Technology Articles

2025-01 Power Nexperia

[Jan 8 2025] Nexperia has introduced the NEH71x0 power management IC (PMIC) family, expanding its energy harvesting portfolio with a focus on performance, cost-efficiency, and versatility. This advanced PMIC line sets a new benchmark for sustainable design in low-power applications. A key advantage of the NEH71x0 series is its inductor-less design, which significantly reduces circuit board space and bill-of-m ...

2025-01 Semiconductors Monnit Corporation

[Jan 7 2025] Morse Microelectronics, the world's leading provider of Wi-Fi HaLow chips, has introduced the first Wi-Fi HaLow access point reference design, HaLowLink 1, further expanding the company's suite of iot evaluation tools. As the preeminent reference design and evaluation platform, HaLowLink 1 is designed to realize the full potential of Wi-Fi HaLow technology, combining the long range coverage, high ...

2025-01 Semiconductors Micron Technology Inc.

[Jan 7 2025] Micron Technology, Inc. announced that it has begun certification with customers for the 6550 ION NVMe™ SSD. The Micron 6550 ION SSD is the world's leading 60TB data center SSD and the industry's first 60TB SSD for E3.S and PCIe 5.0. 1 The product continues the award-winning success of the 6500 ION SSD, delivering industry-leading performance, energy efficiency, durability, security, and rack den ...

2025-01 Semiconductors Texas Instruments

[Jan 7 2025] Texas Instruments (TI) held a C2000 MCU product launch event in Shenzhen, China, and officially launched two revolutionary microcontroller products - TMS320F28P55x series and F29H85x series. These two new products not only mark another major leap for the C2000 series in the field of real-time control, but also show Texas Instruments' deep accumulation and innovation strength in Edge AI technology ...

2025-01 Connectors ams

[Jan 6 2025] Ams OSram, the world's leading provider of optical solutions, has announced that the innovative application of LED films in the automotive sector is the next step in the development of ALIYOS™ LED-on-Foil technology. This cutting-edge technology combines AMS OSram's ALIYOS™ technology with LEONHARD KURZ's innovative in-mold decoration (IMD) and functional Film bonding (FFB) technologies. The tech ...

2025-01 Semiconductors Adafruit Industries

[Jan 6 2025] Artificial intelligence (AI) and machine learning (ML) are advancing at an extraordinary pace, powering progress across industries. As models become larger and more complex, they need to process large amounts of data in real time. This demand puts pressure on the underlying hardware infrastructure, especially memory, which must process massive data sets quickly and efficiently. High-bandwidth mem ...

2025-01 Semiconductors IRTouch Systems

[Jan 6 2025] IAR, the world's leading software solution provider for Embedded system development, and Beijing Guoke World Technology Co., LTD. (hereinafter referred to as "Guoke World") jointly announced that the latest version of IAR Embedded Workbench for RISC-V will fully support the AS32X series RISC-V MCU of Guoke World. The two parties will work together to support the innovative research and developmen ...

2025-01 Semiconductors Intel

[Jan 6 2025] Forget Lunar Lake! If there's one chip family that's critical to Intel's entire turnaround plan, it's the company's upcoming Clearwater Forest Xeon line. This is the first time Intel has shown this chip, and it will be the first mass-produced chip with an 18A process node. Intel CEO Pat Kissinger has said that the 18A node is so important to the company that he has staked the future of the entire ...

2025-01 Connectors Laird Technologies

[Jan 4 2025] Laird Thermal Systems announced the expansion of its product line of micro-thermoelectric chillers with the introduction of the OptoTEC™ MBX family for space-constrained, high-performance optoelectronics applications. The MBX series uses next-generation thermoelectric materials and advanced automated processes TO provide standard and custom options for TEC used in applications such as To-CAN, TOS ...

2025-01 Semiconductors Samsung

[Jan 4 2025] According to reports, due to the unsatisfactory performance of Samsung's foundry business, coupled with weak market demand, Samsung has decided to further close some of the previous generation of production lines. It is particularly noteworthy that even its most advanced second-generation 3-nanometer 3GAP process technology has only reached a low yield of 20% (reference reading: TSMC! Samsung sec ...

2025-01 Connectors Renesas Electronics America Inc.

[Jan 4 2025] Renesas Electronics, a global semiconductor solutions provider, announced the first full memory interface chipset solution for the second-generation DDR5 multi-capacity dual-in-line memory module (MRDIMM). Increasing memory bandwidth requirements for artificial intelligence (AI), high performance computing (HPC), and other data center applications require new DDR5 MRDIMMs. They operate at speeds ...

2025-01 Optoelectronics Silicon Labs

[Jan 4 2025] The Connectivity Standard Alliance (CSA) has released version 1.4 of the Matter 1.4 standard. As a key member of the Connectivity Standards Consortium, and a longtime supporter and active promoter of the Matter standard, Silicon Labs is providing comprehensive solutions that include wireless hardware, software, tools, and the newly launched Matter Extension suite. It was the first to implement su ...