Technology Articles

2025-01 Semiconductors Adafruit Industries

[Jan 6 2025] Artificial intelligence (AI) and machine learning (ML) are advancing at an extraordinary pace, powering progress across industries. As models become larger and more complex, they need to process large amounts of data in real time. This demand puts pressure on the underlying hardware infrastructure, especially memory, which must process massive data sets quickly and efficiently. High-bandwidth mem ...

2025-01 Semiconductors IRTouch Systems

[Jan 6 2025] IAR, the world's leading software solution provider for Embedded system development, and Beijing Guoke World Technology Co., LTD. (hereinafter referred to as "Guoke World") jointly announced that the latest version of IAR Embedded Workbench for RISC-V will fully support the AS32X series RISC-V MCU of Guoke World. The two parties will work together to support the innovative research and developmen ...

2025-01 Semiconductors Intel

[Jan 6 2025] Forget Lunar Lake! If there's one chip family that's critical to Intel's entire turnaround plan, it's the company's upcoming Clearwater Forest Xeon line. This is the first time Intel has shown this chip, and it will be the first mass-produced chip with an 18A process node. Intel CEO Pat Kissinger has said that the 18A node is so important to the company that he has staked the future of the entire ...

2025-01 Connectors Laird Technologies

[Jan 4 2025] Laird Thermal Systems announced the expansion of its product line of micro-thermoelectric chillers with the introduction of the OptoTEC™ MBX family for space-constrained, high-performance optoelectronics applications. The MBX series uses next-generation thermoelectric materials and advanced automated processes TO provide standard and custom options for TEC used in applications such as To-CAN, TOS ...

2025-01 Semiconductors Samsung

[Jan 4 2025] According to reports, due to the unsatisfactory performance of Samsung's foundry business, coupled with weak market demand, Samsung has decided to further close some of the previous generation of production lines. It is particularly noteworthy that even its most advanced second-generation 3-nanometer 3GAP process technology has only reached a low yield of 20% (reference reading: TSMC! Samsung sec ...

2025-01 Connectors Renesas Electronics America Inc.

[Jan 4 2025] Renesas Electronics, a global semiconductor solutions provider, announced the first full memory interface chipset solution for the second-generation DDR5 multi-capacity dual-in-line memory module (MRDIMM). Increasing memory bandwidth requirements for artificial intelligence (AI), high performance computing (HPC), and other data center applications require new DDR5 MRDIMMs. They operate at speeds ...

2025-01 Optoelectronics Silicon Labs

[Jan 4 2025] The Connectivity Standard Alliance (CSA) has released version 1.4 of the Matter 1.4 standard. As a key member of the Connectivity Standards Consortium, and a longtime supporter and active promoter of the Matter standard, Silicon Labs is providing comprehensive solutions that include wireless hardware, software, tools, and the newly launched Matter Extension suite. It was the first to implement su ...

2025-01 Semiconductors Panasonic

[Jan 3 2025] Panasonic Automotive Electronics Systems (PAS) and Arm announced a strategic collaboration to advance the standardization of software-defined vehicle (SDV) architectures. Based on a shared vision, the two companies are committed to creating a flexible software stack that meets the needs of current and future vehicles, and have promoted standardization cooperation in software development for the a ...

2025-01 Semiconductors ON Semiconductor

[Jan 3 2025] Onsemi and Wurth Elektronik announced that Wurth's passive component database has been integrated into ON's unique PLECS® Model Self Generation Tool (SSPMG). SSPMG is a web-based platform with an intuitive, easy-to-use interface that enables engineers to customize high-precision, high-fidelity PLECS models for complex power electronics applications to identify and fix performance bottlenecks earl ...

2025-01 Semiconductors ON Semiconductor

[Jan 3 2025] Onsemi announced the launch of the Treo platform, an analog and mixed-signal platform built with advanced 65nm node BCD (Bipolar - CMOS-DMOS) process technology. The platform provides a strong foundation for ON's broad range of power and perception solutions, including high performance and low power perception, efficient power management and dedicated communications devices. With this scalable si ...

2025-01 Semiconductors STMicroelectronics

[Jan 3 2025] What Is TL072CD? The TL072CD is a practical and efficient dual operational amplifier that combines high-performance JFET and bipolar transistor technology into a single chip, making it both powerful and reliable. It boasts fast response speeds, low bias and offset currents, and minimal temperature influence on offset voltage. Simply put, this chip not only performs quickly but also remains except ...

2025-01 Connectors Tecate Group

[Jan 3 2025] Tektronix has officially launched its latest series of isolated current probes (TICP ISO V) as well as a three-channel bidirectional power supply (EAPSB 20,000). These two new products not only set a new benchmark in the field of power test and measurement, but also demonstrate Tektronix's outstanding strength in driving technological innovation in the industry. Tektronix's new products focus on ...