Technology Articles

2019-12 Connectors Maxim Integrated

[Dec 12 2019] Maxim introduces the MAX98390 smart amplifier, which integrates Dynamic Speaker Management (DSM) algorithms to dramatically increase volume and achieve clearer, richer sound quality, with the lowest static power consumption on the market, and further reduce size to meet the demanding demands of users for stylish products. The boosted digital Class D DSM intelligent amplifier safely and stably del ...

2019-12 Passive Components Toshiba Semiconductor and Storage

[Dec 11 2019] Toshiba Electronic Components and Memory Devices, Inc., the industry leader in miniaturized cutting-edge optical relays, today announced the introduction of a new family of five optical relays in the industry's smallest [1] package, the S-VSONR4 (2.0mm x 1.45mm). The new products are suitable for automatic test equipment, memory testers, SoC/LSI testers and probe cards. The TLP34xxSRL series (two ...

2019-12 Power Bourns

[Dec 10 2019] Bourns announced the completion of the expansion of its SinglFuse overcurrent protection product line, adding 33 lines over the past 18 months. The increasing focus on security in many industries has led to an increasing demand for effective circuit protection. The extended SinglFuse™ product family meets safety standards to provide reliable overcurrent protection in sensitive circuits, supportin ...

2019-12 Semiconductors NXP

[Dec 9 2019] NXP Semiconductors announced one of the industry's most highly integrated portfolios of RF solutions for 5G cellular infrastructure, industrial and commercial markets. Leveraging its extensive experience, breakthrough research and development, world-class manufacturing capabilities and global reach, NXP has built a comprehensive solution that easily meets the 5G RF power amplification needs of to ...

2019-12 Passive Components NXP

[Dec 8 2019] NXP Semiconductors announced the launch of the first RF power transistor designed for RF energy using silicon carbon-based gallium nitride (GaN-on-SiC). The MRF24G300HS takes advantage of GaN's high efficiency to surpass the efficiency of most magnetrons at 2.45 GHz, while SiC's high thermal conductivity helps ensure continuous wave (CW) operation. For more than 50 years, 2.45 GHz magnetrons have ...

2019-12 Power Renesas Electronics America Inc.

[Dec 7 2019] Renesas Electronics Corporation announced the launch of the RX Microcontroller (MCU) family of RX72M product groups with built-in EtherCAT® slave station controllers for industrial Ethernet communications. This new flagship product group in the Renesas RX family brings high-performance, single-chip solutions with large memory capacities to industrial devices requiring control and communication fu ...

2019-12 Power Qorvo US Inc.

[Dec 6 2019] Qorvo introduces new energy-efficient, small base station front-end solutions for the sub-6 GHz wireless infrastructure market. The product significantly improves efficiency and enables base station manufacturers to enhance their existing 4G LTE infrastructure for higher bandwidth, coverage, throughput and capacity, especially for high-density, high-traffic areas. Strategy Analytics predicts that ...

2019-12 Passive Components Vishay

[Dec 5 2019] Vishay Intertechnology announced that it has expanded its T55 series of vPolyTan™ surface-mounted polymer tantalum moulded chip capacitors with the addition of a D-shape (EIA 7343-31) dimension device with a single-digit ESR value reduced from 9 m to 7 m and a 6 m ESR value device under development. The capacitors released today retain the previous larger exterior size, with a single-digit ESR ...

2019-12 Sensors Infineon Technologies

[Dec 4 2019] Infineon Technologies AG introduces a new product, XENSIVTM DPS368. This is a miniaturized digital pressure sensor that measures both temperature and pressure. With an ultra-high accuracy of ±2 cm and low power consumption, this product is ideal for precise measurements of altitude, airflow and body motion, making it ideal for mobile phones and wearables that support motion tracking and navigatio ...

2019-12 Sensors Infineon Technologies

[Dec 3 2019] Infineon Technologies AG has developed an excellent 3D image sensor solution for the mobile device market, the REAL3™ IRS2381C. Today, the 3D Time of Flight (ToF) single-chip solution has been named "Product of the Year" in the Sensor category by the Embedded Vision Alliance. The awards recognize innovations and significant achievements in advanced technologies, services and products that drive t ...

2019-12 Connectors Renesas Electronics America Inc.

[Dec 2 2019] Renesas Electronics has introduced a radiation-resistant 16-channel current driver with an integrated 4-bit decoder for reducing the size, weight and power (SWaP) of satellite command and telemetry systems by up to 50%. The ISL72814SEH integrates decoders, input level converters and an array of 16 current drivers in a single monolithic IC. Multiple ISL72814SEH current drivers are capable of sendi ...

2019-12 Power Analog Devices

[Dec 1 2019] Analog Devices has introduced a new solution for millimeter wave (mmWave) 5G infrastructure with the highest level of integration yet, designed to reduce the design requirements and complexity of next-generation cellular network infrastructure. The solution integrates ADI's advanced beamforming ics, up/down conversion (UDC) and other mixed-signal circuits. This optimized beam-to-bit signal chain ...