Records 5,522
Page 31/461

What Is the IRFP460 Power MOSFET?
2024-08
Semiconductors
Vishay Siliconix
[Aug 9 2024] What Is the IRFP460? The IRFP460 is a high-performance third-generation Power MOSFET from Vishay. It operates using PowerMESH™II technology, which enhances its switching speed, low on-resistance, and overall ruggedness. The MOSFET is housed in a TO-247 package. The IRFP460 functions by varying the gate voltage to control the flow of electrical current between its drain and source terminals. The I ...
Charging and Supports V2X Integration
2024-08
Semiconductors
Vishay Siliconix
[Aug 9 2024] The transition to electric vehicles (EVs) not only redefines how cars are "refueled" but also promises to ensure stable energy supply and enhance efficiency. Achieving this vision relies on implementing Dynamic Load Management (DLM) systems for EV charging. Dynamic Load Management DLM systems revolutionize energy usage by intelligently balancing power loads among multiple chargers. This optimized ...

The Internet of Things shapes the future of life
2024-08
Power
NXP
[Aug 8 2024] Internet of Things (IoT) It has become an important industry field in modern society, transferring related devices and items to Internet technology to achieve intelligent data exchange and control. Below, we will detail some common iot application areas and their corresponding solutions. With the continuous advancement of technology and the rise of the definition of the Internet of Things, the ap ...

Artificial Intelligence Application Clustering: A new era of optical connectivity
2024-08
Power
Texas Instruments
[Aug 8 2024] The AI application cluster has a strong mandate for optical connectivity, creating a new multi-billion dollar segment for the global optical module market. Ai application clustering refers to the integration and coordination of multiple AI applications to achieve more complex, efficient and intelligent functions and applications. These technologies can include, but are not limited to, machine lea ...

SoC and AI: Redefining the future of electronics
2024-08
Power
Advanced Linear Devices Inc.
[Aug 8 2024] SoC stands for System on Chip, which translates directly to "Radio frequency transceiver system software" or "System on film". It usually refers to a product, that is, an integrated circuit chip with a special purpose, including detailed system software and related content placed in the phone software. SoC is not only a commodity, but also a technology. It realizes the whole design process, from ...

Vishay introduces AEC-Q200 certified thin-film resistors with high reliability
2024-08
Sensors
Vishay
[Aug 5 2024] Vishay Intertechnology has announced the launch of a new AEC-Q200 certified series of thin film chip resistors, the CHA series, which provide high frequency performance up to 70 GHz for automotive, aerospace and avionics, and telecommunications applications. The Vishay Sfernice CHA series is available in a compact 02016 package size with resistance values ranging from 10 to 500. The newly release ...

Micro Crystal introduces the C8 series of ultra-small real-time clock modules
2024-08
Power
Micron Technology Inc.
[Aug 5 2024] As electronics continue to miniaturize, Swiss Micro Crystal has made a major leap forward with the launch of its latest C8 series. This series of ultra-small Real-Time clock (RTC) modules, designed specifically for compact and lightweight designs, paves the way for engineers working on smaller, more efficient electronic devices. The core highlight of the C8 series is its significantly reduced siz ...

Oemstron What Is an MBR20200CT Rectifier?
2024-08
Semiconductors
STMicroelectronics
[Aug 3 2024] What Is an MBR20200CT? The MBR20200CT is a high-current, high-voltage Schottky barrier rectifier. The MBR20200CT can handle large currents with minimal voltage drop, which is used for power rectification in various electronic circuits. This rectifier has a maximum repetitive peak reverse voltage (VR) of 200V and can handle a maximum average forward rectified current (IF(AV)) of 20A. It features a ...
TI's New Magnetic Packaging Tech Halves Power Module Size
2024-08
Semiconductors
TinyCircuits
[Aug 3 2024] Texas Instruments (TI) has introduced six new power modules designed to boost power density, efficiency, and reduce EMI. Leveraging TI’s proprietary MagPack™ packaging technology, these modules offer up to a 50% reduction in size compared to previous models while maintaining the same thermal performance and doubling power density. The industry’s ultra-compact 6A power modules now provide 8dB lowe ...

STMicroelectronics introduces compact 750W motor drive reference boards for home appliances and industrial equipment
2024-08
Connectors
STMicroelectronics
[Aug 3 2024] STMicroelectronics' EVLDrive 101-HPD (High Power Density) motor drive reference design integrates a three-phase gate driver, STM32G0 microcontroller and 750W power stage on a circular PCB board with a diameter of only 50 mm. The board's sleep power consumption is very low, less than 1uA, and its compact shape can be directly loaded into devices such as hair dryers, handheld vacuum cleaners, power ...

Nexperia introduces a new high current eFuses with excellent current limiting accuracy
2024-08
Passive Components
Nexperia
[Aug 1 2024] Nexperia has introduced the NPS3102A and NPS3102B Electronic Fuses (eFuses) as the latest components in its growing family of power devices. These electronic fuses have a low resistance of 17 mΩ and can handle high currents of 13.5 a. They are designed to protect downstream loads from excessive voltages and to protect the power supply from load failures and large inrush currents. These EFUses are ...

Molex introduces new current sensors for industrial and automotive applications
2024-08
Sensors
Molex
[Aug 1 2024] Molex, the world's leading provider of electronic solutions, has introduced Percept, a new current sensor. The product is designed to meet the growing demand for high-precision busbar current sensing technology in the industrial and automotive sectors. By combining Infineon's wireless coil high-precision current sensing technology with Molex's unique electronic device packaging technology, the Pe ...