Technology Articles

2019-05 Semiconductors Vishay

[May 19 2019] Vishay Intertechnology has announced the launch of a new 2.5A IGBT and MOSFET driver, VOD3120A, to expand its optoelectronics portfolio. The Vishay Semiconductors VOD3120A comes in DIP-8 and SMD-8 packages with a low voltage drop output current loss of only 3.5 mA, which can be used to improve inverter level efficiency. The recently released optocoupler uses CMOS technology and contains AIGaAs le ...

2019-05 Connectors FDK

[May 18 2019] FCI announced the launch of a range of advanced power distribution connectors for mobile communications applications. The PwrBlade+TM series connectors not only have high linear current density and low power loss, but are also rugged, providing the ideal solution for truck and trailer communication equipment. The PwrBlade+TM series of connectors features high-power contacts that are optimized for ...

2019-05 Power United Chemi-Con

[May 17 2019] U-blox has announced that it is expanding its connectivity software product. In addition to the already widely known u-connectXpress(formerly known as u-blox Connectivity software), the product now includes u-connectScript. The extended software family further simplifies wireless Bluetooth and Wi-Fi device development, enabling embedded scripting applications in the module, reducing complexity an ...

2019-05 Optoelectronics STMicroelectronics

[May 16 2019] STMicroelectronics integrates its most advanced LED control technology with advanced power technology to develop a new all-in-one LED control chip, so that future lamps can save more power and provide users with a better experience. HVLED001B is the second generation of STMicroelectronics LED driver, including high voltage start circuit and induction circuit, can simplify the driver and AC line c ...

2019-05 Power Macronix

[May 15 2019] MACOM expands its portfolio of silicon-based Gallium nitride (GaN-on-Si) power amplifiers (PA) with the introduction of the new MAMG-100227-010 broadband power amplifier (PA) module. The broadband PA module is optimized for land Mobile Radio systems (LMR), wireless public safety communications, and military tactical communications and electronic countermeasures (ECM). The MAMG-100227-010 PA modul ...

2019-05 Power Nexperia

[May 14 2019] Nexperia has introduced the Low RDS(on) 40 V AEC-Q101 MOSFET product line, which targets space-constrained, high-power modules in powertrains. The device is packaged in a miniature LFPAK33 with a space area of only 10.9 mm² and a pitch of only 0.65 mm, using Nexperia's Trench 9 technology. This results in a 48% lower RDS(on) parameter than the previous process, covering a wide range of applicatio ...

2019-05 Sensors ON Semiconductor

[May 13 2019] ON Semiconductor announced the launch of the RSL10 Sensor Development Kit, designed to provide engineering teams with a platform for fully developing Internet of Things (IoT) applications with cutting-edge smart sensor technology, enabled by the industry's lowest-power Bluetooth low-power radio. The RSL10 Sensor Development Kit combines the highly integrated RSL10 System-level Package (RSL10 SIP) ...

2019-05 Power C&K

[May 12 2019] C&K announced a wide range of switch combinations for game controller and game accessory designers, including a variety of small tap switches, ultra-small tap switches and micro tap switches for printed circuit board mounting. These switches are designed for the most demanding uses and can be customized to achieve the precise sound and feel required for a perfect gaming experience. The KMT0 serie ...

2019-05 Sensors STMicroelectronics

[May 11 2019] 0.25°C Typical measurement accuracy, low working current, low standby current, STMicroelectronics' new STTS22H temperature sensor improves temperature and heat flow monitoring for equipment such as asset trackers, container shipping recorders, HVAC HVAC systems, air humidifiers, refrigerators, building automation systems and smart consumer devices. The STTS22H is compatible with I2C and SMBus 3.0 ...

2019-05 Sensors Melexis Technologies NV

[May 11 2019] Melexis has announced the launch of a new version of its far-infrared (FIR) thermal sensor array, the MLX90641. Compared to the current version of the MLX90640, the new device has significantly reduced thermal noise, an increased refresh rate of 64 Hz, and an upper operating temperature of 125°C. The latest sensing technology makes it easier to integrate temperature measurement functions into app ...

2019-05 Connectors Hirschmann

[May 10 2019] Hyperstone has announced the availability of a new SATA III SSD controller, Model X1. The X1 is designed to meet the needs of the industrial sector, and the target product applications include high-reliability SSDS, M.2 and U.2 modules, system packages for CFast cards and eSSD, and flash drives for on-board controllers and flash chips. The initial X1 is available in 144-ball TFBGA (10.4 x 10.4 x ...

2019-05 Passive Components TDK

[May 9 2019] TDK has introduced the TFM252012ALVA thin-film metal power inductor, which can be directly connected to a 12 V automotive battery while maintaining a small size. The newly developed inductor has A rated current of 1.6 A and an inductance of 4.7 μH, which can withstand severe temperature environments and operate in the temperature range of -55 °C to +150 °C (including temperature rise due to spont ...