Technology Articles

2020-09 Semiconductors Vishay

[Sep 3 2020] Vishay Intertechnology has announced the launch of a new automotive grade phototransistor coupler, the VOMA618A, in a compact SOP-4 miniature flat package with a current transfer ratio (CTR) of 50% to 600% and a forward current of only 1 mA. The Vishay Semiconductors VOMA618A forward current is 80% lower than the previous generation solution, helping to save energy in automotive and high-reliabil ...

2020-09 Power Nexperia

[Sep 3 2020] Nexperia announced the introduction of the PESD2V8R1BSF, the industry's first ESD protection device developed specifically for the USB4TM standard with industry-leading RF performance. The new device uses Nexperia's TrEOS ESD and active thyristor (SCR) technology, which will be of particular interest to USB4TM and Thunderbolt interface design engineers. The device enables very low capacitance (do ...

2020-09 Connectors Toshiba Semiconductor and Storage

[Sep 2 2020] Toshiba Electronic Components & Storage Corporation announced the launch of the "TLP5231," a pre-drive optocoupler for medium and large current insulated gate bipolar transistors (IGBTs) and MOSFETs for power regulation systems in industrial inverters and photovoltaics (PV). The new pre-driven optocoupler has a variety of built-in features, including overcurrent detection by monitoring the collec ...

2020-09 Semiconductors ON Semiconductor

[Sep 2 2020] ON Semiconductor, which drives energy efficiency innovation, introduces a connected lighting platform that leverage the company's expertise in Power over Ethernet (PoE) and ultra-low power Bluetooth low power connectivity and AC-DC and DC-DC power conversion design. The prototype platform enables the engineering team to explore and innovate in the field of connected lighting, making lighting devi ...

2020-09 Connectors Omron Electronics Inc-EMC Div

[Sep 1 2020] Omron has announced its new MOS FET (metal-oxide-semiconductor field-effect transistor, a type of field-effect transistor) relay module "G3VM-21MT", which will be the world's first electronic component to adopt a "T-circuit structure" (a circuit structure commonly used in electronic devices such as attenuators to minimize leakage current). The T-circuit structure consists of small, long-life soli ...

2020-09 Semiconductors Texas Instruments

[Sep 1 2020] Texas Instruments introduces the industry's first new 40-A SWIFT DC/DC buck converter that can stack up to four integrated circuits (ics). The TPS546D24A PMBus buck converter delivers up to 160A output current at ambient temperatures of 85°C, four times higher than other power ics on the market. Among the many 40A DC/DC converters, the TPS546D24A is more efficient, reducing power consumption by 1 ...

2020-08 Semiconductors Vishay

[Aug 31 2020] Vishay Intertechnology has announced the introduction of A new IHDM automotive side wound through hole inductor, the IHDM-1008BC-3A, rated at up to 150 A for use in engine compartment environments. The Vishay Custom Magnetics IHDM-1008BC-3A uses iron powder core technology for excellent sensing and saturation stability, low power consumption and excellent thermal performance in the harsh operatin ...

2020-08 Power Silicon Labs

[Aug 31 2020] Silicon Labs has unveiled Secure Vault technology, a new suite of advanced security features designed to help connected device manufacturers address the escalating security threats and regulatory pressures of the Internet of Things (IoT). Silicon Labs' Wireless Gecko Series 2 platform takes full advantage of Secure Vault by combining best-in-class security software capabilities with Physically un ...

2020-08 Power Infineon Technologies

[Aug 30 2020] Infineon Technologies AG has partnered with Qualcomm to develop a 3D certified reference design based on the Qualcomm Snapdragon 865 mobile platform, further expanding the range of applications of Infineon's 3D sensor technology in mobile devices. This reference design uses the REAL3TM 3D time-of-flight (ToF) sensor to enable smartphone manufacturers to achieve standardized integration that is co ...

2020-08 Power Power Integrations

[Aug 30 2020] Power Integrations introduces the LinkSwitc-TN2 series of ics for non-isolated offline power supplies that are highly integrated (built-in MOSFETs and controllers) and offer significant performance and space savings over conventional linear or capacitive step-downs. The built-in semiconductor in all devices, in addition to the traditional voltage of 725V, is launched up to 900V MOSFET, making the ...

2020-08 Optoelectronics ams

[Aug 29 2020] Pictures have become an important way for people to express themselves on social media. In pursuit of the "perfect image," more and more apps offer filters or editing capabilities to enhance the image. Despite the proliferation of innovations in smartphone photography, there are still some image effects that can only be achieved with professional cameras and complex and expensive lenses. Osram in ...

2020-08 Passive Components Murata

[Aug 29 2020] Murata BBSC/UBSC/ULSC ultra-wideband SMT silicon capacitors target optical communication systems (ROSA/TOSA, SONET and all optoelectronic components) as well as high-speed data systems or products. These capacitors are designed for DC blocking, coupling, and bypass grounding applications. These silicon capacitors have low insertion loss, low reflection, and high phase stability over a wide freque ...