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The Role of 5G in Automotive Signal Management
2024-11
Semiconductors
Samsung
[Nov 12 2024] The adoption of 5G technology promises to revolutionize vehicle safety and efficiency by integrating internal and external antennas for high-speed, low-latency, and reliable communication with 5G networks. This communication will enable applications like advanced driver assistance systems (ADAS), real-time traffic updates, remote diagnostics, and seamless entertainment. As 5G infrastructure grows ...
An Intermediate Bus Converter (IBC) designed for AI and ML data center applications
2024-11
Power
Flex Power Modules
[Nov 12 2024] Flex Power Modules announced the introduction of the BMR316, a high-performance non-isolated, non-regulated DC/DC Intermediate Bus Converter (IBC), tailored for AI and milliliter data center applications that require significant computing power. The compact bmr316 is the best choice for high-power ibc applications where board space is limited. The bmr316 has a fixed 4:1 conversion rate, effective ...
Nexperia and KOSTAL Formed a Strategic Relationship to Advance Automotive-Grade Wide Bandgap (WBG) Devices
2024-11
Power
Nexperia
[Nov 12 2024] Nexperia has announced a strategic partnership with renowned automotive supplier KOSTAL to facilitate the production of wide-band gap (WBG) devices that meet stringent specifications for automotive applications. Under the terms of the partnership, Amperi will supply, develop and manufacture WBG power electronics, which will be designed and tested by Kostal. The partnership will primarily focus on ...
Navitas announces the world's first 8.5kW AI data center power supply powered by GaN and SiC
2024-11
Semiconductors
Nuvoton Technology
[Nov 12 2024] Navitas Semiconductor has introduced the world's first 8.5 kW power unit (PSU) for next-generation artificial intelligence and hyperscale data centers. The PSU is powered by GaN and SiC technologies and achieves 98% efficiency. The 54V output power module is optimized by artificial intelligence to comply with the OCP (Open Compute Project) and ORv3 (Open Rack v3) specifications. Equipped with hig ...
Thin, high-creepage distance isolation transformers for gate drive and high-voltage battery management systems
2024-11
Semiconductors
Bourns
[Nov 11 2024] Bourns, the world's leading manufacturer of electronic components for power, protection and sensing solutions, has introduced a new AEC-Q200 compliant automotive thin, high creepage distance isolation transformer. The Bourns H series flyback transformers are designed for high power density, higher performance and compact dimensions. This product is suitable for a variety of applications, includin ...
Melexis announces ground-breaking Arcminaxis™ position sensing technology and products for robotic joints
2024-11
Sensors
Melexis Technologies NV
[Nov 11 2024] Melexis, a global microelectronics engineering company, announced the launch of Arcminaxis™, a breakthrough magnetic technology designed to meet the growing demand for affordable and high-precision robotic joint position sensing solutions. The MLX90384, the first product with Arcminaxis™ technology, provides manufacturers with a cost-effective solution by simplifying the assembly process of robot ...
Infineon introduces the industry's first 20 Gbps universal USB peripheral controller
2024-11
Semiconductors
Infineon Technologies
[Nov 11 2024] Infineon Technologies AG, the global semiconductor leader in power systems and the Internet of Things, has announced the EZ-USB FX20 programmable USB peripheral controller, a new product of the EZ-USB™ family. With this product, developers can create USB devices that meet the higher performance requirements of artificial intelligence (AI), image processing, and emerging applications. The EZ-USB™ ...
NSM211x Series automotive grade current sensors without external isolation components
2024-11
Sensors
Noritake Company Inc.
[Nov 9 2024] NOVOSENSE Microelectronics has introduced the NSM211x, a series of automotive-grade, completely integrated high-bandwidth, high-isolation current sensors that guarantee accurate current measurement while obviating the necessity for extra isolation components. The automotive-grade series, to be exhibited at electronica 2024 (Stand B5.450), is designed for applications such as OBC/DC-DC converters, ...
Next-Generation Automotive Microcontrollers
2024-11
Semiconductors
STMicroelectronics
[Nov 9 2024] STMicroelectronics (ST) is dedicated to supporting the automotive industry's challenges with electrification and digitalization. Through current solutions and a future-oriented unified MCU platform development strategy, ST aims to enable the next-generation vehicle architecture and the evolution of software-defined vehicles (SDV) with breakthrough innovations. Here, Remi EL-OUAZZANE, President of ...
Innoscience has launched two new 100V automotive grade GaN devices for the automotive Lidar market
2024-11
Semiconductors
Inolux
[Nov 9 2024] Innoscience Technologies has enhanced its portfolio with the introduction of two new 100 v automotive-grade GaN devices. INN100W135A-Q (RDS), max = 13.5Ω) and the more compact INN100W800A-Q (RDS(top),max = 80Ω) are both AEC-Q101 certified and optimized for LiDAR, high power density DC-DC converters and Class D audio applications in the automotive industry. The INN100W135A-Q and ultra-compact INN1 ...
What Is ICE3BR0665J IC?
2024-11
Semiconductors
Infineon Technologies
[Nov 8 2024] What Is ICE3BR0665J? - The ICE3BR0665J is a high-performance IC in the CoolSET®-F3R jitter series from Infineon Technologies. - The ICE3BR0665J is designed for offline battery adapters and cost-effective, low-power SMPS applications. - This IC offers advanced power management features, such as active burst mode, auto-restart protection, propagation delay compensation and soft start and gate drivi ...
Ams OSram launches new infrared LED with new IR
2024-11
Optoelectronics
ams
[Nov 8 2024] Ams Osram, a global leader in optical solutions, announced the release of its latest IR: 6 infrared (IR) LED chip technology. Compared with AMS OSram's existing IR LED transmitter chips, the technology can increase display brightness by 35% and work efficiency by 42%. The new IR: 6 thin-film chip technology will enable manufacturers to significantly improve lighting and image quality, achieve fas ...