Technology Articles

2021-05 Power Panduit Corp

[May 4 2021] The latest addition to Pentek's Jade family of XMC FPGA modules is an L-band RF tuner based on Xilinx's Kintex UltraScale FPGA with two 400-MHz analog-to-digital converters (ADCs). Jade, model 71891, is designed to connect directly to L-band signals from SATCOM or communication systems. According to Pentek, the Jade series' architecture upgrade to Kintex FPGas delivers higher performance, 20 perc ...

2021-05 Sensors Bosch Sensortec

[May 3 2021] Wearable fitness trackers are rapidly gaining popularity. Air pressure sensors enable wearables to detect changes in the user's altitude, such as going up and down stairs, to calculate the number of calories the user has burned. Until now, many air pressure sensors have not been resistant to liquids, so integrating them into waterproof products has been a challenge. To solve this problem, Bosch S ...

2021-05 Power EPC

[May 3 2021] EPC announced the introduction of the Laser Driver IC(EPC21601), which combines 40 V, 10 A field-effect transistor, gate driver and 3.3V logic level input on a single chip for time-of-flight (ToF) liDAR systems. For robots, surveillance security systems, drones, fully autonomous cars and vacuum cleaners. The EPC21601 is controlled by A 3.3V logic circuit and is capable of modulating and achieving ...

2021-05 Power Xilinx

[May 3 2021] In order to meet the needs of modern data center development, Xilinx announced the launch of a series of new data center products and solutions, including the new Alveo SmartNIC series, smart world AI video analysis application, an accelerated algorithmic transaction reference design capable of sub-microsecond transactions. And the Xilinx App Store. From networking and AI analytics to financial t ...

2021-05 Power Renesas Electronics America

[May 2 2021] Renesas Electronics, a leading provider of advanced semiconductor solutions, and LUPA-Electronics GmbH, a provider of automotive safety solutions, today announced the EagleCAM module, an open front-facing camera solution. Features R-Car V3H and R-Car V3M system-on-chip (SoC) devices from Renesas Electronics. The all-in-one scalable camera platform addresses the latest Euro NCAP and C-NCAP require ...

2021-05 Connectors Microchip Technology

[May 2 2021] As reliance on communications and weather satellites grows, the scope and mission of space research is expanding, and new technologies are needed to help accelerate the design and production of space systems. Microchip Technology announced the expansion of its SA50-120 power converter family with nine new products based on commercial-grade off-the-shelf technology (COTS) to provide developers wit ...

2021-05 Power Flex Power Modules

[May 2 2021] Flex introduces the BMR492 Series of brick DC/DC power modules that deliver 600 to 800W of continuous power. 800W converters in < Up to 1100 W of peak power for a short period of 1 s. Cpus in data communications and data center applications often require this burst mode operation. The first member of the BMR492 series of digital intermediate bus converters is the BMR4920302/861. The BMR4920302 ...

2021-05 Power Toshiba Semiconductor and Storage

[May 1 2021] Toshiba Electronic Components and Storage Devices, Inc. (announced the launch of the 18TB MG09 series hard disk Drive (HDD), Toshiba's first HDD with energy-assisted magnetic recording. The MG09 series uses Toshiba's third-generation 9-disc helium seal design and Toshiba's innovative flux control-Microwave-assisted Magnetic Recording (FC-MAMR) technology to increase the traditional magnetic recor ...

2021-05 Power Silicon Labs

[May 1 2021] Silicon Labs has introduced a new all-in-one isolation solution, the Si823Hx gate driver board, which provides perfect support for the recently released Wolfspeed WolfPACK power module. Wolfspeed power modules can be used in numerous power applications, including electric vehicle (EV) chargers and motor drivers in industrial and automotive markets. The board contains the Si823Hx isolated gate dri ...

2021-05 Sensors Samsung

[May 1 2021] Samsung Electronics has unveiled a new generation of 50 megapixel ISOCELL GN2 image sensor with a large 1.4μm (micron) pixel. Compared to the previous generation ISOCELL GN1, the ISOCELL GN2 can achieve up to 100 million pixels of ultra-high definition photo output, and can improve the focus ability with the full pixel dual-core focus Pro technology. In addition, ISOCELL GN2 can also achieve more ...

2021-04 Semiconductors Nexperia

[Apr 30 2021] Nexperia has announced a range of half-bridge (high-end and low-end) automotive MOSFETs featuring space-saving LFPAK56D package technology. A half-bridge configuration with two MOSFETs is a standard building block for many automotive applications, including motor drivers and DC/DC converters. This new package provides a single-device half-bridge solution. Compared to two-channel MOSFETs for three ...

2021-04 Passive Components Infineon Technologies

[Apr 30 2021] Infineon Technologies AG introduces the CoolSiC™ Hybrid IGBT single tube with a 650 V turn-off voltage. The new CoolSiC Hybrid IGBT combines the key benefits of the 650 V TRENCHSTOP™ 5 IGBT and the CoolSiC™ Schottky Barrier diode with excellent switching frequency and lower switching losses, especially for DC-DC and power factor correction (PFC) applications. Common applications include: battery ...