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Renesas Electronics introduces the RX72M microcontroller portfolio for industrial applications
2019-12
Power
Renesas Electronics America Inc.
[Dec 7 2019] Renesas Electronics Corporation announced the launch of the RX Microcontroller (MCU) family of RX72M product groups with built-in EtherCAT® slave station controllers for industrial Ethernet communications. This new flagship product group in the Renesas RX family brings high-performance, single-chip solutions with large memory capacities to industrial devices requiring control and communication fu ...

Qorvo offers front-end solutions for the wireless infrastructure market
2019-12
Power
Qorvo US Inc.
[Dec 6 2019] Qorvo introduces new energy-efficient, small base station front-end solutions for the sub-6 GHz wireless infrastructure market. The product significantly improves efficiency and enables base station manufacturers to enhance their existing 4G LTE infrastructure for higher bandwidth, coverage, throughput and capacity, especially for high-density, high-traffic areas. Strategy Analytics predicts that ...

Vishay introduces the T55 series of vPolyTan surface mount polymer tantalum chip capacitors
2019-12
Passive Components
Vishay
[Dec 5 2019] Vishay Intertechnology announced that it has expanded its T55 series of vPolyTan™ surface-mounted polymer tantalum moulded chip capacitors with the addition of a D-shape (EIA 7343-31) dimension device with a single-digit ESR value reduced from 9 m to 7 m and a 6 m ESR value device under development. The capacitors released today retain the previous larger exterior size, with a single-digit ESR ...

Infineon introduces an ultra-small pressure sensor
2019-12
Sensors
Infineon Technologies
[Dec 4 2019] Infineon Technologies AG introduces a new product, XENSIVTM DPS368. This is a miniaturized digital pressure sensor that measures both temperature and pressure. With an ultra-high accuracy of ±2 cm and low power consumption, this product is ideal for precise measurements of altitude, airflow and body motion, making it ideal for mobile phones and wearables that support motion tracking and navigatio ...

Infineon introduces 3D image sensor solutions for the mobile device market
2019-12
Sensors
Infineon Technologies
[Dec 3 2019] Infineon Technologies AG has developed an excellent 3D image sensor solution for the mobile device market, the REAL3™ IRS2381C. Today, the 3D Time of Flight (ToF) single-chip solution has been named "Product of the Year" in the Sensor category by the Embedded Vision Alliance. The awards recognize innovations and significant achievements in advanced technologies, services and products that drive t ...

Renesas Electronics introduces new radiation-resistant current drivers to reduce the size of satellite systems
2019-12
Connectors
Renesas Electronics America Inc.
[Dec 2 2019] Renesas Electronics has introduced a radiation-resistant 16-channel current driver with an integrated 4-bit decoder for reducing the size, weight and power (SWaP) of satellite command and telemetry systems by up to 50%. The ISL72814SEH integrates decoders, input level converters and an array of 16 current drivers in a single monolithic IC. Multiple ISL72814SEH current drivers are capable of sendi ...

ADI introduces breakthrough solutions that will accelerate the deployment of millimeter wave 5G wireless network infrastructure
2019-12
Power
Analog Devices
[Dec 1 2019] Analog Devices has introduced a new solution for millimeter wave (mmWave) 5G infrastructure with the highest level of integration yet, designed to reduce the design requirements and complexity of next-generation cellular network infrastructure. The solution integrates ADI's advanced beamforming ics, up/down conversion (UDC) and other mixed-signal circuits. This optimized beam-to-bit signal chain ...

Microchip introduces the industry's first terabit Ethernet PHY
2019-11
Connectors
Microchip Technology
[Nov 30 2019] Microchip Technology, through its subsidiary Microsemi, has announced the META-DX1 family of Ethernet PHY devices. This new family integrates 1 GbE to 400 GbE Ethernet interfaces, FlexE, MACsec link encryption, and nanosecond precision timestamps in a single chip with terabit capacity, enabling the first convergence of routing and switching capabilities. Currently, the industry is upgrading from ...

OmniVision introduces a new 5 megapixel RGB-IR image sensor
2019-11
Power
OmniVision Technologies Inc
[Nov 29 2019] OmniVision Technologies has announced the OV5678, the industry's first 5-megapixel RGB-Ir image sensor for 2-in-1 laptops. The sensor has higher facial recognition authentication accuracy using a single camera and can be used for infrared (IR) Windows Hello as well as high-quality color (RGB) images for selfies and video conferencing. By combining infrared and color imaging, designers can make th ...

Vishay introduces automotive-grade Power Metal Plate galvanometer resistors with high power and wide resistance ranges
2019-11
Passive Components
Vishay
[Nov 28 2019] Vishay introduces new automot-grade power metal plate galvanometers in dimensions 2010 and 2512, rated at 2W and 3W. Designed for galvanometer and pulse applications in power supplies, instruments, amplifiers, dividers, power inverters and battery management circuits, the new WFM resistor allows designers to use a single high-power resistor without having to parallel multiple resistors to create ...

Dialog introduces a family of audio codecs with groundbreaking active noise reduction performance
2019-11
Semiconductors
Diodes Incorporated
[Nov 27 2019] Dialog Semiconductor, a supplier of highly integrated power management, audio, AC/DC power conversion, charging, and Bluetooth low power technologies, announced the introduction of the DA740x, a highly integrated audio codec chip with the industry's best active noise cancellation (ANC) performance, providing the fastest audio performance in the rapidly growing wireless headphone market regardless ...
Microchip introduces the industry's first commercial eSPI to LPC bridge
2019-11
Connectors
Microchip Technology
[Nov 26 2019] As the industrial computing industry transitions from Low Pin Count (LPC) interface technology to Enhanced Serial Peripheral Interface (eSPI) bus technology, updating existing equipment will incur significant development costs when applying the new standard. To help developers apply the eSPI standard while preserving their legacy LPC devices, Microchip Technology announced the industry's first co ...