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Qorvo introduces the vehicle scale UWB SoC chip QPF5100Q
2025-01
Connectors
Qorvo US Inc.
[Jan 17 2025] Qorvo, the world's leading provider of connectivity and power solutions, announced the launch of its new vehicle-certified ultra-wideband (UWB) system-on-chip (SoC), the QPF5100Q, with samples available to key customers. This breakthrough SoC addresses the automotive industry's need for high-precision, reliable UWB technology for UWB radar applications such as keyless vehicle security access, dig ...

Renesas introduces new MOSFETs with superior performance
2025-01
Connectors
Renesas Electronics America
[Jan 17 2025] Renesas Electronics announced the introduction of 100V high-power N-channel MOSFETs - RBA300N10EANS and RBA300N10EHPF - based on the new MOSFET wafer manufacturing process, REXFET-1. Ideal high current switching performance for motor control, battery management systems, power management and charge management applications. Terminal equipment based on this innovative product will be widely used in ...

Samsung unveils AI robot "Ballie" and new smart home devices at CES 2025
2025-01
Semiconductors
Samsung
[Jan 13 2025] Samsung Electronics has announced the launch of its first home artificial intelligence robot, "Ballie," which is expected to go on sale in the first half of 2025. Vegas, Nevada is a major event for the tech industry, where companies showcase their innovations. Ballie is a yellow spherical robot designed to improve everyday life by learning consumer usage patterns. It can control various household ...

Texas Instruments (TI) has introduced a new generation of radar sensors and automotive audio processors that support edge AI
2025-01
Power
Texas Instruments
[Jan 13 2025] Texas Instruments has introduced a new integrated automotive chip that helps drivers and passengers of vehicles at all price points achieve a safer and more immersive driving experience. The TI AWRL6844 60GHz millimeter wave radar sensor supports occupancy detection for seat belt reminder systems, child detection in the car, and intrusion detection through a single chip running edge AI algorithms ...

Diodes introduces a 36-channel linear LED driver that meets automotive specifications and is suitable for display and lighting product applications
2025-01
Optoelectronics
Diodes Incorporated
[Jan 13 2025] Diodes introduces new automotive specification * 36-channel linear LED current drivers. With the ability to drive RGB configurations and individual leds, the AL5887Q helps designers achieve a variety of dynamic lighting modes and color depths in internal and external luminaries to meet OEM's brand differentiation needs. These two control functions simplify the complex LED-style module designs of ...

Infineon has announced that it has successfully developed the first 300 mm gallium nitride
2025-01
Semiconductors
Infineon Technologies
[Jan 10 2025] Infineon Technologies AG announced yesterday that it has successfully developed the world's first 300 mm gallium nitride (GaN) power semiconductor wafer technology. Infineon is the world leader in mastering this breakthrough technology in an existing and scalable mass production environment. This breakthrough will greatly boost the GaN power semiconductor market. Compared to 200 mm wafers, 300 mm ...

XP Power introduces ultra-compact, medical-compliant, 4:1 input DC-DC converters for BF and CF applications
2025-01
Power
XP Power
[Jan 10 2025] XP Power has officially announced the JMR03/10/20 series for 3W, 10W and 20W, an ultra-compact, medically compliant DC-DC converter that offers a 4:1 input ratio, making it suitable for a wide range of input requirements. The product offers 2 x MOPP (Patient Protection Mode) with a leakage current of only 2A, ensuring easy integration into BF (body suspension) and CF (heart suspension) grade medi ...

Teledyne e2v has released engineering prototypes of the ARM-based LX2160 to support the design and validation of aerospace programs
2025-01
Semiconductors
Teledyne LeCroy
[Jan 9 2025] Teledyne e2v has announced the release of an engineering prototype of a 16-core ArmCortexa72-based system-on-chip (SoC) processor, LX2160-Space, enabling early project design and hardware and software validation for demanding aerospace applications. The engineering sample of the LX2160-Space has the same size/form factor/function as the Flight positive film (FM). LX2160-Space can be used for many ...

STMicroelectronics announces a new generation of microcontrollers integrated with NPU accelerators to help edge artificial intelligence development
2025-01
Connectors
STMicroelectronics
[Jan 9 2025] STMicroelectronics introduces a new family of microcontrollers with integrated machine learning (ML) accelerators to bring embedded artificial intelligence (AI) to life, enabling cost - and power-focused consumer electronics and industrial products to run algorithms such as computer vision, audio processing, sound analysis, and more. It provides high performance functions that previously small em ...

QNX launches industry-first automotive software solution to accelerate digital cockpit development
2025-01
Semiconductors
WeEn Semiconductors
[Jan 9 2025] BlackBerry, Inc. 's QNX division, has released the QNX® Cabin. As an innovative framework, QNX Cabin empowers Oems to virtualize the development of complex digital cabins in the cloud. The cloud-based development model enables architects and developers to "develop left," designing, testing, and optimizing every line of code in the cloud and then easily migrating it to production system-on-chip (S ...

Qualcomm unveils industry-leading AI innovation and collaboration at CES 2025
2025-01
Power
Qualcomm
[Jan 8 2025] Qualcomm Technologies today announced a series of industry-leading AI innovations at CES 2025, demonstrating how it is transforming the user experience across multiple end categories such as PCS, automotive, smart homes and enterprise. Anmon, president and CEO of Qualcomm, said: "AI is bringing epochal change to the technology field. In 2025, AI processing will continue to migrate to the edge, en ...

Teledyne e2v releases engineering samples of the Arm® based LX2160 to support the design and validation of aerospace programs
2025-01
Connectors
Teledyne LeCroy
[Jan 8 2025] Teledyne e2v has announced the release of a 16-core engineering prototype of the Arm®Cortex® A72-based system-on-chip (SoC) processor LX2160-Space, enabling early project design and hardware and software validation for demanding aerospace applications. The engineering sample of the LX2160-Space has the same size/form factor/function as the Flight positive film (FM). LX2160-Space can be used for m ...