Technology Articles

2023-05 Semiconductors KEMET

[May 4 2023] YAGEO Group's KEMET announced the launch of a new series of high performance supercapacitors for automotive electronics, the FMU series, which is industry-leading in the market with operating temperatures ranging from -40 ° C to 105 ° C and capable of operating for 1000 hours at rated voltage under 85 ° C /85%RH conditions. These supercapacitors meet automotive test requirements and are manufactu ...

2023-04 Power KEMET

[Apr 29 2023] YAGEO Group's KEMET announced the launch of a new series of high performance supercapacitors for automotive electronics, the FMU series, which is industry-leading in the market with operating temperatures ranging from -40 ° C to 105 ° C and capable of operating for 1000 hours at rated voltage under 85 ° C /85%RH conditions. These supercapacitors meet automotive test requirements and are manufactu ...

2023-04 Semiconductors Microchip Technology

[Apr 29 2023] Electrification is driving growth in SiC semiconductors, with large market segments such as electric vehicles, sustainability and industrial turning to SiC power solutions due to their fast switching capabilities, lower power losses and higher temperature performance. To help power design engineers make an easy, quick and assured transition to SiC power solutions, Microchip Technology announced t ...

2023-04 Connectors Transphorm

[Apr 29 2023] Transphorm and Weltrend Semiconductor, a pioneer and global supplier of reliable, high-performance gallium nitride (GaN) power conversion products, announced the launch of the first system-level package (SiP) gallium nitride power control chip. Weltrend Semiconductor is one of the world leaders in controller ics for adapter USB PDS. The new WT7162RHUG24A power converter control chip, A 45 - to 10 ...

2023-04 Power XP Power

[Apr 29 2023] XP Power has announced the EPL150 series of high-power density, ultra-thin size, bare version AC-DC power supplies for space-critical, cost-sensitive, industrial, communications and medical applications. The output power of EPL150 series can reach 100W when cooling by natural convection, and 150W when the air flow is 10CFM. The product measures 101.6 x 50.8 mm and its ultra-thin 25.1 mm thickness ...

2023-04 Power Power Integrations

[Apr 29 2023] Power Integrations has announced the launch of 900V gallium nitride (GaN) devices, adding to the InnoSwitch3™ family of flyback switch ics. Using the company's unique PowiGaN™ technology, the new IC delivers up to 100W of power with an efficiency of over 93%, eliminating the need for heat fins and simplifying power design for space-constrained applications. The InnoSwitch3 design also features ex ...

2023-04 Semiconductors Qorvo US Inc.

[Apr 29 2023] Qorvo announced that it will be demonstrating a new leadless surface Mount (TOLL) packaging technology that delivers high performance as evidenced by the 750V SiC FET's 5.4 (mΩ) on-off impedance, the lowest in the world. It is also the first product in Qorvo's 750V SiC FETs product TOLL package, with on-resistance ranges from 5.4 mΩ to 60 mΩ. These devices are ideal for applications where space i ...

2023-04 Optoelectronics TE Connectivity

[Apr 29 2023] TE Connectivity's Dynamic D8000 pluggable connector. The Dynamic D8000 pluggable connector has A high current capacity, including 1000 VDC rated voltage, 3000 VAC withstand voltage, and 100 A current per pin. These reliable, high-performance connectors support a range of applications, including battery management systems, battery test equipment, factory automation and robotics. The TE Connectivit ...

2023-04 Semiconductors Toshiba Memory America, Inc.

[Apr 28 2023] Toshiba Electronics Components and Storage announced the launch of an Interface driver/receiver IC, the "TB9032FNG", an in-vehicle driver/receiver IC for the physical layer interface defined in the Clock Extension Peripheral Interface (CXPI) In-vehicle Communication Protocol standard. The product operates at temperatures ranging from -40℃ to 125℃ and is designed to meet the AEC-Q100 (Class 1) on- ...

2023-04 Semiconductors Infineon Technologies

[Apr 28 2023] As a global semiconductor leader in power systems and the Internet of Things, Infineon Technologies further expands its existing AIROC Wi-Fi and Bluetooth portfolio with the introduction of the new AIROC™ CYW43022 ultra-low power dual-band Wi-Fi 5 and Bluetooth ® two-in-one products. The CYW43022 Ultra Low Power architecture features industry-leading performance that reduces power consumption dur ...

2023-04 Semiconductors STMicroelectronics

[Apr 28 2023] STMicroelectronics has released the industry's first microcontroller system chip security solution, STM32Trust TEE Secure Manager, which simplifies the embedded application development process and ensures security protection services "out of the box." First used in the STM32H5 family of microcontrollers, the STM32Trust TEE Secure Manager solution eliminates the need for developers to write and va ...

2023-04 Semiconductors TDK

[Apr 28 2023] TDK Corporation introduces the new B82559A*A033 series shielding EPCOS ERU33 high current chokes. The new family of components are through-hole mounted with ultra-high saturation currents ranging from 32 A to 83 A at 100 °C. They are available in six models ranging from 3.2 μH to 10 μH with DC resistances as low as 0.85 mΩ or 1.2 mΩ, depending on the model. The choke is a very compact 33 x 33 x 1 ...