Technology Articles

2024-06 Passive Components ams

[Jun 21 2024] Ams OSRAM and Pioneer 3D, the world's leading technology innovator in the field of 3D vision, today announced that Pioneer 3D's Einstar universal handheld 3D scanner uses the AMS OSRAM OSLON® Black series of small high-power infrared leds to provide high efficiency, low energy consumption and highly reliable auxiliary lighting for handheld scanners. The SFH 4726AS infrared LED is small in size an ...

2024-06 Power Adafruit Industries

[Jun 20 2024] An interface chip is an integrated circuit chip used to connect data transmission and communication between different devices or systems. In portable energy storage devices, I/O interface chips play a crucial role, they can realize the data transmission and communication between devices, and provide devices with rich functions and flexible scalability. Interface chips are widely used in portable ...

2024-06 Sensors Texas Instruments

[Jun 20 2024] With the continuous progress of science and technology, remote temperature and humidity sensors have become an indispensable tool in modern management. Whether in industry, agriculture, warehousing and logistics, or in the home environment, the application of temperature and humidity sensors is everywhere. These sensors can not only monitor the temperature and humidity in the environment in real ...

2024-06 Connectors Infineon Technologies

[Jun 20 2024] Infineon Technologies AG is expanding its next-generation OptiMOS™ 7 MOSFETs portfolio for automotive applications, adding devices in robust, lead-free packages to the 40 V portfolio and introducing OptiMOS™ 7 MOSFEts in 80 V and 100 V models. These MOSFETs are optimized for standard and future 48 V automotive applications, including electric power steering, braking systems, power switches in new ...

2024-06 Power Texas Instruments

[Jun 19 2024] Texas Instruments (TI) has introduced an advanced 650V three-phase GaN IPM for 250W motor driver applications. The new GaN IPM addresses many of the design and performance tradeoffs that engineers typically face when designing large home appliances and heating, ventilation and air conditioning (HVAC) systems. The DRV7308 GaN IPM achieves more than 99% inverter efficiency, optimizes acoustic perfo ...

2024-06 Connectors Intel

[Jun 19 2024] Globally, the high price of electric vehicles remains one of the biggest barriers to potential buyers placing orders. The main reason why electric vehicles are currently more expensive to manufacture than conventional fuel vehicles is the high cost of advanced battery and motor technology. The most recent solution on the market is to improve the efficiency of existing battery technology through v ...

2024-06 Sensors Vishay

[Jun 19 2024] Vishay Intertechnology, Inc. announced the introduction of the IHLE-4040DEw-5A, the second generation of a new automotive device in a 10 mm x 10 mm 4040 package, expanding the IHLE family of ultra-thin, high-current integrated field shield inductors. Compared to previous generation solutions, the Vishay Dale IHLE-4040DDEW-5A offers an improved shield design, with polarity marking for improved EMI ...

2024-06 Semiconductors ON Semiconductor

[Jun 19 2024] As a leading global Semiconductor supplier, ON Semiconductor is committed to providing innovative, efficient and reliable image sensor solutions to meet the needs of a wide variety of markets. When it comes to creating differentiated and efficient vision systems, ON's image sensors offer several outstanding features and advantages. First, On's image sensors excel at high dynamic range (HDR). High ...

2024-06 Power Cantherm

[Jun 18 2024] Cambridge GaN Devices (CGD), a fabless semiconductor company, has developed a range of energy-efficient gallium nitride (GaN) power devices in a bid to make electronics more environmentally friendly. CGD today introduced the ultra-low on-resistance (RDS(on)) ICeGaN™ GaN Power IC with a novel chip and package design, bringing the benefits of GaN to high-power applications such as data centers, inv ...

2024-06 Passive Components Melexis Technologies NV

[Jun 18 2024] Melexis, as a leader in the field of automotive dynamic lighting LED driver chips, announced the official launch of a new product MLX81123, further expanding the LIN RGB series product line. This chip is deeply optimized on the basis of the previous product, the package design is more compact, significantly improve the cost efficiency, while maintaining stable and reliable excellent performance. ...

2024-06 Passive Components Nexperia

[Jun 17 2024] Nexperia announced that its best-in-class 650 V, 10 A silicon carbide (SiC) Schottky diode is now automotive compliant (PSC1065H-Q) and in a true two-pin (R2P) DPAK (TO-252-2) package for a variety of applications in electric vehicles and other vehicles. In addition, TO further expand its SiC diode portfolio, Nexperia now offers industrial-grade devices rated at 6 A, 16 A and 20 A in TO-220-2, TO ...

2024-06 Power NXP

[Jun 17 2024] NXP Semiconductors has announced a partnership with ZF Friedrichshafen AG, a leader in electric vehicles, for the next generation of SiC based traction inverter solutions for electric vehicles (EV). The solution uses NXP's advanced GD316x High voltage (HV) isolated gate drivers designed to accelerate the adoption of 800V and SiC power devices. The GD316x product family enables safe, efficient and ...