Technology Articles

2024-07 Connectors Infineon Technologies

[Jul 26 2024] Infineon Technologies has been chosen by Daihen Corporation to provide their CoolSiC™ 2000 V modules for use in their advanced unit-type power conditioners designed for grid storage batteries. Grid storage batteries and their associated power conditioners are crucial in promoting the widespread use of renewable energy sources such as solar and wind power generation, as part of efforts to reduce c ...

2024-07 Semiconductors Toshiba Semiconductor and Storage

[Jul 26 2024] Toshiba Electronic Components and Storage Corporation (Toshiba) announced the launch of the MG10-D series of enterprise hard drives. The product is a member of the traditional Magnetic Recording (CMR) air hard drive family, supports SAS and SATA interfaces, and has a capacity of up to 10TB. The MG10-D series draws on more than 50 years of Toshiba's experience and is built with precision engineeri ...

2024-07 Semiconductors Taiwan Semiconductor Corporation

[Jul 26 2024] Taiwan Semiconductor has introduced a new series of small-signal MOSFETs that meet the AEC-Q101 qualification. The addition of these 10 new components expands the company’s already large and distinctive range of TQM Family MOSFETs, which comply with the AEC-Q101 global automotive standard for reliability. The new devices are available in N-MOS or P-MOS and can be configured as single- or dual-cha ...

2024-07 Power XP Power

[Jul 25 2024] XP Power introduces the EHL series of PCB-mounted AC-DC power supplies that provide single output voltages from 3.3VDC to 48VDC. Available in bare board and packaged versions, the EHL05 (5W) and EHL20 (20W) high power density power supplies feature an ultra-wide input range from 85VAC to 528VAC for global compatibility and high stability in fluctuating power conditions. The EHL series has an IEC ...

2024-07 Power Omron Electronics Inc-EMC Div

[Jul 24 2024] Omron Electronic Components Europe has introduced a new high-capacity printed circuit board (PCB) relay designed specifically for Mode 3 AC electric vehicle (EV) charging stations installed in AC wallboxes. The G9KC relay offers the most minimal contact resistance currently available on the market and generates considerably less heat at the load terminal during operation than similar devices. Thi ...

2024-07 Power Everspin Technologies Inc.

[Jul 24 2024] Eggtronic has introduced its EPIC mixed-signal power conversion controller ICs, which now include reprogrammable flash memory options.the EPIC 2.0 Flash series has been developed to provide OEMs with increased flexibility during the design process and to enable the deployment of the same low-power, mixed-signal IC across multiple applications, thereby reducing inventory. EPIC (Eggtronic Power Int ...

2024-07 Connectors TDK

[Jul 24 2024] TDK Corporation has announced the launch of the RGB Series, a series of rugged non-isolated DC-DC converters manufactured by TDK-Lambda with power ratings ranging from 400W to 750W. These buck converters have a wide input voltage range of 9 to 18V, 18 to 32V, or 18 to 60V. They can provide adjustable output voltages from 0.8 to 8V or 3.3 to 24V. The output current can reach 60A, but this depends ...

2024-07 Connectors Navitas Semiconductor, Inc.

[Jul 24 2024] The industrial and machinery markets are transforming due to the emergence of new technologies such as drones and robotic tools. These technologies demand energy-efficient solutions with improved capabilities. Microchip Technology’s MCP8027 is a gate driver for 3-phase brushless motors that includes a power module and has a sleep-mode current of 5 uA (typical). The MCP8027 device incorporates thr ...

2024-07 Semiconductors ON Semiconductor

[Jul 22 2024] In the face of an escalating climate crisis and soaring global energy demand, governments and businesses around the world are working together on ambitious climate goals to mitigate environmental impacts and achieve a sustainable future. Key to this is advancing the electrification transition to reduce carbon emissions and actively using renewable energy sources. To accelerate this global transfo ...

2024-07 Semiconductors Toshiba Semiconductor and Storage

[Jul 22 2024] BiCS FLASH technology is a 3D vertically stacked memory technology developed by Toshiba Corporation. It adopts the structure of vertical multi-layer unit, which can realize high density and large capacity memory chip. The core idea of this technology is to stack traditional two-dimensional flat storage units upward to form multi-layer storage units, thereby increasing storage density, reducing ch ...

2024-07 Connectors Advanced Energy

[Jul 22 2024] The rapid development of autonomous driving technology, especially the emergence of autonomous travel services like "Radish Fast Run", is quietly changing the way we live and work. This technology not only greatly improves traffic efficiency and safety, but also has a profound impact on the job market at a deep level, especially in traditional driving and related industries. This article will exp ...

2024-07 Semiconductors NXP

[Jul 22 2024] NXP Semiconductors announced that its single-chip NFC and embedded security component solution, the SN220, has been certified by the Automotive Connectivity Alliance (CCC) for digital keys launched in December 2023. This marks NXP as the first digital car key solution provider to receive this certification. NXP offers a complete suite of solutions covering the complete digital car key ecosystem, ...