Technology Articles

2024-11 Semiconductors Toshiba Semiconductor and Storage

[Nov 18 2024] Toshiba Electronic Components & Storage Corporation has announced the development of a new bare chip1200 V silicon carbide (SiC) MOSFET "X5M007E120" for in-vehicle traction inverters , whose innovative structure enables low on-resistance and high reliability. X5M007E120 Test samples are now available for customer evaluation. When the body diode of a typical SiC MOSFETs is bipolar energized during ...

2024-11 Semiconductors Microchip Technology

[Nov 18 2024] To help developers build artificial intelligence (AI) -driven sensor processing systems, Microchip Technology has released the PolarFire FPGA Ethernet sensor Bridge that supports NVIDIA's Holoscan sensor processing platform. The PolarFire FPGA supports multiple protocols and is an integral part of Microchip's platform and is the first solution compatible with MIPI® CSI-2® based sensors and MIPI D ...

2024-11 Power Microchip Technology

[Nov 15 2024] To meet the growing demand for higher efficiency, smaller size and higher performance in power electronic systems, power components are constantly evolving. To provide system designers with a broad range of power solutions, Microchip Technology announced the IGBT 7 device portfolio in different packages, supporting multiple topologies, and current and voltage ranges. With higher power capacity, l ...

2024-11 Semiconductors Renesas Electronics America

[Nov 15 2024] Renesas Electronics, a global semiconductor solutions provider, announced the launch of a new generation of automotive multi-domain integrated system-on-chip (SoC), the R-Car X5 series, which enables a single chip to simultaneously support multiple automotive functional domains, including advanced driver assistance systems (ADAS), in-vehicle infotainment systems (IVI), and gateway applications. T ...

2024-11 Semiconductors 3M (TC)

[Nov 15 2024] Nordic Semiconductor, a global leader in low-power wireless connectivity solutions, today launched the nRF54L series of wireless SoC products, including the previously announced nRF54L15™, and the new nRF54L10™ and nRF54L05™ models. This cutting-edge series sets a new industry standard with enhanced efficiency, exceptional processing power, and diverse design options, meeting the growing demands ...

2024-11 Semiconductors STMicroelectronics

[Nov 15 2024] What Is TDA2004R? - The TDA2004R is a versatile Class B dual audio power amplifier. - The TDA2004R is housed in the Multiwatt11 package for automotive audio applications. - It is an excellent choice for boosting audio power in car sound systems. - The TDA2004R can deliver compact, efficient designs with minimal external components. - It does not require electrical insulation between the package a ...

2024-11 Semiconductors Toshiba Semiconductor and Storage

[Nov 13 2024] Toshiba Electronic Components & Storage Corporation has announced the development of a new bare-chip 1200 V silicon carbide (SiC) MOSFET "X5M007E120" for in-vehicle traction inverters with an innovative structure that enables low on-resistance and high reliability. X5M007E120 Test samples are now available for customer evaluation. When the body diode of a typical SiC MOSFETs is energized at the b ...

2024-11 Connectors STMicroelectronics

[Nov 13 2024] STMicroelectronics' STGAP3S series of silicon carbide (SiC) and IGBT power switching gate drivers incorporate ST's latest robust electrical isolation technology, optimized desaturation protection and flexible Miller clamp architecture. STGAP3S uses enhanced capacitance isolation between the gate drive channel and the low-voltage control and interface circuit, with a transient isolation voltage (V ...

2024-11 Semiconductors Samsung

[Nov 12 2024] The adoption of 5G technology promises to revolutionize vehicle safety and efficiency by integrating internal and external antennas for high-speed, low-latency, and reliable communication with 5G networks. This communication will enable applications like advanced driver assistance systems (ADAS), real-time traffic updates, remote diagnostics, and seamless entertainment. As 5G infrastructure grows ...

2024-11 Power Flex Power Modules

[Nov 12 2024] Flex Power Modules announced the introduction of the BMR316, a high-performance non-isolated, non-regulated DC/DC Intermediate Bus Converter (IBC), tailored for AI and milliliter data center applications that require significant computing power. The compact bmr316 is the best choice for high-power ibc applications where board space is limited. The bmr316 has a fixed 4:1 conversion rate, effective ...

2024-11 Power Nexperia

[Nov 12 2024] Nexperia has announced a strategic partnership with renowned automotive supplier KOSTAL to facilitate the production of wide-band gap (WBG) devices that meet stringent specifications for automotive applications. Under the terms of the partnership, Amperi will supply, develop and manufacture WBG power electronics, which will be designed and tested by Kostal. The partnership will primarily focus on ...

2024-11 Semiconductors Nuvoton Technology

[Nov 12 2024] Navitas Semiconductor has introduced the world's first 8.5 kW power unit (PSU) for next-generation artificial intelligence and hyperscale data centers. The PSU is powered by GaN and SiC technologies and achieves 98% efficiency. The 54V output power module is optimized by artificial intelligence to comply with the OCP (Open Compute Project) and ORv3 (Open Rack v3) specifications. Equipped with hig ...