Technology Articles

2024-12 Semiconductors Bridgetek Pte Ltd.

[Dec 6 2024] On December 6, Broadcom announced the launch of the industry's first 3.5D F2F packaging technology, the 3.5D XDSiP platform. This advanced platform integrates over 6000mm² of silicon chips and up to 12 HBM memory stacks within a single package, addressing the high-performance, low-power requirements of large AI chips. The 3.5D XDSiP, beyond the 2.5D packaging, connects the top metal layers of two ...

2024-12 Passive Components Vishay Siliconix

[Dec 6 2024] Electronic systems and devices operating at high power levels require complex cooling solutions. Although current materials with high thermal conductivity promise excellent heat transfer across nanoscale and micron interfaces under ideal conditions, their performance in complex thermal interfaces for practical applications is often several orders of magnitude lower than theoretical values. Recent ...

2024-12 Semiconductors ABB Embedded Power

[Dec 6 2024] As a leader in advanced haptic motor technology, TITAN Haptics has recognized that in a competitive market, haptic technology can differentiate products, improve user satisfaction, and create new business opportunities. The following case studies show how several companies have successfully integrated haptic technology into their products, resulting in significant gains. These examples also show ...

2024-12 Semiconductors Analog Devices

[Dec 5 2024] The financial race by tech giants to commercialize generative artificial intelligence (GenAI) has somewhat obscured the amount of work being done on AI, especially at the edge of the network, where vendors are desperate for AI applications to run on iot devices, which are often limited by memory, bandwidth, and power consumption. A microcontroller (MCU) from Analog Devices, Inc. integrates a low- ...

2024-12 Semiconductors Abracon

[Dec 5 2024] In recent years, with the rapid development of new energy vehicles and 5G communication technology, the demand for high-performance semiconductor materials has been growing. In the past year, the domestic silicon carbide industry has experienced rapid development. From the recently held 2024 wide bandgap semiconductor advanced technology innovation and application development Summit Forum, the re ...

2024-12 Semiconductors XMOS

[Dec 5 2024] Pure wafer foundry X-Fab and Soitec will begin working together to provide Soitec's SmartSiC technology for the production of silicon carbide power devices at X-Fab's facility in Lubbock, Texas. The collaboration follows the successful completion of the evaluation phase, during which X-Fab Texas manufactured silicon carbide (SiC) power devices on 6-inch SmartSiC wafers. Soitec will provide X-Fab ...

2024-12 Semiconductors Allegro MicroSystems, LLC

[Dec 5 2024] What Is L6219DS? The L6219DS is a motor driver designed to control bipolar stepper motors or two DC motors with bidirectional drive capability. It features two H-bridge outputs that can handle up to 45 V and provide up to 750 mA of current. The device incorporates internal PWM control to regulate output current, with a low saturation voltage drop of less than 1.8 V at 500 mA. The output current l ...

2024-12 Power TDK

[Dec 5 2024] DIN Rail power supplies provide a compact, reliable and easy to install solution for powering a wide range of equipment and systems in industrial, automation and building applications. Choosing the right DIN rail power supply for a specific application is no easy task, as there are many factors to consider, from input voltage and output power to efficiency and wiring connection options. TDK-Lambd ...

2024-12 Power NXP

[Dec 4 2024] Ultra-wideband is a powerful wireless communication technology commonly referred to as UWB. The technology is versatile and can perform a variety of difficult-to-classify tasks. For example, UWB is commonly used as a ranging technology to pinpoint the location of objects and easily find things that may be misplaced or lost, such as wallets. On the other hand, UWB is also a positioning technology ...

2024-12 Sensors ON Semiconductor

[Dec 4 2024] How does a smart doorbell detect someone at your door? How do you recognize important actions through the camera? The answer is image sensors. These tiny sensors are built into the smart doorbell and always operate at full state (full resolution, 30fps), where the recorded images can clearly show what person or object is approaching your door. Given that such devices need to run 24 hours a day, y ...

2024-12 Semiconductors ABB Embedded Power

[Dec 3 2024] Semiconductor diamond deep technology company Diamfab and plasma-assisted CVD synthetic diamond startup HiQuTe diamond announced a strategic technology partnership. This partnership covers key stages of the value chain, from the production of substrates to the production of electronic components to the epitaxy of doping layers. HiQuTe Diamond will leverage its unique expertise in producing high-q ...

2024-12 Semiconductors Rohm Semiconductor

[Dec 3 2024] Valeo and ROHM Semiconductor collaborate to propose and optimize the next generation of power modules for electric motor inverters using their combined expertise in power electronics management. As a first step, ROHM will provide its 2-in-1 Silicon Carbide (SiC) molded module TRCDRIVE pack™ to Valeo for future powertrain solutions. Valeo is broadening access to efficient, electrified mobility acr ...