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What Is ICE3BR0665J IC?
2024-11
Semiconductors
Infineon Technologies
[Nov 8 2024] What Is ICE3BR0665J? - The ICE3BR0665J is a high-performance IC in the CoolSET®-F3R jitter series from Infineon Technologies. - The ICE3BR0665J is designed for offline battery adapters and cost-effective, low-power SMPS applications. - This IC offers advanced power management features, such as active burst mode, auto-restart protection, propagation delay compensation and soft start and gate drivi ...
Infineon introduces ultra-high current density power modules for high-performance AI computing
2024-11
Connectors
Infineon Technologies
[Nov 7 2024] Data centers currently account for more than 2 percent of global energy consumption. Driven by AI, this figure is expected to grow to around 7% by 2030, equivalent to the current energy consumption of all of India. Achieving efficient power conversion from the grid to the core is critical to achieving superior power density, resulting in improved computing performance while reducing total cost of ...
Power Integrations introduces 1700V Gallium nitride switching IC, setting a new benchmark in gallium nitride technology
2024-11
Semiconductors
Power Integrations
[Nov 7 2024] Power Integrations, a well-known company in the field of energy-efficient power conversion for high-voltage integrated circuits, introduces the new member of the InnoMux™-2 family of single-stage, independently tuned multioutput offline power ics. The new device is manufactured using the company's proprietary PowiGaN™ technology and is the industry's first, 1700V gallium nitride switching IC. The ...
Toshiba introduces new gate driver ics for 3-phase brushless DC motors for a variety of automotive applications
2024-11
Power
Toshiba Semiconductor and Storage
[Nov 6 2024] Toshiba Electronic Components & Storage Corporation announced that it has begun offering engineering samples of the "TB9084FTG" gate drive IC for 3-phase brushless DC motors. This device can be used to drive critical on-board functions including body system applications, electric pumps, and motor generators. The device sample is now open for application. Many of the mechanical components in today ...
SiC power devices help improve the endurance of new energy vehicles
2024-11
Power
Advanced Linear Devices Inc.
[Nov 6 2024] In the global trend towards sustainable development, new energy vehicles have attracted wide attention due to their low carbon emissions and high energy efficiency. With this comes an increasing demand for high-performance power electronics. Silicon carbide (SiC) power devices, with their excellent electrical and thermal properties, are becoming a key component of the core power system of new ene ...
Infineon introduces a new vehicle-scale laser driver IC
2024-11
Power
Infineon Technologies
[Nov 6 2024] 3D depth sensors play an important role in in-vehicle monitoring systems, enabling innovative automotive cabins, seamless connectivity to new services, and greater passive safety. They are essential for meeting the requirements and safety ratings of the European New Car Assessment Programme (NCAP), as well as for achieving superior comfort features. Infineon Technologies AG, a global semiconducto ...
Qorvo has been selected as a key supplier for Mediatek's Dimensity 9400 debut Wi-Fi 7 FEM
2024-11
Semiconductors
Qorvo US Inc.
[Nov 5 2024] Recently, Qorvo announced that MediaTek has selected Qorvo as the key supplier for the first Wi-Fi 7 front-end module (FEM) on the Mediatek MT6653 Wi-Fi 7/Bluetooth single chip. Qorvo's Wi-Fi 7 FEM and MediaTek MT6653, used in the MediaTek Dimensity 9400 platform, have been optimised to help enhance the performance, energy efficiency and technical characteristics of Wi-Fi 7 in mobile devices, pro ...
STMicroelectronics announces highly adaptable easy-to-connect dual wireless IoT modules for metering and asset tracking applications
2024-11
Sensors
STMicroelectronics
[Nov 5 2024] ST has introduced an enhanced mobile data communication module that simplifies the connection and management of large-scale iot devices and accelerates the adoption of sustainable smart grids and smart industries. The ST87M01 module platform is NB-IoT certified and can be equipped with an advanced ST4SIM embedded SIM (eSIM) card for access to mobile network services. In addition, the modules are ...
Vishay introduces new high energy surge current limiting PTC thermistors that improve the performance of active charge-discharge circuits
2024-11
Passive Components
Vishay
[Nov 4 2024] Vishay Intertechnology has announced the launch of a new series of surge limiting positive temperature coefficient (PTC) thermistors, the PTCEL. Vishay BCcomponents PTCEL High Energy Series devices have a maximum energy absorption capacity of 340 J, five times higher than competing devices at high ambient temperatures, a wide resistance range at 25 °C (R25), and high voltage handling capabilities ...
Murata develops a "scalable circuit board" that balances scalability and reliability
2024-11
Passive Components
Murata
[Nov 4 2024] Murata has developed a "stretchable circuit board" that works even when the board is bent and stretched, ensuring high reliability. It is expected to be used in medical and health care wearable devices that collect biological information on the surface of the body, and because of its scalability, it can provide a more comfortable adhesive feeling while achieving high-precision data collection. Mu ...
Naxin Microelectronics Launches Multi-Channel 24/16-Bit Δ-Σ ADCs with Capacitive PGA
2024-11
Semiconductors
ISSI, Integrated Silicon Solution Inc
[Nov 1 2024] Naxin Microelectronics recently launched the NSAD124x and NSAD114x series of multi-channel 24/16-bit low-power, high-precision Δ-Σ ADCs, designed to meet the high-accuracy temperature measurement needs in industrial applications. Featuring an integral non-linearity of 3 ppm and effective resolutions up to 23.4 bits, these devices are ideal for thermocouple measurement, multi-wire RTD, thermistors ...
NXP eIQ software expands AI edge capabilities
2024-11
Power
NXP
[Nov 1 2024] NXP Semiconductors has announced the addition of two new tools to its eIQ AI and machine learning development software to make it easy to deploy and use AI edges on a variety of edge processors. eIQ Time Series Studio provides automated machine learning workflows that make it easy to develop and deploy time series-based machine learning models on McU-level chips, such as the MCX Series MCU portfo ...