
Vishay introduces new 3rd generation 650 V SiC Schottky diodes
2023-06
Optoelectronics
Vishay
[Jun 12 2023] Vishay Intertechnology announced the launch of 17 new third-generation 650 V silicon carbide (SiC) Schottky diodes. The Vishay Semiconductors are designed with a hybrid PIN Schottky (MPS) architecture with high surge current protection and low forward voltage drop, capacitive charge and reverse leakage current, helping to improve the energy efficiency and reliability of switching power supply des ...
Murata commercializes a resin-molded surface mount MLCC for electric vehicle noise suppression
2023-06
Optoelectronics
Murata Electronics
[Jun 12 2023] Murata has developed the EVA Series, a resin-formed, surface-mounted multilayer ceramic capacitor for electric vehicle noise suppression. Although the product is small and thin (12.7 x 6.0 x 3.7 mm), it still ensures the creepage distance required for high voltage loads (10 mm), and supports the Y2 level of the international standard "IEC60384-14". This is a resin-formed surface mount multilayer ...
NXP's new generation of secure and energy efficient i.MX 91 series extends Linux capabilities for a wide range of edge applications
2023-06
Semiconductors
NXP
[Jun 12 2023] NXP Semiconductors officially announces the i.MX 91 family of application processors. Building on NXP's more than two decades of leadership in developing multi-market application processors, the i.MX 91 series provides a secure, versatile, and energy-efficient portfolio optimized to meet the needs of next-generation Linux-based iot and industrial applications. The newly released protocols change ...
ON Semiconductor offers the next generation 1200 V EliteSiC M3S devices
2023-06
Semiconductors
ON Semiconductor
[Jun 12 2023] Onsemi introduces the latest generation of 1200 V EliteSiC Silicon Carbide (SiC) M3S devices to help power electronics engineers achieve better energy efficiency and lower system costs. The new product family includes EliteSiC MOSFETs and modules that help increase switching speeds for the growing number of 800 V electric vehicle (EV) on-board chargers (OBC) and electric vehicle DC fast charging, ...
Excelitas introduces the new InGaAs avalanche photodiode C30733BQC-01
2023-06
Optoelectronics
Excelitas Technologies
[Jun 12 2023] Excelitas Technologies Corp, an industrial technology leader in innovative, market-driven optoelectronic solutions, has introduced the C30733BQC-01 InGaAs avalanche photodiode. This unique combination of high gain and fast recovery time and low noise performance makes it the ideal solution for high-end telecom test equipment applications, optical communication and distributed fiber optic sensing ...
NXP introduces new top cooling package technology for RF power devices
2023-06
Semiconductors
NXP
[Jun 11 2023] NXP Semiconductor announced the launch of a family of top-cooled RF amplifier modules that incorporate innovative packaging technology to help create thinner wireless products for 5G infrastructure. Smaller base stations can improve the convenience and economics of installation, while being more decentralized into the environment. NXP's GaN multi-chip module family, combined with the new RF power ...