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C&K introduces its new RTF ultra-thin rotary DIP switch
2020-05
Power
C&K
[May 26 2020] C&K, a leading manufacturer of high-reliability electromechanical switches, announced the launch of its new RTF ultra-thin rotary dip switch, the latest addition to the C&K dip switch product family. The new RTF is the smallest package size for coded dip switches on the market for industrial, consumer and medical devices. The RTF is the latest product innovation and demonstrates C&K's firm direct ...

DeepRoute unveils Sensor Solution to accelerate deployment of sensors for autonomous vehicles
2020-05
Sensors
Dave Embedded Systems
[May 25 2020] L4 autonomous driving solutions provider DeepRoute has released DeeProute-Sense, a sensing solution designed to enable the autonomous vehicle industry to deploy sensors faster, further driving and facilitating the development of the entire industry. The solution includes a sleek, lightweight roof box and advanced sensor fusion calibration services. The roof box consists of eight on-board cameras, ...

Analog Devices introduces new wideband RF transceivers to simplify system design and reduce costs
2020-05
Sensors
Analog Devices
[May 24 2020] Analog Devices introduces a new broadband transceiver that is part of the RadioVerse design and technology ecosystem. The ADRV9026 is designed to support base station applications, including single and multi-standard 3G/4G/5G macro cell base stations, Massive MIMO (M-MIMO) and small cell systems. The ADRV9026 is ADI's fourth-generation broadband RF transceiver for four-channel integration with lo ...

STMicroelectronics Time of Flight module shipments cross the 1 billion mark
2020-05
Power
STMicroelectronics
[May 23 2020] STMicroelectronics' ToF sensors are manufactured using its single photon avalanche Diode (SPAD) sensor technology at ST's 300mm pre-process fab in Crolles, France. The final module integrates the SPAD sensor and vertical cavity surface emitting laser (VCSEL), as well as the necessary optical components to improve product performance, and is packaged and tested in ST's advanced in-house post-proce ...

TDK introduces a new line-up of ultra-thin PiezoListen speakers
2020-05
Passive Components
TDK
[May 22 2020] TDK Corporation has expanded its product lineup of ultra-thin PiezoListen speakers with the introduction of a new loudspeaker that enables a wider dynamic range and higher sound pressure level (SPL) even at low voltage of 24VP-P or lower. The PiezoListen series of piezoelectric speakers now includes PHUA6630* wide dynamic range speakers that operate in the frequency range of 400 Hz to 20 kHz. The ...

Littelfuse introduces the BMZF Series battery mounted ZCASE fuse holder
2020-05
Power
Littelfuse
[May 21 2020] Littelfuse brings the BMZF Series battery holder ZCASE fuse holder to the commercial vehicle product line. The BMZF series battery-mounted fuse holder allows high current fuses to be mounted directly to the tethered battery terminals without additional installation hardware and is designed to meet the stringent requirements of commercial vehicle applications. The compact design of the BMZF saves ...

C&K introduces its new push switch with light
2020-05
Power
C&K
[May 20 2020] C&K, a leading manufacturer of high-reliability electromechanical switches, has announced the launch of its new push switch with light, the KLS series LED SPDT/DPDT push switch. With positive haptic feedback and a wide selection of LED light colors, the KLS series is ideal for the latest vending machine, network equipment, self-service terminals or professional audio/video equipment designs. The ...

STMicroelectronics introduces the industry's first 4Mbit EEPROM memory chip
2020-05
Power
STMicroelectronics
[May 19 2020] STMicroelectronics, the world's leading semiconductor supplier across multiple electronic applications, has introduced a new generation of memory chips that combine unprecedented storage capacity with read and write speed and reliability, enabling us to do more with the devices we use every day to enrich our lives and work. STMicroelectronics' new memory capacity of 4Mbit EEPROM allows small devi ...

Vishay introduces AC and pulse film capacitors for electric vehicles
2020-05
Passive Components
Vishay
[May 18 2020] Vishay Intertechnology has announced the launch of a new range of automotive grade AC and pulse metallized polypropylene film capacitors, the MKP385e, for hybrid and electric vehicles. The Vishay BCcomponents MKP385e series has a maximum operating temperature of +125 C (voltage derating observation), complies with IEC 60384-17 and AEC-Q200 standards (D version), and tests temperature, humidity an ...

Qorvo introduces a new power application controller
2020-05
Connectors
Qorvo US Inc.
[May 17 2020] Qorvo announced the launch of the most powerful MCU and integrated motor control and drive control product on the market, the new PAC5527 power Application controller. Qorvo's system-on-a-chip (SoC) controller delivers high efficiency, high performance and long battery life with brushless direct current (BLDC) motor powered tools. David Briggs, Product Director of Power Management and Motor Drive ...

TriLumina introduces a 3 W surface-mount flip chip backlaunch VCSEL array without a pedestal
2020-05
Sensors
Tri-Mag, LLC
[May 16 2020] TriLumina, a leading developer of flip-chip vertical cavity surface-emitting laser (VCSEL) technology for 3D sensing applications, has announced the world's first 3W surface-mount flip-chip back-emitting VCSEL array, which eliminates the need to move package bases or bonding wires for 3D sensing cameras. Compared to traditional VCsels for 3D sensing, this new on-board VCSEL(VoB) technology enable ...

TE introduces the new zSFP+ stacked Belly-to-Belly connector
2020-05
Connectors
TE Connectivity
[May 15 2020] TE Connectivity, the global leader in innovative connectivity solutions for high-speed computing and networking applications, announced the introduction of the new zSFP+ stacked belly-to-belly connector, supporting data rates up to 28 Gbps NRZ and 56 Gbps PAM-4. Top unlock is a key feature of the zSFP+ family, enabling four-row belly-to-belly applications, increasing panel interface density and m ...