Technology Articles

2019-01 Power Bosch Sensortec

[Jan 5 2019] Bosch Sensortec introduces the BMI260 series, a new generation of high-performance MEMS inertial measurement units (IMUs) for smartphone applications. The series includes four sensors - BMI260, BMI261, BMI263 and BMI264 - offering a wide range of features, including full Android compatibility, I3C interface and sensor synchronization support. The new IMU is equipped with a high-performance accele ...

2019-01 Power OmniVision Technologies Inc

[Jan 4 2019] OmniVision Technologies, an industry-leading developer of digital image solutions, announced the launch of its second-generation 0.9 micron pixel, 1/2.83-inch optical format 24 megapixel (MP) image sensor based on PureCel Plus stack chip architecture technology. Designed for the front and rear cameras of high-resolution smartphones, the OV24B sensor family features cutting-edge technology and enh ...

2019-01 Semiconductors ON Semiconductor

[Jan 4 2019] ON Semiconductor, which is driving energy efficient innovation, expands the capabilities of the Bluetooth 5-certified radio Systems on a Chip (SoC) RSL10 family to support the Bluetooth SIG mesh networking standard, and also introduces a new personal computer (PC) software application with integrated RSL10 USB adapters. New software and design support tools coupled with the recently released RSL1 ...

2019-01 Power Littelfuse

[Jan 3 2019] Littelfuse introduces the first in a series of transient suppression diode arrays (SPA diodes). This series of products is designed to protect the two lines of the 10/100/1000BaseT Ethernet port from damage due to continuous overcurrent and overvoltage. The through-wiring enables the circuit of the SP4031 series hybrid protection module to protect the Ethernet PHY chip from electrostatic discharg ...

2019-01 Semiconductors ON Semiconductor

[Jan 2 2019] ON Semiconductor, which is driving energy efficient innovation, has introduced a new 50 megapixel (50 MP) resolution charge-coupled device (CCD) image sensor to enable more efficient inspection of smartphone displays. The KAI-50140 is the highest resolution Interline Transfer CCD image sensor on the market today, providing the critical imaging detail and high image uniformity required for smartph ...

2018-02 Semiconductors Dialog Semiconductor GmbH

[Feb 8 2018] Dialog Semiconductor, a provider of highly integrated custom and configurable power management, AC/DC power conversion, charging and Bluetooth low power technologies, has announced the launch of the first fully integrated Nanoscale static current PMIC family for Internet of Things (IoT) applications - the DA9070 and DA9073. This latest and more powerful PMIC series builds on the success of Dialog ...

2017-04 Connectors STMicroelectronics

[Apr 8 2017] STMicroelectronics releases 800V H Series thyristors with a maximum junction temperature of 150°C at maximum rated output current, thus reducing the heat sink size of AC load drivers by up to 50% and developing AC drivers with compact size and high reliability. Available in D2PAK, TO-220AB and TO-220AB insulated packages. The new 800V H Series thyristors are suitable for industrial manufacturing ...

2017-01 Connectors Diodes Incorporated

[Jan 10 2017] Diodes Incorporated announced the launch of the PS508 and PS509 analog multiplexers, which are capable of switching signal voltages up to 36V in industrial environments. The high-voltage capabilities of these devices will support Industrial Internet of Things (IIoT) applications using multiple sensors, including factory automation and process control, battery monitoring systems, and test and meas ...

2016-07 Power XP Power

[Jul 31 2016] Complementation the previously announced 3W, 5W and 10W modules, the VCE20 and VCE40 series offer 20W and 40W of power, respectively, and are available in packaged and lower-priced bare-board versions, both of which are suitable for PCB mounting. The compact (VCE20-63.5 mm x 30.5 mm x 21.8 mm /VCE40-85.0 mm x 35.1 mm x 27.7 mm) size and PCB pin design ensure that the product is easily integrated ...

2016-07 Connectors TE Connectivity

[Jul 30 2016] TE Connectivity announced that its CeeLok FAS-T connector is now available in a square-flanged socket housing version for a variety of cable and board applications. This CeeLok FAS-T connector can easily meet 10Gb Ethernet speed requirements, as well as the most stringent link budget requirements. The connector achieves superior signal integrity thanks to a patented T-shaped pin arrangement that ...

2016-07 Power Microchip Technology

[Jul 29 2016] In MCU based system design, software system is usually the bottleneck that affects the time to market and system performance. Microchip Technology's next-generation PIC18-Q43 family of products can shift a variety of software tasks to hardware, helping developers bring higher-performing solutions to market faster. The new family integrates a wealth of peripherals that are versatile and easy to us ...

2016-02 Connectors Microsemi

[Feb 2 2016] Microsemi Corporation has announced the availability of the SmartFusion2™ SoC FPGA dual-axis motor control Suite with a modular motor control IP set and reference design. Using a single SoC FPGA device to simplify motor control design, the suite accelerates time to market and can be scaled for use in multiple industries, including industrial, aerospace and defense, with typical applications inclu ...