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New symmetrical dual-channel MosFEts from Vishay
2023-01
Semiconductors
Vishay
[Jan 30 2023] Vishay Intertechnology has announced the launch of two new 30 V symmetrical dual-channel N-channel power MosFETs --SiZF5300DT and SiZF5302DT. Combination of high-edge and low-edge TrenchFET Gen V MOSFET in a 3.3mm x 3.3mm PowerPAIR 3x3FS monomer package. Vishay Siliconix SiZF5300DT and SiZF5302DT are suitable for power conversion in computing and communication applications, reducing component cou ...
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Infineon launches the megawatt T-type three-electric flat bridge arm module based on TRENCHSTOP IGBT7 PrimePACK
2023-01
Semiconductors
Infineon Technologies
[Jan 30 2023] The new PrimePACK 2300V IGBT module was developed primarily for 1500V inverters. It is characterized by good DC stability under 1500V working voltage, that is, high robustness under cosmic radiation, and overload junction temperature of 175℃ can support failure modes such as LVRT. In addition, the module achieves higher power density compared to the IGBT4 solution, resulting in cost performance a ...
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Littelfuse introduces the minimum IP67 touch switch
2023-01
Semiconductors
Littelfuse
[Jan 30 2023] Littelfuse Corporation has announced the launch of its new C&K Switches NanoT product line, which consists of micro, surface-mounted, extremely small, waterproof tap switches. Smart wearables, health monitoring devices and other battery-powered iot devices are driving demand for higher density active component integration, seamless circular screens and additional features in ever-smaller Spaces. ...
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Laird Connectivity FlexPIFA 2-dBi and 3-dBi antennas for Wi-Fi and Bluetooth applications
2023-01
Semiconductors
Laird Technologies
[Jan 29 2023] Laird Connectivity FlexPIFA 2-dBi and FlexPIFA 3-dBi antennas equipped with MHF1/U.FL cable. The industry-leading flexible planar inverted F antenna (PIFA) is designed for Wi-Fi or Bluetooth applications and can be installed on non-conductive or irregular surfaces even when exposed to humidity. It operates at temperatures ranging from -40°C to +85°C. Laird Connectivity FlexPIFA 2-dBi and 3-dBi an ...
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Vishay offers aluminum capacitors in compact packages with high volume/high voltage combination screw connectors
2023-01
Semiconductors
Vishay
[Jan 29 2023] Vishay Intertechnology has announced the launch of a new series of screwjoint aluminum electrolytic capacitors, 202 PML-ST, which allows designers to store higher energy in smaller Spaces. Available in 11 small package dimensions from 35 mm x 60 mm to 90 mm x 220 mm, Vishay BCcomponents 202 PML-ST series capacitors offer higher capacitance/voltage (CV) values than previous solutions and up to 49. ...
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Wurth Electronics launches new generation isolation power module SIP/SMT module
2023-01
Semiconductors
Wurth Electronics
[Jan 29 2023] Wurth Electronics has introduced a new generation of 1 W "Fixed Output Voltage Isolation SIP/SMT module", adding a brand new product to the MagI³C FISM family of power modules. The series improves on the integrated voltage converter and features continuous short circuit protection (SCP) and higher isolation voltage. The nine new modules come in standard SIP-4, SIP-7 and SMT-8 packages that are co ...
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TDK TFM-BLE thin-film power circuit inductor: small and thin to achieve high current and low loss
2023-01
Optoelectronics
TDK
[Jan 29 2023] TDK has developed a new TFM-BLE series of thin-film power circuit inductors. TDK has incorporated thin-film technology developed in the head business into the manufacturing of this series of inductors. Using TDK's characteristic conductor formation technology, magnetic metal materials with high saturation flux density are used as the core material to meet the DC bias characteristics required by i ...
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Abracon introduces 10ppb thermostatic crystal oscillator for precise and punctual applications
2023-01
Sensors
Abracon
[Jan 29 2023] Abracon Surface Mount (SMD) isothermal Crystal oscillator (OCXO) product line is continuously enriched, with the launch of AOC2012/AOC1409 and AOC2522A/ AOC2522B series OCXOs. These OCXO products are integrated with quartz crystal resonators of SC cut and high Q value, combined with precise temperature monitoring and control circuit design, so that the product series can meet the Stratum 3 and 3E ...
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Infineon introduces the new 2 x 37 W audio amplifier family using the second generation MERUS multilevel switching technology
2023-01
Semiconductors
Infineon Technologies
[Jan 29 2023] When designing battery-powered portable audio devices for consumer speaker applications, the need to maximize battery life and provide excellent sound quality while achieving a compact exterior design and reducing system costs is critical. Infineon Technologies Inc. 's MERUS™ multilevel switching technology, designed to reduce switching losses and achieve efficient audio amplification at both low ...
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Infineon introduces the XMC7000 series microcontroller for industrial applications
2023-01
Semiconductors
Infineon Technologies
[Jan 28 2023] Infineon Technologies has introduced the XMC7000 Series microcontroller (MCU) for industrial drive, electric vehicle (EV) charging, electric two-wheelers, robotics and other advanced industrial applications. The XMC7000 family of microcontrollers includes single-core and dual-core products based on 32-bit Arm Cortex-M7 processors with a dominant frequency of up to 350-MHz, as well as 32-bit Arm C ...
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Infineon introduces the industry's first PFC and hybrid flyback IC
2023-01
Semiconductors
Infineon Technologies
[Jan 28 2023] USB power supply (USB-PD) has become the mainstream standard for fast charging and powering a wide range of mobile and battery-powered devices using a unified Type-C connector. In the newly released USB-PD rev 3.1 standard, the Extended Power Range (EPR) specification supports a wide output voltage range and high power transmission. Unification and high power capacity combined with low system cos ...
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Diodes brings out its latest PCIe 3.0 packet switcher
2023-01
Semiconductors
Diodes Incorporated
[Jan 28 2023] DIODES will launch its latest PCIe 3.0 packet switcher-Diodes PI7C9X3G1224GP. The product is an efficient 12-port, 24-channel device that can be used in edge computing, data storage devices, communication infrastructure, and integrated into host bus adapters (Hbas), industrial controllers, and network routers.PI7C9X3G1224GP comes in 324 pin flip-chip BGA package format. The forwarding delay of PI ...