Technology Articles

2023-06 Semiconductors NXP

[Jun 11 2023] NXP Semiconductor announced the launch of a family of top-cooled RF amplifier modules that incorporate innovative packaging technology to help create thinner wireless products for 5G infrastructure. Smaller base stations can improve the convenience and economics of installation, while being more decentralized into the environment. NXP's GaN multi-chip module family, combined with the new RF power ...

2023-06 Semiconductors Infineon Technologies

[Jun 11 2023] Infineon Technologies has further expanded its product portfolio with the EiceDRIVER™ 6ED223xS12T series of 1200V silicon-on-insulator (SOI) three-phase gate drivers with the EiceDRIVER 2ED132xS12x series. The half-bridge configuration of the driver IC series complements the existing 1200V SOI series, providing customers with more choice and design flexibility. The enhanced current output capabil ...

2023-06 Connectors Infineon Technologies

[Jun 10 2023] Infineon Technologies introduces a new automotive power module, HybridPACK™ Drive G2. The module inherits the proven HybridPACK Drive G1 integrated B6 package concept, offering scalability at the same size and scaling to higher power and ease of use. The HybridPACK Drive G2 series has different current and voltage ratings (750 V and 1200 V) and uses Infineon's next generation chip technologies, E ...

2023-06 Power Intel

[Jun 10 2023] In the case of Computex2023 emphasizing the theme of artificial intelligence (AI), the new products launched by various manufacturers are also centered around AI. Processor giant intel (intel) is not exhibiting products in 2023. However, at the same time, it also announced that its code Meteor Lake series processor will import AI applications, and will design the new VPU core in it, which has att ...

2023-06 Semiconductors Toshiba Semiconductor and Storage

[Jun 10 2023] Toshiba Electronic Components & Storage Corporation announced the introduction of motor drive ics "TB67S581FNG", "TB67S580FNG", "TB67H481FNG" and "TB67H480FNG" for consumer products and industrial equipment, which not only reduce the number of external components required, but also reduce the number of external components required. It also uses a very versatile and space-saving compact package. W ...

2023-06 Power Intel

[Jun 9 2023] Intel has announced the release of the first Agilex 7 FPGA R-Tile, which supports PCIe 5.0 and CXL 2.0 capabilities and is now in volume delivery. It uses an R-Tile design and is the only FPGA to support these interfaces with hard intellectual property. Shannon Poulin, corporate vice president and general manager of the Programmable Solutions Group at Intel, said: "We provide the cutting-edge tec ...

2023-06 Sensors ABLIC

[Jun 9 2023] Wireless sensor network (WSN) is a new type of sensor technology developed on the basis of wireless communication technology, it integrates sensing, processing, communication and other functions, and can network, data processing and control the surrounding environment. Wireless sensor networks have the following characteristics: Distributed network Wireless sensor network is a distributed network ...

2023-06 Semiconductors SolaHD

[Jun 9 2023] Two South Korean tech giants, Samsung Electronics and Naver Corp, have entered into a partnership agreement to jointly develop a generative artificial intelligence platform that will be used for enterprise applications and aims to compete with global AI tools such as ChatGPT. According to foreign media reports, the two sides have officially signed a cooperation agreement. Naver is South Korea's l ...

2023-06 Semiconductors Viking Technology

[Jun 9 2023] According to the survey data released by the International Semiconductor Industry Association (SEMI), the world investment in pre-process manufacturing equipment for semiconductor circuits in 2023 will decrease by 22% year-on-year to $76 billion. As demand for smartphones and personal computers, mainly memory semiconductors, weakens amid global inflation, companies are reducing investment amid wo ...

2023-06 Power Microchip Technology

[Jun 9 2023] A standard universal serial bus or USB connection is the industry's dominant way to transfer data between two devices. The large number of electronic components in automotive, industrial and consumer applications has stimulated the demand for remote USB cabling products. In an effort to deliver remote and reliable USB solutions to the market. Microchip Technology announced the launch of two new c ...

2023-06 Semiconductors Microchip Technology

[Jun 9 2023] As smart edge devices put new demands on energy efficiency, safety, and reliability, system architects and design engineers are forced to find new solutions. Microchip Technology announced new development resources and design services to help system designers transition to PolarFire FPgas and SOCs, including the industry's first mid-range industrial edge protocol stack, customizable encryption, a ...

2023-06 Power ABB Embedded Power

[Jun 9 2023] Automotive chip is a core component used in automotive electronic system, which can quickly handle various tasks in the automotive system, while ensuring the stability and safety of the system. With the continuous development of automotive intelligence and electrification, the demand for automotive chips continues to increase. I. The classification of automotive chips Functional division Automoti ...