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Technology Articles

Records 5,196
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Diodes step-down converters enhance power regulation

2015-01 Connectors Diodes Incorporated
[Jan 3 2015] Diodes offers a wide range of synchronous step-down converters, including the AP65450, AP65452 and AP65552, for low output voltage power regulation in digital TVS, displays and other rapidly changing high-density point-of-load system architectures. The new device uses adaptive constant on-time control to ensure high precision DC output, high efficiency and fast transient response. The AP65450 is ...
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Microchip's JukeBlox platform has added support for Qobuz Connect

2015-01 Semiconductors Microchip Technology
[Jan 3 2015] Microchip Technology, a leading global provider of integrated microcontroller, mixed-signal, emulator and flash patented solutions, announced the addition of Qobuz Connect connectivity support to Microchip's JukeBlox platform. With this combined solution, HD quality and true CD quality audio can be transmitted directly to wireless speakers and AV receivers, providing users with a wonderful and en ...
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Molex's breakthrough Dow POWERHOUSE

2015-01 Power Molex
[Jan 2 2015] Molex Corporation has won the 2014 Chicago Innovation Award for its development of a connector system that provides electrical connectivity for Dow Chemical's POWERHOUSE solar roof panel. Molex interconnect systems have helped Dow bring ground-breaking new solar roof solutions to residential consumers across the United States and Canada. Jeff Gaumer, New Product Development Manager at Molex, said ...
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The Nordic Semiconductor IPv6 Bluetooth Smart Protocol stack for nRF51 series SOCs enables small iot applications with low cost and ultra-low power consumption

2015-01 Semiconductors Newhaven Display Intl
[Jan 2 2015] Ultra-low power (ULP) radio frequency (RF) specialist Nordic Semiconductor ASA announced the nRF51 Internet of Things (IoT) Software development Kit (SDK), This is the complete IPv6-ready Internet protocol suite for the market-leading Nordic nRF51 family of system-on-a-chip (SoC), Take advantage of the Bluetooth SIG's newly adopted Internet Protocol Support Profile, IPSP) and 6LoWPAN technology o ...
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Diodes dual buck converters improve modem efficiency

2015-01 Connectors Diodes Incorporated
[Jan 1 2015] Diodes Incorporated introduces the PAM2322AGEAR, a dual buck converter that offers a pair of high-efficiency pulse-width modulated buck DC/DC converters in a 2.5mm x 2.00mm miniature package designed to meet the requirements of wireless and DSL modem applications. The device's innovative pulse jump mode minimizes static current under light load operation, helping to extend the battery life of por ...
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Power Integrations releases new reference designs for high power LED lighting applications

2015-01 Power Power Integrations
[Jan 1 2015] Power Integrations, the leader in high-efficiency, high-reliability LED driver ics, has introduced a new reference design for LED street lights, industrial lamps and other high-power LED lighting applications. The new reference design RDR-382 introduces a constant current, 43 V(rated), 150 W reference Power supply designed using Power Integrations' HiperPFS™-2 PFC controller IC and HiperLCS™ inte ...
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On introduces Automotive LED drivers and controllers for advanced automotive lighting applications

2010-07 Connectors ON Semiconductor
[Jul 16 2010] ON Semiconductor introduces a new family of four devices that promote the high level of performance and innovative features that automotive manufacturers and consumers now expect from automotive exterior and interior lighting. The new series is specifically aimed at low-power solid-state lighting and includes two LED drivers (NCV7683 and NCV7685) and two current controllers (NCV7691 and NCV7692). ...
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Toshiba introduces new NVMe/PCIe SSD RD500 and RC500 series for 96-layer 3D flash memory

2010-02 Power Toshiba Semiconductor and Storage
[Feb 3 2010] Toshiba Electronics Corporation announced the launch of two new families of NVMe/PCIe 3.0 Gen3x4 M.2 solid state drives (SSDS) : the RD500 and RC500 series. Both product lines feature Toshiba Memory Corporation's most advanced 96-layer TLC(third-level storage unit)BiCS FLASH 3D memory. Toshiba Memory Corporation's new SSDS offer high-performance solutions aimed at today's mainstream gamers, do-it ...
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Nexperia introduces 175 ° C diodes and transistors packaged in SOT23

2010-01 Power Nexperia
[Jan 10 2010] Nexperia announced that key components in its family of high-performance, general-purpose transistors and switching diodes packaged in SOT23 are now fully established to operate at temperatures up to 175 ° C. The product range includes the industry's most popular high-speed switching diode BAS16/21 and BC807/817 general-purpose transistors. The 175 ° C SOT23 device also has 25% higher Ptot (total ...
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Microchip introduces a new capacitive touch controller that accelerates EMI certification for automotive touch screens

2010-01 Passive Components Microchip Technology
[Jan 9 2010] To address the electromagnetic interference (EMI) and electromagnetic compatibility (EMC) issues facing automotive touchscreen developers, Microchip Technology has introduced three new maXTouch touchscreen controllers and additional optimization services. The new TD series touch controllers feature a new differential interactive signal acquisition technology that significantly improves the signal ...
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U-blox launches globally configurable NB-IoT modules for 3GPP Rel 14 and 5G

2009-02 Connectors United Chemi-Con
[Feb 22 2009] U-blox Corporation has announced the launch of the multi-band NB-IoT module SARA-N3, which supports the initial 3GPP Release 14 feature set (LTE Cat NB2). SARA-N3 is available in two models: one for use in China and one that can be used across bands in any NB-IoT network worldwide. The u-blox Firmware over the Air (uFOTA) client/server solution with lightweight M2M(LwM2M) allows SARA-N3 to provid ...
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Optimizes motor control for industrial, home appliance and robotic equipment

2009-02 Power Renesas Electronics America
[Feb 21 2009] Renesas Electronics Corporation announced the introduction of the RX66T series of microcontrollers (MCUS), the first members of Renesas' 32-bit RX MCU family of flagship products, all powered by the new third-generation RXv3 CPU core. The RX66T uses advanced CPU core technology to significantly improve performance 1, which is more than 2.5 times better than previous RX series MCUS. Combining the ...