Technology Articles

2020-09 Power Renesas Electronics America

[Sep 9 2020] Renesas Electronics, a leading global supplier of semiconductor solutions, announced that its RL78/G1H based sub-GHz wireless solution has been certified by the WI-SUN Alliance FAN, one of the key communications standards of the Wi-SUN Alliance. The solution complements Renesas' RX651 microcontroller (MCU) and RAA604S00 wireless transceiver discrete solutions, further expanding the company's Wi-S ...

2020-09 Power CUI

[Sep 9 2020] CEVA, the world's leading licensor of signal processing platforms and artificial intelligence processor IP for smart and connected devices, announced that Ambiq Micro, a leader in ultra-low power solutions, has been licensed. CEVA's RivieraWaves Bluetooth Low Energy IP can be used for its next generation Sub-threshold Power Optimization Technology (SPOT) platform with integrated Bluetooth connect ...

2020-09 Passive Components MEAN WELL

[Sep 8 2020] MACOM Technology Solutions, Inc., a leading provider of semiconductor solutions, announced the launch of two new transresistance amplifiers (TIAs), both optimized for optical networking applications, with coverage ranging from 100Gbps DR1 to 800Gbps DR8 and FR8. The new TIA is now available with flip-chip and lead bonding package options for fast and flexible deployment in QSFP, QSFP-DD and OSFP ...

2020-09 Power FLIR Lepton

[Sep 8 2020] FLIR Systems has announced the launch of a new HD medium-range surveillance System, the FLIR Ranger HDC MR. The Ranger HDC MR Sets new surveillance benchmarks to detect illegal activity even in severe weather conditions, and utilizes embedded analytics and image processing capabilities to reduce cognitive effort, enabling operators to quickly distinguish between real threats and false alarms. The ...

2020-09 Sensors Renesas Electronics America

[Sep 7 2020] Renesas Electronics, the world's leading provider of semiconductor solutions, announced the launch of the next generation broadband millimeter wave synthesizer with industry performance and unique features optimized for 5G and broadband wireless applications. The flagship 8V97003 is ideal for local oscillators (LO) for millimeter wave and beamforming, as well as precise reference clocks for high- ...

2020-09 Power Xilinx

[Sep 7 2020] Xilinx, a global leader in adaptive and intelligent computing, announced the introduction of Versal™ Premium, the third product family in the Versal ACAP portfolio. With a highly integrated, power-optimized network core, the Versal Premium family is the industry's most bandwidth and computation-dense adaptive platform. Versal Premium is designed for running the highest bandwidth networks in therm ...

2020-09 Sensors Bourns

[Sep 6 2020] Bourns has announced the addition of four new models to the Bourns Precision Sensor (BPS) family. Based on the latest microelectromechanical systems (MEMS) technology, the four new BPS310, BPS320, BPS330 and BPS340 families deliver fast response, high resolution and long-term stability, making them the perfect solution for cost-effective pressure sensors. These BPS sensors measure pressure in the ...

2020-09 Semiconductors ON Semiconductor

[Sep 6 2020] ON Semiconductor expands its Wide band Gap (WBG) device family with the introduction of two more silicon carbide (SiC) MOSFETs. These new devices are suitable for a variety of demanding high-growth applications, including solar inverters, electric vehicle (EV) on-board charging, uninterruptible power supplies (UPS), server power supplies, and EV charging stations, providing a level of performance ...

2020-09 Power Power Integrations

[Sep 5 2020] Power Integrations expands its product lineup with the release of the new InnoSwitch™3 Series of constant voltage/constant displacement fly-back switching power supply ics. The new INN3x78C device incorporates a smaller "No. 8" 750 V PowiGaN transistor to create a lightweight, high-efficiency power supply capable of delivering 27 W to 55 W of output power without the need for heat sinks. Like the ...

2020-09 Power Micron Technology Inc.

[Sep 5 2020] Micron Technology announced the beginning of the industry's first Universal Flash Memory (UFS) multi-chip package (uMCP) product that also features low-power DDR5 (LPDDR5) DRAM. This uMCP product provides a high-density, low-power storage solution for thin and compact mid-range smartphone designs. Micron's new uMCP5 package incorporates the company's innovation and cutting-edge technology in mult ...

2020-09 Power NXP

[Sep 4 2020] NXP Semiconductors announced a new automotive digital key solution that enables smartphones, remote keys and other mobile devices to securely store, verify, securely communicate with and share digital keys with the vehicle. The solution expands the reach and convenience of car access by providing the security foundation needed to enable new features such as key sharing, multi-car access and confi ...

2020-09 Power XP Power

[Sep 4 2020] XP Power has officially announced two new families of ultra-wide range input DC-DC converters. Their flexible nature allows devices with incompatible voltages to be easily integrated into industrial systems. The DTJ15 and DTJ20 series are designed for easy installation and operation. They can be mounted on a plate or DIN rail and connected via screw terminals, requiring no additional components t ...