Technology Articles

2016-01 Semiconductors Cypress Semiconductor

[Jan 8 2016] Cypress Semiconductor Corporation announced that its first - and second-generation USB Power Transfer controllers have passed the USB Designers Forum (USB-IF) certification test process with USB Power Transfer (PD)E-Marker capability. Product test ids for EZ-PD CCG1 (CYPD1103) and EZ-PD CCG2 (CYPD2103) controllers are 1095059 and 1095054, respectively. E-Marker chips are used in USB power transfe ...

2016-01 Passive Components Littelfuse

[Jan 8 2016] Littelfuse, a global leader in circuit protection, offers four general purpose ESD protection Transient Suppression Diode Array (SPA® Diode) solutions that take up less board space than their industry counterparts. The SP1013 and SP1014 transient suppression diode arrays conform to standard 0201 package sizes, but require 30% less board space and greater gaps between components than other 0201 so ...

2016-01 Power Power Integrations

[Jan 7 2016] Power Integrations, Inc. announced the launch of the CAPZero™-2 IC, the next generation of its CAPZero family of innovative double-terminal X-capacitor discharge ics. The CAPZero-2 IC covers a wide range of applications and output power for increased design flexibility. Covering a wide range of X capacitors from 0.1 µF to 6 µF, and with a breakdown voltage rated at 1 kV to withstand transient vol ...

2016-01 Semiconductors Cypress Semiconductor

[Jan 7 2016] Cypress Semiconductor, the market leader in static random access memory (SRAM), announced the industry's highest capacity synchronous SRAM with on-chip error correction codes (ECC). The new 36Mb synchronous SRAM integrates ECC capabilities to provide the highest level of data reliability and simplify the design of a variety of military, communications and data processing applications. Cypress pla ...

2016-01 Power Intematix Corporation

[Jan 6 2016] Imagination Technologies has announced that Imagination's ClearCall VoIP applications now support Cavium's popular OCTEON® III CN70XX/CN71XX family of multi-core MIPS64 processors. This integrated solution is designed for Oems/ODMs and service providers to quickly deliver high-quality VoIP phones and service gateways to the home, small and medium business (SMB) and junior enterprise markets where ...

2016-01 Connectors STMicroelectronics

[Jan 6 2016] STMicroelectronics introduces the new powerSTEP motor driver, a sophisticated motor control design that enables applications to perform high-power work directly on the chip. This fully integrated stepper motor driver System Package (SiP) offers the industry's highest power density of up to 500W/cm2 and will assist automation equipment manufacturers in designing cost-effective motor control system ...

2016-01 Connectors STMicroelectronics

[Jan 5 2016] STMicroelectronics has combined its ultra-low power microcontroller technology with years of experience in ARM Cortex-M4 cores to create the STM32L4 series of microcontrollers for the next generation of energy efficient consumer electronics, industrial, medical and metrological products. The STM32L476 and STM32L486 are based on an 80MHz ARM Cortex-M4 processor core with a floating point unit (FPU ...

2016-01 Power ams

[Jan 5 2016] Ams introduces the new AS3955 Near Field Communication (NFC) interface chip (NFiC) with unique energy harvesting capabilities and data transmission capabilities. Similar to previous AS3953 products, the AS3955 provides contactless bridging between near Field communication (NFC) card readers, such as smartphones and tablets, and any other microcontroller. However, the AS3955 can also provide power ...

2016-01 Power Artesyn Embedded Technologies

[Jan 4 2016] Artesyn Embedded Technologies announced the second generation of its MicroMP(µMP) family of configurable power supplies. Atson's µMP power supply product line has been popular in the market, and this second generation of the µMP16 power supply product has many advantages, such as the highest output power of 1800W, which is unprecedented, the power density of 22.9W/cu.in, and the efficiency of 91% ...

2016-01 Passive Components Molex

[Jan 4 2016] Molex introduces the Super Sabre power connector system for all high-current applications that require flexible wire-to-wire and wire-to-board configurations. Super Sabre power connectors can deliver 34.0 amps per blade and can withstand operating temperatures up to 125°C (USCAR-2, Class 3), especially for automotive and commercial vehicle applications, as well as home appliances, medical, data c ...

2016-01 Connectors Infineon Technologies

[Jan 3 2016] Infineon Technologies AG has announced the launch of its 3D magnetic sensor TLV493D-A1B6, which enables highly accurate 3D sensing with very low power consumption in a compact 6-pin TSOP package. By detecting magnetic fields in the x, y, and z directions, the sensor reliably senses three-dimensional, linear, and rotational motion. The digital I²C interface can realize fast bidirectional communica ...

2016-01 Semiconductors Silicon Labs

[Jan 3 2016] Silicon Labs, a leading provider of microcontrollers, sensors and wireless connectivity solutions in the Internet of Things (IoT), has announced the industry's most energy efficient USB microcontroller (MCU). The new Happy Gecko MCU is the latest addition to Silicon Labs' award-winning EFM32 32-bit MCU product family, providing the industry's lowest USB power consumption for longer battery life a ...