Records 5,467
Page 74/456
![Article Cover](/uploaded/images/article/19032ab5d6f94eaea0cb177f4850b679.jpeg)
Qualcomm launches advanced Internet of Things solutions
2023-05
Power
Qualcomm
[May 17 2023] To continue expanding the iot ecosystem and use cases, Qualcomm Technologies announced the launch of new iot solutions to support the development of next-generation iot terminals: Qualcomm QCS8550, QCM8550, QCS4490 and QCM4490 processors. The new and upgraded solutions offer rich functionality, advanced features, and a wide range of uses designed to meet the demanding needs of industry and commer ...
![Article Cover](/uploaded/images/article/c80402b4a2b94610952f97cc470567fd.jpg)
Amphenol RF offers flexible and PCB patch antennas
2023-05
Power
Ampleon
[May 16 2023] Amphenol RF adds flexibility and PCB patch antennas to its robust RF solution portfolio. These antennas can be used inside connected devices and provide flexible pads or rigid PCBS that can be installed inside the device. Flexible and PCB patch antennas are usually terminated with wireless modules, providing AMC or other industry standard subminiature connectors. These internal antennas are often ...
![Article Cover](/uploaded/images/article/e4781c436e774ac0838d047049e99b17.jpg)
The new SiC diodes offer the highest efficiency and superior robustness
2023-05
Semiconductors
Newhaven Display Intl
[May 16 2023] Navitas Semiconductor now offers fifth-generation high-speed GeneSiC SiC power diodes for demanding data center, industrial motor drive, solar and consumer applications. The 650v rated merged pin Schottky (MPS) diode features a unique pin Schottky construction that provides "low built-in voltage bias" (" low knee ") for excellent robustness under all load conditions with the highest efficiency. A ...
![Article Cover](/uploaded/images/article/07c53b08560c4b9bba16f04a1916b81f.jpg)
The second series GaN integrated circuits offer best-in-class robustness and efficiency
2023-05
Optoelectronics
Cardinal Components
[May 16 2023] Cambridge GaN Devices has released the second series of its ICeGaN 650V GaN HEMT series, offering industry-leading robustness, ease of use and maximum efficiency. The H2 Series ICeGaN HEMTs use the company's intelligent gate interface to virtually eliminate the typical E-mode GaN weakness, providing greatly improved overvoltage robustness, higher anti-noise thresholds, dV/dt suppression, and ESD ...
![Article Cover](/uploaded/images/article/89c89f3f8a8d4c03affad8a6a773a5e7.png)
STMicroelectronics introduces Inertial Modules for IIoT and IoT applications
2023-05
Semiconductors
STMicroelectronics
[May 16 2023] STMicroelectronics ISM330IS and ISN330ISN iNEMO inertial modules. These modules provide an integrated SiP solution that combines a three-axis digital accelerometer with a three-axis digital gyroscope. Inertial modules enable always-on, low-power optimal performance in industrial iot and iot applications, including industrial robotics, asset tracking, condition monitoring, and complex motion detec ...
![Article Cover](/uploaded/images/article/f84e0c32d0274f1a811737c28bdc6e27.jpeg)
Edible electronics breakthrough: Scientists have created the first edible rechargeable battery
2023-05
Power
IXYS
[May 16 2023] A research team at the Italian-Italian Institute of Technology has managed to create a fully edible rechargeable battery made from materials commonly found in our daily diet. The innovative technology is expected to play a role in areas such as health diagnosis, food quality monitoring and edible soft robots. The research is in the journal Advanced Materials. According to IT House, edible electro ...
![Article Cover](/uploaded/images/article/22e45331ccaf4de8bd75b4e9127c81af.jpg)
Elma electronics expands its line of rugged Small Size (SFF) edge computing systems
2023-05
Power
Elna America
[May 16 2023] Elma electronics expands its rugged line of small size (SFF) edge computing systems to include the JetSys-5330 based on the powerful NVIDIA Jetson AGX Orin SoM. The new rugged AI platform offers up to 275 TOPS and multiple extended sites for customizing I/O and storage needs, making it an ideal platform for rugged deployment of deep learning applications. By enabling advanced data processing in h ...
![Article Cover](/uploaded/images/article/f9e9a09652bc492496f9db0be27827b8.jpg)
Harwin offers pitch hybrid layout connectors
2023-05
Power
Harwin Inc.
[May 16 2023] Harwin offers a range of Gecko-MT 1.25mm pitch hybrid layout connectors. These connectors are the smallest and lightest hybrid layout devices available today and are used in high-performance applications where size, weight and power are critical, such as aerospace, defense, motorsports, and more. Connectors have two or four power contacts and eight signal contacts, 10A and 2A in each type, with s ...
![Article Cover](/uploaded/images/article/d717cde48d4a4a5abbd190a87ef31202.png)
Helo Semiconductor supports Infineon OPTIGATM TPM security chip firmware burning
2023-05
Semiconductors
Infineon Technologies
[May 16 2023] Infineon Technologies and Helo Semiconductor, Taiwan's leading IC recording and testing brand, jointly announced their cooperation in the trusted Platform Module (TPM) security chip field. Helo Semiconductor has officially become an Associated Partner of Infineon in the Greater China market. Provide firmware update burning service for Infineon OPTIGATM TPM security chip, help the majority of equi ...
![Article Cover](/uploaded/images/article/a97df6899d0444469d935347abcaf646.jpg)
High voltage MCU with USB-C PD and up and down voltage charging controller
2023-05
Semiconductors
Infineon Technologies
[May 15 2023] USB-C has been widely adopted by the consumer electronics industry as the connector of choice and is expected to replace most traditional power adapters up to 240 W. With the global transition to USB-C-based DC power, fast charging protocols are becoming more and more popular, further improving power functionality and user experience. To meet the demand created by this trend, Infineon introduces ...
![Article Cover](/uploaded/images/article/7b4e27fd23e743a6b5ee999c3b331dca.jpg)
Infineon focuses on the three major motor driving markets to meet the new challenges of the motor market
2023-05
Semiconductors
Infineon Technologies
[May 15 2023] Based on a quarterly revenue comparison for fiscal 2021 and 2022, automation and drives, home appliances, and electric vehicles are the major growth areas for motor control system applications. These three pillars of motor drive can well reflect the development of global motor drive. According to the opinion of the market consulting firm's analysts and the customer's view of the market, motor dri ...
![Article Cover](/uploaded/images/article/341fdfa26c85431b92d5ddc0c14404d4.jpg)
Renesas Electronics expands its connectivity product lineup with acquisition of Panthronics to acquire NFC technology
2023-05
Semiconductors
Renesas Electronics America
[May 15 2023] Renesas Electronics, a global provider of semiconductor solutions, announced that it has entered into a definitive agreement with the shareholders of Panthronics AG (" Panthronics "), a fabless semiconductor company focused on high performance wireless products, pursuant to which Renesas Electronics will acquire Panthronics through a wholly owned subsidiary in an all-cash transaction. The acquisi ...