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Technology Articles

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Samsung Electronics' lead and TSMC's challenge

2024-06 Power Samsung
[Jun 28 2024] Semiconductor packaging technology is a key part of the chip manufacturing process, which directly affects the performance, reliability and cost of integrated circuits. Among them, Panel Level Packaging (PLP) technology, as an emerging high-density packaging solution, is gradually becoming the focus of the industry. Samsung Electronics and Taiwan Semiconductor Manufacturing Company (TSMC), as the ...
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STMicroelectronics announces Intelligent eFuse for vehicles to improve design flexibility and functional safety

2024-06 Connectors STMicroelectronics
[Jun 28 2024] STMicroelectronics began mass production of the new train gauge high-edge power switch tube, the new product adopts ST's proprietary intelligent fuse protection function and supports SPI digital interface, improving design flexibility and functional safety. The four-channel VNF9Q20F is the first product in ST's new family of power switches using the advanced single-chip VIPower M0-9 MOSFET proces ...
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Intel achieves full integration of optical I/O cores

2024-06 Power Intel
[Jun 28 2024] Intel has made a breakthrough in silicon optical integration technology for high-speed data transmission. At the Fiber Optics Conference 2024 (OFC), Intel's Silicon Optical Integrated Solutions (IPS) team demonstrated an industry-leading, fully integrated OCI (Optical Compute Interconnect) core that is packaged with an Intel CPU to run real data. For data center and HPC applications, Intel's OCI ...
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Microchip releases an early access version of the MPLAB extension for VS Code

2024-06 Power Microchip Technology
[Jun 27 2024] To take advantage of the versatility of Microsoft Visual Studio Code (VS Code), Microchip Technology has released an early access version of the MPLAB Extensions for VS Code. This release provides embedded designers with the tools to import projects from the MPLAB X Integrated development environment (IDE) to VS Code while still using Microchip's debugging and programming support. This move is pa ...
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How can GaN power devices improve the power density of inverters

2024-06 Power Global Specialties
[Jun 27 2024] GaN (Gallium nitride) power devices, as an advanced semiconductor device, have many advantages in inverter applications, such as high switching frequency, low switching loss and high temperature operation capability. The introduction of GaN power devices can significantly improve the power density of inverters, so that inverters can provide higher power output at the same size. Several methods fo ...
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Infineon introduces CoolSiC MOSFET 400 V, redefining the power density and efficiency of AI server power supplies

2024-06 Connectors Infineon Technologies
[Jun 26 2024] As artificial intelligence (AI) processors increasingly demand more power, server power supplies (Psus) must deliver higher power without exceeding the prescribed size of server racks, mainly due to the surge in energy demand for advanced Gpus. By the end of the decade, each advanced GPU chip could consume 2 kilowatts or more. These requirements, together with the emergence of more demanding appl ...
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Filters with adjustable frequencies make phones less crowded

2024-06 Power Aavid
[Jun 26 2024] In modern communication, wireless devices use different filters for different frequencies, such as 5G, 4G, 3G, in order to cover all frequencies or bands need to use a large number of filters, and these filters will take up a lot of space. With the continued evolution of communication standards, 6G will also enter commercial use in the future, which means that more filters need to be added to com ...
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Infineon launches a new development board to accelerate edge AI and ML applications

2024-06 Connectors Infineon Technologies
[Jun 26 2024] Infineon Technologies has recently launched a new development board designed to provide a quick-start platform for the use of machine learning and artificial intelligence (ML and AI) at the edge. The board, named Cy8CKOIT-062S2-AI, is powered by the PSoC 62S2 microcontroller. "Infineon's PSoC 6 AI Evaluation Suite is the perfect partner for you to easily prototype and collect real-world data to q ...
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Application of hybrid bonding technology in HBM

2024-06 Connectors Texas Instruments
[Jun 26 2024] In the modern information society, dynamic random access memory (DRAM), as an important part of computers and various electronic devices, has always played a vital role. As technology continues to advance and demand increases, DRAM performance and capacity continue to improve. Among them, high bandwidth memory (HBM) as a new generation of DRAM technology, has been widely concerned. The emergence ...
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Bosch introduces rugged, energy-efficient 4-in-1 MEMS indoor air quality sensors

2024-06 Sensors Bosch Sensortec
[Jun 25 2024] The quality and cleanliness of the air is essential for health. On average, we spend about 90% of our time indoors, where the air is much cleaner than outside. Poor indoor air quality can lead to respiratory diseases, allergies, heart disease and cancer, among many other conditions. Bosch Sensortec has a long history of designing and manufacturing air quality sensors and is a leader in the indust ...
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How can sensors change our lives

2024-06 Sensors Renesas Electronics America
[Jun 25 2024] With the rapid development of modern science and technology, sensors, as a key technology, are quietly changing our lives. From smart homes to health care, from industrial automation to environmental monitoring, sensors are used everywhere, making our world more convenient and safe with their efficiency, precision and intelligence. The smart home revolution The smart home is one of the most intui ...
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Murata introduces a communication module that supports LoRaWAN+ Satellite Communications (S-Band)

2024-06 Connectors Murata
[Jun 25 2024] Murata Production Co., Ltd. has developed the "Type 2GT", Murata's first communication module that supports both LoRaWAN and satellite communications. It can be used for various IoT devices such as smart agriculture, environmental sensing, and smart homes. In recent years, 5G, IoT and other communication infrastructure continue to develop, as communication satellites become more and more miniatur ...