Technology Articles

2020-12 Passive Components Transphorm

[Dec 17 2020] Transphorm, a pioneer in the development and manufacture of highly reliable, high-performance gallium nitride (GaN) power semiconductors, has announced that the company's second 900 V GaN field-effect transistor (FET) is now in production. The TP90H050WS has a typical on-resistance of 50 milliohm and a transient peak rating of 1 kV and is now certified by the Joint Commission on Electronic Equipm ...

2020-12 Connectors Broadcom

[Dec 17 2020] Boardcon has announced the EM-HI3559V200, a single-board computer based on the HiSilicon Hi3559 V200, which is equipped with a HiSilicon Hi3559 V200 SoC and supports 4K Ultra HD mobile cameras, a system specifically designed for dashcams. Action camera and rearview camera solutions. The Hi3559V200 platform includes a dual-core Cortex-A7 CPU, provides a Linux + Huawei Lite OS dual-system solution, ...

2020-12 Power Heatron Inc.

[Dec 17 2020] Hexagon's Manufacturing Intelligence division has introduced the RS-SQUARED area scanner for absolute arms, pairing the area scanner with a portable measuring arm for the first time. RS-SQUARED is designed for high-speed scanning of simple shapes and surfaces, measuring parts much faster than traditional laser scanners or even other structured optical scanners. By combining the flexibility of a p ...

2020-12 Passive Components Molex

[Dec 16 2020] Telecommunications and data center enterprises face increasing bandwidth demands and therefore require high-density interconnections. To meet these needs, Molex continues to develop a variety of innovative connectivity solutions. One of these solutions is the NearStack High-speed Cable Assembly Solution. High-speed, high-density applications are abandoning traditional board designs to allow for l ...

2020-12 Connectors Renesas Electronics America

[Dec 16 2020] Renesas Electronics announced the introduction of two new 42V bisynchronous controllers with a minimum static current of 6µA and integrated 2A pull current /3A feed current MOSFETs to provide primary power level solutions for Renesas R-Car H3 and R-Car M3 SOCs. The ISL78264 dual synchronous step-down controller manages the intermediate first stage DC/DC conversion, step-down the 12V battery syste ...

2020-12 Passive Components Vishay

[Dec 16 2020] Vishay Intertechnology announced the debut of the -30 V p channel power MOSFET-SIRA99DP, with on-resistance down to 1.7m at 10 V. The Vishay Siliconix TrenchFET 4th generation SiRA99DP has the lowest on-resistance in the industry and comes in a thermally-enhanced 6.15mm x 5.15mm PowerPAK SO 8 monocoque package specifically designed for increased power density. This MOSFET is RG and UIS tested, Ro ...

2020-12 Semiconductors Maxim Integrated

[Dec 15 2020] Maxim Integrated announced the DS28E18 1-Wire to I2C/SPI bridge chip for extending remote sensor network connectivity, helping designers reduce system design complexity and cost to the lowest level in the industry. Using Maxim Integrated's 1-Wire protocol to connect the I2C and SPI-compatible sensors, the DS28E18 requires only two wires to connect the device, while competing solutions require fou ...

2020-12 Semiconductors Maxim Integrated

[Dec 15 2020] Maxim Integrated announced the launch of the MAX77958 USB-C PD Controller and the MAX77962 28W liter/Buck charger to help designers overcome USB-C Power transfer (PD) design challenges. As new technologies such as 5G wireless communication and 4K video continue to be added to portable devices, many devices are shifting from single-battery powered architectures to dual-battery (2S) powered archite ...

2020-12 Sensors Sensata Technologies

[Dec 15 2020] Sensata Technologies, a sensor solutions provider, announced the launch of two new rotary Hall effect sensors with IO-link: the ACW4 single-turn and TCW4 multi-turn modular Rotary Hall Effect sensors. IO-link integration standardizes the output of sensors so they can communicate in any IO-Link-enabled fieldbus network, simplifying installation and replacement. New interface capabilities allow sen ...

2020-12 Semiconductors Dialog Semiconductor GmbH

[Dec 14 2020] Dialog Semiconductor announced that EcoXiP™ octal xSPI non-volatile memory (NVM), an addition to its Adesto Technologies acquisition, has been optimized for use with Renesas' Arm® based RZ/A2M microprocessors (MPUs). RZ/A2M is designed for embedded AI high-speed image processing in smart home appliances, service robots, industrial machines and other applications, and EcoXiP, the lowest power cons ...

2020-12 Sensors CUI

[Dec 14 2020] Crocus Technology, a leading supplier of TMR sensors, has announced the launch of the two-dimensional (2D) Angle sensor CT310, the next generation successor to the CT300 released in 2018. Its low noise performance enables high resolution measurements. The CT310 was developed using Crocus' patented XtremeSense TMR 2D technology, which delivers high performance, ultra-low Angle error and excellent ...

2020-12 Passive Components KEMET

[Dec 14 2020] KEMET continues to develop and design solutions for alternative energy, industrial/lighting, medical, defense and aerospace, and telecommunications applications with its new tantalum Stacked polymer (TSP) O 7360-43 and 82μF/75V rated voltage expansion capacitor family in polymer gas-tight packaging. The TSP series features an innovative stacked construction designed to provide the highest capacit ...