Technology Articles

2025-01 Semiconductors Infineon Technologies

[Jan 10 2025] Infineon Technologies AG announced yesterday that it has successfully developed the world's first 300 mm gallium nitride (GaN) power semiconductor wafer technology. Infineon is the world leader in mastering this breakthrough technology in an existing and scalable mass production environment. This breakthrough will greatly boost the GaN power semiconductor market. Compared to 200 mm wafers, 300 mm ...

2025-01 Power XP Power

[Jan 10 2025] XP Power has officially announced the JMR03/10/20 series for 3W, 10W and 20W, an ultra-compact, medically compliant DC-DC converter that offers a 4:1 input ratio, making it suitable for a wide range of input requirements. The product offers 2 x MOPP (Patient Protection Mode) with a leakage current of only 2A, ensuring easy integration into BF (body suspension) and CF (heart suspension) grade medi ...

2025-01 Connectors STMicroelectronics

[Jan 9 2025] STMicroelectronics introduces a new family of microcontrollers with integrated machine learning (ML) accelerators to bring embedded artificial intelligence (AI) to life, enabling cost - and power-focused consumer electronics and industrial products to run algorithms such as computer vision, audio processing, sound analysis, and more. It provides high performance functions that previously small em ...

2025-01 Semiconductors WeEn Semiconductors

[Jan 9 2025] BlackBerry, Inc. 's QNX division, has released the QNX® Cabin. As an innovative framework, QNX Cabin empowers Oems to virtualize the development of complex digital cabins in the cloud. The cloud-based development model enables architects and developers to "develop left," designing, testing, and optimizing every line of code in the cloud and then easily migrating it to production system-on-chip (S ...

2025-01 Semiconductors Teledyne LeCroy

[Jan 9 2025] Teledyne e2v has announced the release of an engineering prototype of a 16-core ArmCortexa72-based system-on-chip (SoC) processor, LX2160-Space, enabling early project design and hardware and software validation for demanding aerospace applications. The engineering sample of the LX2160-Space has the same size/form factor/function as the Flight positive film (FM). LX2160-Space can be used for many ...

2025-01 Connectors Teledyne LeCroy

[Jan 8 2025] Teledyne e2v has announced the release of a 16-core engineering prototype of the Arm®Cortex® A72-based system-on-chip (SoC) processor LX2160-Space, enabling early project design and hardware and software validation for demanding aerospace applications. The engineering sample of the LX2160-Space has the same size/form factor/function as the Flight positive film (FM). LX2160-Space can be used for m ...

2025-01 Power Nexperia

[Jan 8 2025] Nexperia has introduced the NEH71x0 power management IC (PMIC) family, expanding its energy harvesting portfolio with a focus on performance, cost-efficiency, and versatility. This advanced PMIC line sets a new benchmark for sustainable design in low-power applications. A key advantage of the NEH71x0 series is its inductor-less design, which significantly reduces circuit board space and bill-of-m ...

2025-01 Power Qualcomm

[Jan 8 2025] Qualcomm Technologies today announced a series of industry-leading AI innovations at CES 2025, demonstrating how it is transforming the user experience across multiple end categories such as PCS, automotive, smart homes and enterprise. Anmon, president and CEO of Qualcomm, said: "AI is bringing epochal change to the technology field. In 2025, AI processing will continue to migrate to the edge, en ...

2025-01 Semiconductors Texas Instruments

[Jan 7 2025] Texas Instruments (TI) held a C2000 MCU product launch event in Shenzhen, China, and officially launched two revolutionary microcontroller products - TMS320F28P55x series and F29H85x series. These two new products not only mark another major leap for the C2000 series in the field of real-time control, but also show Texas Instruments' deep accumulation and innovation strength in Edge AI technology ...

2025-01 Semiconductors Monnit Corporation

[Jan 7 2025] Morse Microelectronics, the world's leading provider of Wi-Fi HaLow chips, has introduced the first Wi-Fi HaLow access point reference design, HaLowLink 1, further expanding the company's suite of iot evaluation tools. As the preeminent reference design and evaluation platform, HaLowLink 1 is designed to realize the full potential of Wi-Fi HaLow technology, combining the long range coverage, high ...

2025-01 Semiconductors Micron Technology Inc.

[Jan 7 2025] Micron Technology, Inc. announced that it has begun certification with customers for the 6550 ION NVMe™ SSD. The Micron 6550 ION SSD is the world's leading 60TB data center SSD and the industry's first 60TB SSD for E3.S and PCIe 5.0. 1 The product continues the award-winning success of the 6500 ION SSD, delivering industry-leading performance, energy efficiency, durability, security, and rack den ...

2025-01 Connectors ams

[Jan 6 2025] Ams OSram, the world's leading provider of optical solutions, has announced that the innovative application of LED films in the automotive sector is the next step in the development of ALIYOS™ LED-on-Foil technology. This cutting-edge technology combines AMS OSram's ALIYOS™ technology with LEONHARD KURZ's innovative in-mold decoration (IMD) and functional Film bonding (FFB) technologies. The tech ...