Technology Articles

2020-08 Semiconductors STMicroelectronics

[Aug 28 2020] STMicroelectronics, a leading global semiconductor company, announced the introduction of the new FDA901 Class D audio amplifier integrated circuit, whose semiconductor design incorporates Alps Alpine Co., a major Japanese manufacturer of automotive audio equipment. Ltd.) world-class audio design expertise, and infocomm equipment. The goal of the new chip is to create a versatile, high-fidelity c ...

2020-08 Optoelectronics ams

[Aug 28 2020] Ams has announced the introduction of a new (IR) laser floodlight module, the Merano Hybrid, which is an ultra-compact package and integrates all the optoelectronic components of the (IR) laser floodlight and the VCSEL Driver of the vertical cavity surface emitting laser. Oems (original equipment Manufacturers) use this module to make it easier to implement popular 3D features. This is the latest ...

2020-08 Passive Components Murata

[Aug 27 2020] Murata ATSC Automotive high temperature silicon capacitors are targeted at under-hood electronic devices and sensors in harsh conditions in the automotive market sector. Deep grooved MOS capacitors, combined with a unique Mosaic structure and distributed grooved capacitors, achieve excellent electrical performance. Murata ATSC Automotive high temperature silicon capacitors are targeted at under-h ...

2020-08 Power SiTIME

[Aug 27 2020] SiTime, the market leader in MEMS silicon clock system solutions, has announced a 48-hour lead time for its MEMS oscillators, helping customers speed up design and reduce development efforts to generate revenue faster.Previously, customers had to wait up to 20 weeks and sometimes pay a one-time engineering fee (NRE) to get an oscillator configured to their specific requirements. SiTime's programm ...

2020-08 Semiconductors FTDI, Future Technology Devices International Ltd

[Aug 26 2020] Always at the forefront of embedded connectivity innovation, FTDI announces its latest series of multi-channel USB interface ics. As more and more hardware begins to use next-generation power protocols, this family of ics has the capability to handle these needs. The new high-speed (480Mbits/s) device is available in 2-channel (FT2233HP) and 4-channel (FT4233HP) versions with serial UART (RS232, ...

2020-08 Power CH Products

[Aug 26 2020] CISSOID announced its continued commitment to address the challenges of the automotive and industrial markets with the launch of a three-phase Silicon Carbide (SiC) MOSFET Smart Power Module (IPM) platform for electric vehicles. This new smart power module technology provides an all-in-one solution that integrates a three-phase water-cooled silicon carbide MOSFET module with a built-in gate drive ...

2020-08 Connectors Maxim Integrated

[Aug 25 2020] Maxim Integrated Products announced the launch of the MAX32520 ChipDNATM Secure Arm® Cortex-M4 microcontroller, which physically eliminates cloning (PUF) and is the industry's first secure microcontroller for financial and government applications. Maxim's PUF technology offers multiple layers of protection and is the industry's most advanced, high-performing key protection solution for IoT, healt ...

2020-08 Power SunLED

[Aug 25 2020] Super Micro Computer will launch the market's first outdoor edge system for 5G RAN, AI inference, and intelligent edge applications with IP65 protection level servers. The product will be powered by Intel Xeon D processors and second-generation Intel Xeon scalable processors, offering a variety of configuration options. The new system is suitable for harsh outdoor environments and supports the in ...

2020-08 Power Power Integrations

[Aug 24 2020] Power Integrations, an innovator in gate driver technology for medium and high voltage inverter applications, introduces the 1SP0351 SCALE-2™ single-channel +15/-10V plug and play gate driver, The new product was developed specifically for the new 4500V crimped IGBT (PPI) modules from manufacturers such as Toshiba, Westcode and ABB. The new gate driver is based on the widely used SCALE 2 chipset ...

2020-08 Sensors Allegro MicroSystems, LLC

[Aug 24 2020] Allegro MicroSystems has announced the introduction of the world's first freestanding, Hall coreless current sensor, the ACS37612, which measures PCB or busbar currents above 200A to 1000A with 1% accuracy, without the need for a collector core or shield. Allegro's differential Hall components for measuring magnetic fields offer strong resistance to stray field interference, but do not require th ...

2020-08 Connectors Qorvo US Inc.

[Aug 23 2020] Qorvo introduces the world's highest performing broadband power amplifier (PA), the TGA2962. Designed specifically for communication and test instrumentation applications, the power amplifier introduced today by Qorvo boasts several performance breakthroughs: It delivers industry-leading 10 watts of RF power in the 2-20 GHz frequency range as well as a large signal gain of 13dB and a power additi ...

2020-08 Power Infineon Technologies

[Aug 23 2020] Infineon Technologies AG has successfully developed solutions that meet the highest efficiency and quality requirements. For MOSFET low-frequency switching applications, the new 600 V CoolMOS™ S7 series delivers leading power density and energy efficiency. Key features of the CoolMOS™ S7 series include optimized conduction performance, improved thermal resistance and high pulse current capability ...