Records 5,336
Page 99/445
Stackable multi-row board-to-board connectors enable unprecedented flexibility
2023-02
Power
Interlink Electronics
[Feb 10 2023] Interplex has introduced new multirow board-to-board (BTB) connector products. The proprietary unit cookie design allows multiple connector units to be stacked on top of each other. This shows that interconnects can be appropriately sized without having to be customized for them. This unique, cost-effective approach will allow different pin count requirements to be met through the same basic inte ...
Reliable and cost-effective high-frequency crystal oscillator
2023-02
Power
Rubycon
[Feb 10 2023] High frequency crystal oscillator from X'tals Hong Kong (HKC), now supplied by Rutronik, provides high stability and low noise in the system design. This is possible thanks to differential output and low phase jitter. The manufacturer is responding to growing demand for low-cost, low-jitter timing benchmarks in telecom applications, including LTE/5G, PCI-e Express and 10-Gbit Ethernet. Have an LV ...
Qorvo introduces advanced power solutions for phased array radar systems
2023-02
Power
Qorvo US Inc.
[Feb 9 2023] Qorvo, a leading provider of RF solutions for mobile, infrastructure and aerospace and defense applications, announced the launch of a compact three-chip power solution for phased array radars. The three-chip solution provides configurable GaN offset point automatic calibration, enabling engineers to maximize system performance across different GaN power amplifiers (PA) without changing the board ...
TDK introduces an ultra-compact welded aluminum electrolytic capacitor that increases ripple current capacity by 85%
2023-02
Semiconductors
TDK
[Feb 9 2023] TDK Corporation has introduced the new B43652 series of welded aluminum electrolytic capacitors. The new family of components features ultra-compact size and ultra-large ripple current-carrying capacity, and is Rohs-compliant, designed for a maximum voltage rating of 450 V DC and available in seven capacity ratings ranging from 270 μF to 820 μF. Capacitors ranging from 270μF to 560μF are availabl ...
TDK introduces the industry's first common-mode filter for automotive Ethernet 10BASE-T1S
2023-02
Sensors
TDK
[Feb 9 2023] TDK introduces the new ACT1210E series (3.2 x 2.5 x 2.5 mm (L x W x H)) common mode filter for Automotive Ethernet 10BASE-T1S. Mass production of the new common-mode filter will begin in February 2023 ● The industry's first for automotive Ethernet 10BASE-T1S common mode filter ● Construction to reduce interline capacitance ● High reliability is achieved by laser welding the winding wire to the me ...
Diodes produced the first silicon carbide Schottky barrier diode
2023-02
Semiconductors
Diodes Incorporated
[Feb 9 2023] Diodes announced the release of the first silicon Carbide (SiC) Schottky Barrier diode (SBD). The product portfolio includes the DIODES DSCxxA065 series with eleven 650V rated products (4A, 6A, 8A, and 10A) and the DIODES DSCxx120 series with eight 1200V rated products (2A, 5A, and 10A). The benefits of these wide-gap SBDS include significantly improved efficiency and high temperature reliability ...
Infineon introduces the industry's first dual-port PD controller +DC-DC controller
2023-02
Semiconductors
Infineon Technologies
[Feb 9 2023] EZ-PD CCG7DC is a highly integrated dual-port USB Type-C power transfer solution with integrated step-boost controllers. It is designed to be a perfect match for multi-port AC-DC charger/adapter and cigarette lighter adapter. Users get a high degree of programmability thanks to its 32-bit Arm Cortex-M0 processor on chip, 128 KB flash memory, 16 KB RAM, and 32 KB ROM. In addition, several analog a ...
Infineon introduces IPM Smart power module with microcontroller, grid driver and IGBT
2023-02
Semiconductors
Infineon Technologies
[Feb 8 2023] Integrated motor controller, three-phase grid driver 600V/2A and 600V/4A IPM, capable of driving 50W/70W motors in the absence of radiators, targeted applications for large and small appliances and fan pumps. Product model: ● IMI111T-026H: 2A 600V IPM ● IMI111T-046H: 4A 600V IPM The iMOTION IPM integrates the motor controller, three-phase gate driver, and 600V/2A and 600V/4A IGBTs in a DSO-22 pac ...
Stmicroelectronics ST-ONEMP Digital Controller Simplified high Energy efficiency dual port USB-PD adapter design
2023-02
Semiconductors
STMicroelectronics
[Feb 8 2023] The ST-ONEMP digital controller is based on the market-first ST-ONE architecture and integrates an Arm Cortex-M0+ microcontroller, a highly energy efficient non-complementary Active clamper flyback controller, and a USB-PD 3.1 interface in a single package. The current isolation between the primary and secondary side circuits of the ST-ONE architecture greatly simplifies the design and assembly o ...
EPC introduces 80V GA-Q101 certified GA-FET
2023-02
Power
ECS
[Feb 8 2023] EPC introduces the 80-V AEC-Q101-certified Gallium nitride Field effect Transistor (GaN FET) EPC2252 to provide designers with a smaller and more efficient solution than silicon MosFEts for vehicle scale lidar, 48 V/12 V DC/DC conversion and low-inductance motor drivers. As a global leader in enhanced gallium nitride (eGaN) FETs and ics, EPC Power Conversion Corporation (EPC) has further expanded ...
Toshiba unveils smart power devices that help reduce mounting area
2023-02
Semiconductors
Toshiba Semiconductor and Storage
[Feb 8 2023] Electronic Components and Memory Devices Corporation (" Toshiba ") announced the launch of two smart power devices - "TPD2015FN" and "TPD2017FN" - for controlling the drive of inductive loads used in motors, solenos, lamps and other applications such as programmable logic controllers for industrial equipment. High side switch (8 channels) "TPD2015FN" and low side switch (8 channels) "TPD2017FN" T ...
Silicon Labs Series 2 Wireless SoCs provide the wireless connectivity needed for the future Internet of Things
2023-02
Passive Components
Silicon Labs
[Feb 8 2023] Silicon Labs BG24 and MG24 Series 2 wireless System on Chip (SoC) devices. The product family is a 2.4GHz RF enabled low power wireless SoC with AI/ML hardware accelerators, providing the ideal solution for mesh Internet of Things (IoT) wireless connectivity using Matter, OpenThread and Zigbee protocols. These new wireless SoCs support a variety of smart home, lighting and building automation app ...