Technology Articles

2019-07 Sensors Murata

[Jul 19 2019] The Murata Electronics SCL3300 3-axis MEMs tilt sensor features a tilt Angle output and a digital SPI interface. The inclinometer has four user-selectable measurement modes that can be used to optimize the sensor's performance for different applications and their requirements. The device is designed for applications such as leveling, tilt sensing, machine control, and structural health monitoring ...

2019-07 Power Maxwell Technologies

[Jul 18 2019] Marvell announced the launch of the LiquidSecurity Network Hardware Security Module (HSM) for enterprise data centers and private clouds. This customized solution builds on Marvell's successful public cloud deployment of scalable, cloud-focused security products, extending Marvell's technology leadership even further into the enterprise environment. Marvell LiquidSecurity solutions provide a stab ...

2019-07 Sensors Vishay

[Jul 17 2019] Vishay further expands its optoelectronics portfolio with the introduction of two new series of optically thyristor output optocouplers in compact DIP-6 and SMD-6 packages -VOT8026A and VOT8123A. Vishay Semiconductors VOT8026A and VOT8123A offer high stability and noise isolation with off-state voltages up to 800 V and static dV/dt of 1000 V/μs, suitable for household appliances and industrial eq ...

2019-07 Sensors Tronics

[Jul 16 2019] Tire sensor and data management company Tyrata has achieved a milestone in the development of its IntelliTread TM real-time tread wear sensor. After testing on a variety of OEM passenger car tires, the sensor's design and operation were improved. The IntelliTread sensor uses a wireless signal to track changes in tread depth in millimeters and signals when used commercially and tires need to be re ...

2019-07 Semiconductors Cypress Semiconductor

[Jul 15 2019] Cypress has introduced two low-power dual-mode Bluetooth 5.0 and Bluetooth Low Power (BLE) MCU prototypes to support building Bluetooth Mesh networks in the Internet of Things. Two new MCUS models, CYW20819 and CYW20820, offer both Bluetooth 5.0 audio and BLE connectivity, a low-power wireless solution that enables music transmission and voice command control for battery-powered sports bands, hea ...

2019-07 Sensors ams

[Jul 14 2019] Ams introduces the AS6500, a new high-resolution time-to-digital converter (TDC) with CMOS inputs and a compact package that addresses space and cost constraints. Time intervals as short as 5ns can be measured with an accuracy of 10ps. Based on AMS 'existing TDC-GPX2, the AS6500 offers up to 10ps resolution across four channels with a sampling rate of up to 1.5Ms/s. With high accuracy and high sa ...

2019-07 Power Microchip Technology

[Jul 13 2019] Microchip introduces 12 new Successive approximation register (SAR) analog-to-digital converters (ADCs) and complementary differential amplifiers designed for the new SAR ADC product family to meet the application market's demand for higher speed and resolution analog-to-digital conversions. Designed for high temperature and electromagnetic operating environments, the MCP331x1 (D) -xx series incl ...

2019-07 Power XP Power

[Jul 12 2019] As a product with an outstanding Power density of 26W/in3, XP Power's SIP9 package, 5W rated IMM05 converter takes up 65% less PCB board space than competing products, and its extremely low 2uA leakage current makes it ideal for medical BF and CF applications. The IMM05 series is suitable for 60601-1 medical applications worldwide with 2:1 input range, 1500VAC insulation and 1 x MOPP (250Vrms). T ...

2019-07 Semiconductors Vishay

[Jul 11 2019] Vishay introduces new 30 V and 40 V automotive grade P-channel TrenchFET power MOSFEts -SQJ407EP and SQJ409EP - in a Gull-wing lead PowerPAK SO-8L package for improved board level reliability. The SQJ407EP and SQJ409EP are AEC-Q101 certified and offer more than 50% less footprint than DPAK packaged devices, saving PCB space and reducing costs while having a lower on-resistance than any Gull wing ...

2019-07 Sensors Electroswitch

[Jul 10 2019] Elmos has announced the E520.47, a sensor signal conditioning IC with a SENT interface that supports synchronous signal processing of two resistive sensor Bridges. The IC has been developed specifically for the needs of automotive applications. The E520.47 complies with standard ISO26262 in order to be able to meet the safety requirements of the system up to ASIL C level. The IC can be used in a ...

2019-07 Sensors Melexis Technologies NV

[Jul 9 2019] Melexis announced the launch of the industry's first single-chip automotive-grade VGA time-of-flight (ToF) image sensor, the MLX75027, for applications such as automotive interior and exterior monitoring. The MLX75027 is a system-on-chip solution that provides image sensing and processing at VGA (640 x 480 pixels) resolution in a single BGA package. As the automotive industry moves toward semi-au ...

2019-07 Sensors Rohm Semiconductor

[Jul 8 2019] ROHM Corporation has successfully developed LSI BH1600FVC (analog output type) and BH1710FVC (digital output type), which have excellent spectral sensitivity for portable devices such as mobile phones and LCD TVS. The BH1600FVC and BH1710FVC will be put into mass production at a monthly output of 1 million and 2 million, respectively. The initial production process will be carried out in ROHM APO ...