Technology Articles

2024-12 Semiconductors Rohm Semiconductor

[Dec 12 2024] ROHM, a world-renowned Semiconductor manufacturer, announced a strategic partnership with Taiwan Semiconductor Manufacturing Company Limited (TSMC) for the development and mass production of gallium nitride power devices for vehicles. Through this partnership, the two companies will aim to combine Rohm's gallium nitride device development technology with TSMC's industry-leading GaN-on-Silicon pro ...

2024-12 Semiconductors AKM Semiconductor Inc.

[Dec 12 2024] What Is AK4499EQ? The AK4499EQ is a high-performance 32-bit, 4-channel Switched Resistor DAC that incorporates advanced technology to deliver industry-leading low distortion and low noise performance. It supports PCM inputs up to 768kHz and DSD inputs up to DSD512, making it ideal for high-resolution audio playback in modern network audio systems and USB-DACs. The DAC also features exceptional ou ...

2024-12 Power Henrich Electronics Corporation

[Dec 10 2024] Heidenhain enclosed linear gratings and encoders with innovative true-image technology ensure that the gratings signal is not affected by condensation and other liquid contamination on the machine. The Heideham 6 Series LC Linear grating ruler and the 1 Series RCN Angle encoder provide reliable, high-precision position data, even without the need for sealed air in most applications. As a result, ...

2024-12 Semiconductors Advanced Thermal Solutions Inc.

[Dec 10 2024] As a traditional energy-intensive industry, the mining industry is not facing easy challenges in the global energy transition. According to research by consultancy Wood Mackenzie, direct and indirect greenhouse gas emissions from mining activities account for 4 to 7 per cent of total global emissions, a figure that cannot be ignored. In addition to high energy consumption and high emissions, the ...

2024-12 Power ABLIC

[Dec 9 2024] Digitalisation, artificial intelligence (AI) and automation are intensifying the demand for data centre (DC) IT infrastructure, driving the need for effective cooling solutions. Increasing computing power generates more heat, which in turn requires a significant increase in cooling capacity to maintain performance, stability and equipment life. According to ABI Research, the number of data center ...

2024-12 Semiconductors Abracon

[Dec 7 2024] Global sales of professional service robots are up 30%. The statistics department of the International Federation of Robotics (IFR) registered more than 205,000 robots in 2023. Nearly 80 percent of the robots came from the Asia-Pacific region, with 162,284 units sold. Europe followed with 33,918 units, and the Americas came in third with 8,927 units. This is according to the IFR's World Robotics ...

2024-12 Semiconductors Molex

[Dec 7 2024] Molex, a world-renowned connector and electronic solutions' provider, announced that it will acquire AirBorn, a Texas-based company, to enhance its capabilities in aerospace connector technology. AirBorn is an aerospace connector manufacturer with a history of more than 60 years, specializing in the design and manufacture of rugged connectors and electronic components for original equipment manuf ...

2024-12 Passive Components Vishay Siliconix

[Dec 6 2024] Electronic systems and devices operating at high power levels require complex cooling solutions. Although current materials with high thermal conductivity promise excellent heat transfer across nanoscale and micron interfaces under ideal conditions, their performance in complex thermal interfaces for practical applications is often several orders of magnitude lower than theoretical values. Recent ...

2024-12 Semiconductors Bridgetek Pte Ltd.

[Dec 6 2024] On December 6, Broadcom announced the launch of the industry's first 3.5D F2F packaging technology, the 3.5D XDSiP platform. This advanced platform integrates over 6000mm² of silicon chips and up to 12 HBM memory stacks within a single package, addressing the high-performance, low-power requirements of large AI chips. The 3.5D XDSiP, beyond the 2.5D packaging, connects the top metal layers of two ...

2024-12 Semiconductors ABB Embedded Power

[Dec 6 2024] As a leader in advanced haptic motor technology, TITAN Haptics has recognized that in a competitive market, haptic technology can differentiate products, improve user satisfaction, and create new business opportunities. The following case studies show how several companies have successfully integrated haptic technology into their products, resulting in significant gains. These examples also show ...

2024-12 Semiconductors Allegro MicroSystems, LLC

[Dec 5 2024] What Is L6219DS? The L6219DS is a motor driver designed to control bipolar stepper motors or two DC motors with bidirectional drive capability. It features two H-bridge outputs that can handle up to 45 V and provide up to 750 mA of current. The device incorporates internal PWM control to regulate output current, with a low saturation voltage drop of less than 1.8 V at 500 mA. The output current l ...

2024-12 Semiconductors XMOS

[Dec 5 2024] Pure wafer foundry X-Fab and Soitec will begin working together to provide Soitec's SmartSiC technology for the production of silicon carbide power devices at X-Fab's facility in Lubbock, Texas. The collaboration follows the successful completion of the evaluation phase, during which X-Fab Texas manufactured silicon carbide (SiC) power devices on 6-inch SmartSiC wafers. Soitec will provide X-Fab ...