Technology Articles

2024-11 Power Infineon Technologies

[Nov 6 2024] 3D depth sensors play an important role in in-vehicle monitoring systems, enabling innovative automotive cabins, seamless connectivity to new services, and greater passive safety. They are essential for meeting the requirements and safety ratings of the European New Car Assessment Programme (NCAP), as well as for achieving superior comfort features. Infineon Technologies AG, a global semiconducto ...

2024-11 Power Toshiba Semiconductor and Storage

[Nov 6 2024] Toshiba Electronic Components & Storage Corporation announced that it has begun offering engineering samples of the "TB9084FTG" gate drive IC for 3-phase brushless DC motors. This device can be used to drive critical on-board functions including body system applications, electric pumps, and motor generators. The device sample is now open for application. Many of the mechanical components in today ...

2024-11 Power Advanced Linear Devices Inc.

[Nov 6 2024] In the global trend towards sustainable development, new energy vehicles have attracted wide attention due to their low carbon emissions and high energy efficiency. With this comes an increasing demand for high-performance power electronics. Silicon carbide (SiC) power devices, with their excellent electrical and thermal properties, are becoming a key component of the core power system of new ene ...

2024-11 Sensors STMicroelectronics

[Nov 5 2024] ST has introduced an enhanced mobile data communication module that simplifies the connection and management of large-scale iot devices and accelerates the adoption of sustainable smart grids and smart industries. The ST87M01 module platform is NB-IoT certified and can be equipped with an advanced ST4SIM embedded SIM (eSIM) card for access to mobile network services. In addition, the modules are ...

2024-11 Semiconductors Qorvo US Inc.

[Nov 5 2024] Recently, Qorvo announced that MediaTek has selected Qorvo as the key supplier for the first Wi-Fi 7 front-end module (FEM) on the Mediatek MT6653 Wi-Fi 7/Bluetooth single chip. Qorvo's Wi-Fi 7 FEM and MediaTek MT6653, used in the MediaTek Dimensity 9400 platform, have been optimised to help enhance the performance, energy efficiency and technical characteristics of Wi-Fi 7 in mobile devices, pro ...

2024-11 Passive Components Murata

[Nov 4 2024] Murata has developed a "stretchable circuit board" that works even when the board is bent and stretched, ensuring high reliability. It is expected to be used in medical and health care wearable devices that collect biological information on the surface of the body, and because of its scalability, it can provide a more comfortable adhesive feeling while achieving high-precision data collection. Mu ...

2024-11 Passive Components Vishay

[Nov 4 2024] Vishay Intertechnology has announced the launch of a new series of surge limiting positive temperature coefficient (PTC) thermistors, the PTCEL. Vishay BCcomponents PTCEL High Energy Series devices have a maximum energy absorption capacity of 340 J, five times higher than competing devices at high ambient temperatures, a wide resistance range at 25 °C (R25), and high voltage handling capabilities ...

2024-11 Passive Components Infineon Technologies

[Nov 1 2024] Following the announcement of the launch of the world's first 300mm gallium nitride (GaN) power semiconductor wafer and the completion of the world's largest 200mm silicon carbide (SiC) power semiconductor wafer fab in Kulin, Malaysia, Infineon Technologies AG has once again achieved a new milestone in semiconductor manufacturing technology. Infineon has made a breakthrough in the processing and ...

2024-11 Semiconductors ISSI, Integrated Silicon Solution Inc

[Nov 1 2024] Naxin Microelectronics recently launched the NSAD124x and NSAD114x series of multi-channel 24/16-bit low-power, high-precision Δ-Σ ADCs, designed to meet the high-accuracy temperature measurement needs in industrial applications. Featuring an integral non-linearity of 3 ppm and effective resolutions up to 23.4 bits, these devices are ideal for thermocouple measurement, multi-wire RTD, thermistors ...

2024-11 Power NXP

[Nov 1 2024] NXP Semiconductors has announced the addition of two new tools to its eIQ AI and machine learning development software to make it easy to deploy and use AI edges on a variety of edge processors. eIQ Time Series Studio provides automated machine learning workflows that make it easy to develop and deploy time series-based machine learning models on McU-level chips, such as the MCX Series MCU portfo ...

2024-10 Connectors Nexperia

[Oct 31 2024] Nexperia has introduced a new line of AC/DC flyback controllers to further expand its expanding portfolio of power ics. The NEX806/8xx and NEX8180x are designed for GaN based flyback converters for devices such as PD(Power Delivery) fast chargers, adapters, wall sockets, strip sockets, industrial power supplies and auxiliary power supplies, and other AC/DC conversion applications that require hig ...

2024-10 Semiconductors Texas Instruments

[Oct 31 2024] What Is NE5534P? - The NE5534P is a high-performance operational amplifier. - The NE5534P features excellent DC and AC characteristics. - This operational amplifier is internally compensated for gains equal to or greater than three. - The NE5534P also includes input protection diodes, output short-circuit protection, and provides the capability to adjust offset voltage using the BALANCE and COMP/ ...