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Technology Articles

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The smallest 3D image sensor from Infineon

2020-07 Sensors Infineon Technologies
[Jul 4 2020] 3D depth sensors, which enable reliable face recognition, improved photo capabilities and realistic augmented reality experiences, play a key role in smartphones and applications that rely on accurate 3D image data. Infineon Technologies AG and pmdtechnologies AG, which specializes in software and 3D time-of-flight systems, have developed the world's smallest and most powerful 3D image sensor, th ...
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Spectral ALS sensors to enhance the performance of the next generation of high-end smartphone cameras

2020-07 Sensors ams
[Jul 4 2020] Ams has introduced the AS7350, the most advanced spectral ambient light sensor (ALS) on the market for high-end mobile phone cameras. The new sensor is capable of delivering high quality images, even in cases of extreme color contrast, or in non-ideal/mixed light source conditions, enabling professional grade photography with consumer devices. The AS7350 achieves this for the first time by enabli ...
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NXP uses the S32G Vehicle network processor to unlock the full potential of vehicle data

2020-07 Semiconductors NXP
[Jul 3 2020] NXP Semiconductors announced the launch of the new S32G vehicle network processor. This processor marks a major turning point in the design and implementation of vehicle architecture. As the latest in NXP's S32 processor family, the S32G processor helps the automotive industry shift to high-performance, domain-based vehicle architectures, as well as reduce software complexity and improve encrypti ...
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Velodyne introduced its smallest sensor, the Velabit

2020-07 Sensors Verivolt LLC
[Jul 3 2020] At CES 2020, Velodyne Lida introduced Velodyne's smallest sensor, Velabit™, which brings a whole new level of versatility and affordability to 3D LiDAR perception. Velabit takes advantage of Velodyne's innovative liDAR technology and manufacturing partnerships for cost optimization and high volume production. The sensor advances Velodyne's mission to make high-quality 3D liDAR sensors readily ava ...
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Osram launches 12 new products in the Ostar Projection Power series

2020-07 Optoelectronics OSRAM Opto Semiconductors Inc.
[Jul 2 2020] With the release of 12 new products in the Ostar Projection Power family, OSram is the first to successfully exceed the 3,000 ANSI lumens mark for projectors using leds rather than traditional bulbs, further expanding the market for its LED light source projectors. Projectors are becoming more and more popular in home entertainment systems, and users have higher expectations for projector product ...
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CEVA supports Bluetooth Low Energy audio to accelerate product development of truly wireless stereo earbuds

2020-07 Power CEL
[Jul 2 2020] CEVA, the world's leading licensed manufacturer of wireless connectivity and smart devices, announced that with the general release of RivieraWaves Bluetooth Low Energy and dual-mode IP supporting low power Audio (LE Audio), the company has enhanced its offerings for developers of true wireless stereo (TWS) earbuds and other wireless audio devices. Low Power Audio is the next generation of Blueto ...
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The STM32 system chip presented by ST accelerates the development of LoRa IoT smart devices

2020-07 Semiconductors STMicroelectronics
[Jul 1 2020] Promoting a sustainable world through smart infrastructure and logistics, smart industry and smart living, STMicroelectronics, the world's leading semiconductor supplier across multiple electronic applications, demonstrated the world's first LoRa system-on-a-chip (SoC) to connect smart devices to the Internet of Things (IoT) through long-range wireless technology. The STM32WLE5 system chip enable ...
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TDK introduces a range of fault-tolerant motion sensing products for industrial applications

2020-07 Sensors TDK
[Jul 1 2020] TDK has introduced a new family of high-performance and fault-tolerant InvenSense Inertial Measurement Units (IMU) for industrial applications. The new IIM-46234 and IIM-46230 include multiple 6-axis sensors, each of which can measure three-dimensional linear acceleration and three-dimensional rotational angular velocity. The IIM-4623X product family has the ability to make accurate measurements ...
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TDK introduces a new MEMS-based ToF sensor with expanded sensing range

2020-06 Sensors TDK
[Jun 30 2020] TDK announced that it now has the option to select original equipment manufacturers (Oems) for its Chirp CH-201 MEMs-based ultrasonic time-of-flight (ToF) sensor with expanded sensing range. The ToF sensor uses a tiny ultrasonic transducer chip to emit ultrasonic pulses and then listens for the echoes returned from a target located in the sensor's field of view. By calculating distance based on u ...
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Artesyn Embedded Power introduces high efficiency 1300W 1/4 brick power converter

2020-06 Semiconductors Artesyn Embedded Technologies
[Jun 30 2020] Artesyn Embedded Power, a division of Advanced Energy, announced the introduction of a new 1300W 1/4 brick DC/DC power converter, model number BDQ1300, featuring the most efficient on-board 12V output for telecommunications, computing and server devices. There are also digital controls available. The BDQ1300 power converter has a rated efficiency of more than 97% and provides power for non-isolat ...
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XP Power introduces high-voltage DC-DC power modules for scientific research and semiconductor applications

2020-06 Power XP Power
[Jun 29 2020] XP Power has officially announced a new 30W DC-DC power module that can produce up to 6kVDC from a single 24VDC input. The HRL30 series provides a precise high-voltage output for a wide range of applications, including scientific research and semiconductor applications. The series has a total of 22 voltage modules to choose from, with fully controllable outputs from 0-200VDC to 0-6KVDC in both po ...
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Silicon Labs introduces a new Bluetooth system-on-chip (SoC) solution

2020-06 Semiconductors Silicon Labs
[Jun 29 2020] Silicon Labs announced the launch of a new Bluetooth system-on-chip (SoC) solution that combines market-leading security, wireless performance, energy efficiency, software tools and protocol stacks to meet the market demand for high-volume, battery-powered iot products. Its EFR32BG22 (BG22) SoC extends Silicon Labs' existing secure, ultra-low-power Wireless Gecko Series 2 platform and provides de ...