Technology Articles

2021-04 Sensors ams

[Apr 26 2021] Ams has announced the TMD2636, a fully integrated proximity sensor that offers 30 percent less space than existing solutions, bringing cross-format value addition to True Wireless Stereo (TWS) earplug manufacturers. ● The new TMD2636 fully integrated proximity sensor module for True Wireless Stereo (TWS) earbuds is available in an ultra-thin 0.35mm package that takes up only 0.7mm3 of volume ● Th ...

2021-04 Passive Components Vishay

[Apr 25 2021] Vishay Intertechnology has introduced a new AEC-Q200 qualified NTC thermistor featuring PEeK-insulated nickel-iron (NiFe) leads and a low thermal gradient. Designed to withstand high temperatures up to +185°C, Vishay BCcomponents NTCLE350E4 provides fast, high-precision temperature measurement and sensing in a variety of automotive applications. NiFe alloy for NTCLE350E4 wires has the lowest ther ...

2021-04 Power XP Power

[Apr 25 2021] XP Power has officially announced the LCS series of regulated output, natural convection cooled AC-DC power supplies that are ideal for budget-conscious applications. The four new series (LCS35, LCS50, LCS75, and LCS100) offer power levels of 35W, 50W, 75W, and 100W, respectively, and comply with Class B conduction and radiation standards, facilitating low-cost system integration while integratin ...

2021-04 Passive Components Toshiba Semiconductor and Storage

[Apr 25 2021] Toshiba Electronic Components and Memory Devices Corporation introduced four new 60V Schottky Barrier Diode (SBD) products - CUHS15F60, CUHS20F60, CUHS15S60 and CUHS20S60. Suitable for high voltage rectifier power supply products, but also expanded its own product line. The CUHS15F60 and CUHS20F60 have low forward voltage and focus on the balance between forward voltage and reverse current applic ...

2021-04 Power Qualcomm

[Apr 24 2021] Since the first modem and RF systems were commercially available, the Snapdragon X65 is the company's biggest leap forward in 5G solutions. The system is designed to support the fastest 5G transmission speeds on the market today with fiber-comparable wireless performance, and make full use of available spectrum for extreme network flexibility, capacity and coverage. In addition to the Snapdragon ...

2021-04 Sensors ams

[Apr 24 2021] Ams, the world's leading provider of high-performance sensor solutions, has introduced the 4LS series, adding a new faster, higher resolution line-scan image sensor to its broad range of products. Sensors for machine vision applications. Using cameras equipped with 4LS sensors will help operators of the latest smart factories to increase production while maintaining the highest quality control st ...

2021-04 Power Microchip Technology

[Apr 24 2021] As connected cars increasingly rely on Ethernet for network connectivity, smart technology is helping developers simplify the development of infotainment systems and quickly adapt to the changing needs of automakers. Microchip Technology announced the launch of the LAN9360, the first hardware-based AVB audio endpoint solution, a single-chip Ethernet controller with built-in embedded protocols. Mi ...

2021-04 Sensors Teledyne LeCroy

[Apr 23 2021] Teledyne SP Devices, a business unit of Teledyne Technologies, announced the ADQ32 and ADQ33, fourth-generation modular data acquisition boards optimized for high-throughput applications. With the combination of on-board open field programmable gate arrays (FPgas) and high-speed data streaming, the ADQ32 and ADQ33 are ideal for even the most computationally demanding applications. The ADQ32 dual- ...

2021-04 Power Renesas Electronics America

[Apr 23 2021] Renesas Electronics announced the latest upgrade to the R-Car V3H System-on-Chip (SoC), bringing significantly improved deep learning capabilities to smart camera applications, including driver/passenger monitoring (DMS/OMS), in-vehicle front-facing cameras, round-view systems, and automatic parking up to Level 2+ for most vehicles. The upgraded SoC integrates sensor fusion in the real time domai ...

2021-04 Power Qualcomm

[Apr 23 2021] Qualcomm Technologies announced the launch of its next generation Qualcomm Radio Frequency Front End (RFFE) solution for high-performance 5G mobile devices. These solutions are a combination of modems, RF transceivers, AI-assisted RF front-end components, and mmwave antenna modules designed to deliver advanced performance and power efficiency for the new Qualcomm Snapdragon X65 and X62 5G modems ...

2021-04 Semiconductors ON Semiconductor

[Apr 22 2021] ON Semiconductor introduces the RSL10 Smart camera platform that combines cloud AI with ultra-low power image capture and recognition to enable a new generation of IoT endpoints.The RSL10 Smart Shooting Camera platform adds AI-based image recognition capabilities to ultra-low-power IoT endpoints such as surveillance cameras, restricted areas, factory automation, smart agriculture, and smart homes ...

2021-04 Semiconductors NXP

[Apr 22 2021] NXP Semiconductors has introduced the new EdgeLock 2GO iot Services platform, which makes it easy and secure to deploy and manage iot devices and services. The new iot security platform integrates with NXP's Common Standard (CC)EAL 6+ certified EdgeLock SE050 security element to protect iot devices at the edge and securely connect them to one or more clouds and service providers. "EdgeLock 2GO of ...