Technology Articles

2019-08 Sensors TDK

[Aug 23 2019] Micronas, a member of TDK, expands its line of Hall sensors with HAL 39xy, which supports stray field compensation and has a highly flexible architecture sensing multidimensional magnetic field, registered under the trade name masterHAL. The range meets the requirements of today's and tomorrow's automotive and industrial markets, offering four different measurement modes in a single product: line ...

2019-08 Power Nexperia

[Aug 22 2019] Nexperia, a global leader in discrete, logic and MOSFET devices, today announced that it has implemented the NextPower S3 MOSFET with the lowest on-impedance in history using Trench 11 technology, without affecting other important parameters. Examples include drain current (ID(max)), safe working area (SOA), or gate charge QG. Many applications require ultra-low on-impedance, such as ORing, hot-s ...

2019-08 Sensors Analog Devices

[Aug 21 2019] Analog Devices has introduced a new inertial sensing solution that compensates for GPS signal loss or sensing signal singularity in truck fleets, agricultural equipment, commercial and small aircraft, ships, tanks and other vehicles that rely on GPS satellite navigation to maintain accurate position information. Similar to the Internet, Global Positioning System (GPS) satellite navigation is beco ...

2019-08 Power STMicroelectronics

[Aug 20 2019] STMicroelectronics' STGWA40IH65DF and STGWA50IH65DF 650V STPOWER™IGBT provide optimal on-off and on-off performance in soft switching circuits, improving the energy efficiency of resonant converters in the 16 Khz-60 KHZ switching frequency range. The new IH series is part of STMicroelectronics' gate-gate Field Cutoff (TFS) IGBT family optimized for soft switching applications. It is suitable for ...

2019-08 Power Samsung

[Aug 19 2019] Samsung has released its new Flashbolt High Bandwidth Memory (HBM), which it claims is the industry's first HBM2E compliant memory product. The company's new Flashbolt memory stack increases performance by 33% and offers double the capacity per chip as well as double the capacity per package. Samsung introduced HBM2E DRAM at GTC, a fitting occasion as NVIDIA is one of the biggest users of HBM2 me ...

2019-08 Sensors Texas Instruments

[Aug 18 2019] Texas Instruments announced the TMP411, a remote junction temperature sensor in the +/-1 ° C accuracy range, integrated with local temperature sensors for monitoring thermal diodes in cpus, microprocessors, graphics processing units and FPgas. The device is unique in that it not only provides programmable series resistance cancellation and diode non-ideal correction, but also simplifies and elimi ...

2019-08 Connectors Maxim Integrated

[Aug 17 2019] Maxim introduces the MAX2204 linear power detector in a miniature 2mmx2.2mm, lead-free, 5-pin SC70 package for mobile applications. The power detector is designed to compensate for temperature and process drift, reducing the output variation to ±0.5dB at full power (5dBm) and ±1.5dB at low power (-16 DBM). This will reduce the calibration test process in the final stage of handheld product produc ...

2019-08 Power Qualcomm

[Aug 16 2019] Qualcomm Technologies International announced the launch of the new QCS400 system-on-a-chip (SoC) series of products supporting artificial intelligence (AI) and smart speakers, and the CSRA6640 DDFA amplifier solution that can optimize sound performance, among which, compared to the previous generation technology, The QCS400 Series voice-activated standby time and "unplugged" battery life are ext ...

2019-08 Connectors Diodes Incorporated

[Aug 15 2019] Diodes introduces a new line of high voltage, high speed gate drivers for converters, frequency converters, motor control, and Class D power amplifiers. These devices are suitable for motor driven applications up to 100V, and can support power conversion and reversal applications operating at 200V. These features make it ideal for a variety of consumer and industrial designs, including power tool ...

2019-08 Power Power Integrations

[Aug 14 2019] Power Integrations releases InnoMux chipsets for display power supplies. The chipset features a unique single-stage power architecture that reduces the power consumption level for display applications and increases the overall efficiency of the constant-voltage and constant-current LED backlight driver circuit by 50% compared to conventional power solutions, resulting in a power efficiency of 91% ...

2019-08 Connectors Toshiba Semiconductor and Storage

[Aug 13 2019] Toshiba announced the launch of two new series of small surface mount LDO regulators, the TCR5BM Series and the TCR8BM Series, for power supply applications in mobile devices, video and audio and video products. Both series are suitable for power applications for MCUS, RF devices, camera CMOS sensors in mobile devices, imaging and audio and video devices. These devices have gradually popularized ...

2019-08 Power Bosch Sensortec

[Aug 12 2019] Bosch Sensortec has announced the launch of the BMI270, an ultra-low power intelligent inertial measurement unit (IMU) designed for wearable applications. It uses the latest Bosch MEMS process technology to greatly improve the offset and sensitivity performance of the accelerometer. The BMI270 is the latest addition to the Bosch Sensortec BMI260 series of IMUs, including intuitive gesture, contex ...