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Vishay introduces new 3rd generation 650 V SiC Schottky diodes
2023-06
Optoelectronics
Vishay
[Jun 12 2023] Vishay Intertechnology announced the launch of 17 new third-generation 650 V silicon carbide (SiC) Schottky diodes. The Vishay Semiconductors are designed with a hybrid PIN Schottky (MPS) architecture with high surge current protection and low forward voltage drop, capacitive charge and reverse leakage current, helping to improve the energy efficiency and reliability of switching power supply des ...

The first silicon carbide FETs with RDS below 10mΩ with higher efficiency and lower losses
2023-06
Power
United Chemi-Con
[Jun 12 2023] New power semiconductor company United Silicon Carbide Corporation (UnitedSiC) announced that it will introduce four new SiC FETs with RDS(ON) values as low as 7mΩ and offer unprecedented performance and high efficiency. Suitable for high-power applications such as electric vehicle (EV) inverters, high-power DC/DC converters, high-current battery chargers and solid-state circuit breakers. Of the ...

Excelitas introduces the new InGaAs avalanche photodiode C30733BQC-01
2023-06
Optoelectronics
Excelitas Technologies
[Jun 12 2023] Excelitas Technologies Corp, an industrial technology leader in innovative, market-driven optoelectronic solutions, has introduced the C30733BQC-01 InGaAs avalanche photodiode. This unique combination of high gain and fast recovery time and low noise performance makes it the ideal solution for high-end telecom test equipment applications, optical communication and distributed fiber optic sensing ...

How to update the HPC power of electric vehicles to solve the heat dissipation problem?
2023-06
Power
Xilinx
[Jun 12 2023] With the help of DC fast charging technology, up to 350kW high-power DC fast charging (HPCDC), electric vehicles can achieve similar fuel car "stop refueling" in a short time to complete the charge, the driver's range anxiety will be greatly, HPC goal is to support 300km mileage charging time compressed to 10 minutes. Electric vehicles are revolutionizing transportation, powertrain electrificatio ...

NXP's new generation of secure and energy efficient i.MX 91 series extends Linux capabilities for a wide range of edge applications
2023-06
Semiconductors
NXP
[Jun 12 2023] NXP Semiconductors officially announces the i.MX 91 family of application processors. Building on NXP's more than two decades of leadership in developing multi-market application processors, the i.MX 91 series provides a secure, versatile, and energy-efficient portfolio optimized to meet the needs of next-generation Linux-based iot and industrial applications. The newly released protocols change ...

Murata commercializes a resin-molded surface mount MLCC for electric vehicle noise suppression
2023-06
Optoelectronics
Murata Electronics
[Jun 12 2023] Murata has developed the EVA Series, a resin-formed, surface-mounted multilayer ceramic capacitor for electric vehicle noise suppression. Although the product is small and thin (12.7 x 6.0 x 3.7 mm), it still ensures the creepage distance required for high voltage loads (10 mm), and supports the Y2 level of the international standard "IEC60384-14". This is a resin-formed surface mount multilayer ...
NXP introduces new top cooling package technology for RF power devices
2023-06
Semiconductors
NXP
[Jun 11 2023] NXP Semiconductor announced the launch of a family of top-cooled RF amplifier modules that incorporate innovative packaging technology to help create thinner wireless products for 5G infrastructure. Smaller base stations can improve the convenience and economics of installation, while being more decentralized into the environment. NXP's GaN multi-chip module family, combined with the new RF power ...

Transphorm has announced the launch of its low-cost SuperGaN FET drive solution
2023-06
Power
Transphorm
[Jun 11 2023] Transphorm, the global leader in GaN (gallium nitride) technology in next-generation power systems, recently introduced a high-performance, low-cost drive solution. The design solution is suitable for low to medium power applications such as LED lighting, charging, microinverters, UPS and gaming computers, further strengthening the company's value proposition to customers in these areas in the $3 ...

Infineon introduces the new EiceDRIVER™ 1200V half-bridge driver IC family
2023-06
Semiconductors
Infineon Technologies
[Jun 11 2023] Infineon Technologies has further expanded its product portfolio with the EiceDRIVER™ 6ED223xS12T series of 1200V silicon-on-insulator (SOI) three-phase gate drivers with the EiceDRIVER 2ED132xS12x series. The half-bridge configuration of the driver IC series complements the existing 1200V SOI series, providing customers with more choice and design flexibility. The enhanced current output capabil ...

STMicroelectronics introduces inertial modules and ASIL B certified software library for automobiles
2023-06
Semiconductors
STMicroelectronics
[Jun 11 2023] STMicroelectronics' ASM330LHB vehicle gauge MEMS inertial sensor module is highly accurate, suitable for a variety of automotive system functions, and is equipped with dedicated software to solve the design challenges of ASIL Class B functional safety applications. The ASM330LHB is AEC-Q100 compliant and comes in a 2.5mm x 3.0mm 14-pin VFLGA package. The module consists of a three-axis digital ac ...

Meteor Lake series processors will be imported into the VPU design
2023-06
Power
Intel
[Jun 10 2023] In the case of Computex2023 emphasizing the theme of artificial intelligence (AI), the new products launched by various manufacturers are also centered around AI. Processor giant intel (intel) is not exhibiting products in 2023. However, at the same time, it also announced that its code Meteor Lake series processor will import AI applications, and will design the new VPU core in it, which has att ...

Infineon introduces a new automotive power module for traction inverters for electric vehicles
2023-06
Connectors
Infineon Technologies
[Jun 10 2023] Infineon Technologies introduces a new automotive power module, HybridPACK™ Drive G2. The module inherits the proven HybridPACK Drive G1 integrated B6 package concept, offering scalability at the same size and scaling to higher power and ease of use. The HybridPACK Drive G2 series has different current and voltage ratings (750 V and 1200 V) and uses Infineon's next generation chip technologies, E ...