Technology Articles

2023-01 Semiconductors TDK

[Jan 31 2023] TDK plans to launch its new EPCOS B33331I6* series compact motor running capacitors in September 2023. The new line of capacitors has a safety rating of up to S2, which meets IEC 60335-2-24 standards, and features an ultra-compact aluminum can design, which is expected to be the most compact motor operating capacitor on the market today. Capacitive aluminum cans are only 30 or 35 mm in diameter; ...

2023-01 Semiconductors STMicroelectronics

[Jan 31 2023] STMicroelectronics launches STM32C0 series of products with the highest cost performance among STM32 microcontroller (MCU) family so far, lowering the threshold of STM32 entry for developers. Billions of smart industrial, medical and consumer products around the world have adopted STM32 MCU. STM32 has thousands of existing product models, so that product designers can always choose moderate price ...

2023-01 Semiconductors Infineon Technologies

[Jan 31 2023] Integrated bootstrap diodes are used to power three external high-edge charging bootstrap capacitors, which support 100% duty cycle conditions through trickle charging pumps. Protection features include undervoltage locking, overcurrent protection with configurable thresholds, fault communication, and automatic fault signal clearing. Driver output with a pulse large current buffer stage minimizes ...

2023-01 Optoelectronics Molex

[Jan 31 2023] Molex's PowerPlane Open Compute Project (OCP) Open Rack Version (ORV3) cable assembly is a power interconnect device that enables users to develop data center applications using a proven standard architecture. Molex has also created these connector and cable assembly solutions based on the OCP standard to achieve reliable technical performance. These power solutions have been thoroughly tested an ...

2023-01 Semiconductors Abracon

[Jan 31 2023] Abracon's ABS07AIG is an extension of the company's standard quartz crystal product, certified by AEC-Q200 and certified by the TSI6949 production line. With wide operating temperature options ranging from -40°C to +125°C, the device is an ideal solution for commercial or industrial applications in extreme environments. ABS07AIG has an ultra-thin and thin profile that can be used in space-constra ...

2023-01 Semiconductors STMicroelectronics

[Jan 30 2023] The FDA803S and FDA903S are the latest single-channel fully differential 10W Class D audio power amplifiers in the stmicroelectronics FDA (Pure Digital amplifiers) family. Target applications include emergency road rescue, telematics, and any automotive system that requires audio channels to produce voice, music, or prompt messages of up to 10W standard output power. These amplifiers integrate I2 ...

2023-01 Power Recom Power

[Jan 30 2023] RECOM's new miniature packaged voltage stabilized DC/DC converters, R1M, R2M, R3M and R5M series, are rated at 1W, 2W, 3W and 5W, respectively. The series comes in the usual package size of 13.2mm (L) x 9.1mm (W) x 10.2mm (H). The R2M series is also available in through-hole DIP8 package. The product's input range is 4:1, which is 9-36VDC or 18-75VDC, while R1M, R2M and R3M also offer 4.5-18V inp ...

2023-01 Semiconductors Renesas Electronics America

[Jan 30 2023] Renesas Electronics announced the launch of a new grid-driven IC, the RAJ2930004AGM, for high voltage power devices such as IGBTs (insulated gate bipolar transistors) and SiC (silicon carbide) mosFets for electric vehicle (EV) inverters.As an important part of the electric vehicle inverter, the grid drive IC provides the interface between the inverter control MCU, and the IGBT and SiC mosFETs tha ...

2023-01 Semiconductors Vishay

[Jan 30 2023] Vishay Intertechnology has announced the launch of two new 30 V symmetrical dual-channel N-channel power MosFETs --SiZF5300DT and SiZF5302DT. Combination of high-edge and low-edge TrenchFET Gen V MOSFET in a 3.3mm x 3.3mm PowerPAIR 3x3FS monomer package. Vishay Siliconix SiZF5300DT and SiZF5302DT are suitable for power conversion in computing and communication applications, reducing component cou ...

2023-01 Semiconductors Infineon Technologies

[Jan 30 2023] The new PrimePACK 2300V IGBT module was developed primarily for 1500V inverters. It is characterized by good DC stability under 1500V working voltage, that is, high robustness under cosmic radiation, and overload junction temperature of 175℃ can support failure modes such as LVRT. In addition, the module achieves higher power density compared to the IGBT4 solution, resulting in cost performance a ...

2023-01 Semiconductors Littelfuse

[Jan 30 2023] Littelfuse Corporation has announced the launch of its new C&K Switches NanoT product line, which consists of micro, surface-mounted, extremely small, waterproof tap switches. Smart wearables, health monitoring devices and other battery-powered iot devices are driving demand for higher density active component integration, seamless circular screens and additional features in ever-smaller Spaces. ...

2023-01 Semiconductors Laird Technologies

[Jan 29 2023] Laird Connectivity FlexPIFA 2-dBi and FlexPIFA 3-dBi antennas equipped with MHF1/U.FL cable. The industry-leading flexible planar inverted F antenna (PIFA) is designed for Wi-Fi or Bluetooth applications and can be installed on non-conductive or irregular surfaces even when exposed to humidity. It operates at temperatures ranging from -40°C to +85°C. Laird Connectivity FlexPIFA 2-dBi and 3-dBi an ...