Technology Articles

2019-06 Semiconductors Microchip Technology

[Jun 30 2019] To ensure that systems can capture and display information and high-resolution images, today's video and image processing requires the development of complex computer algorithms. Because designers need high-performance computing, storage, and connectivity resources to achieve detailed, vivid, high-resolution images, field-programmable gate arrays (FPgas) perform thousands of tasks while ensuring ...

2019-06 Sensors ams

[Jun 28 2019] Ams has introduced the AS7026, an optical sensor for continuous monitoring of cardiovascular health, with medical-grade 1 precision measurement of blood pressure. Combined with AMS 'VivaVita™ accessory design, it provides turnkey solutions for customers who need to reduce time to market, creating feature-rich mobile applications for iOS and Android™ mobile operating systems. Embed the AS7026 into ...

2019-06 Semiconductors NXP

[Jun 27 2019] NXP Semiconductors today announced the release of an in-vehicle network processing chipset that can be used as a high-performance service-oriented gateway to unlock the value of connected vehicle data and offer new services. The MSC-LS chipset solution combines NXP Semiconductor's MPC5748G automotive microcontroller and LS1043A enterprise network communications processor to provide the high perfo ...

2019-06 Power Texas Instruments

[Jun 26 2019] Texas Instruments announced the introduction of a new embedded processor and analog chip based on bulk acoustic wave (BAW), which is ideal for applications in the design of the next generation wireless Internet of Things and communications infrastructure. The two devices developed using TI BAW technology are the CC2652RB SimpleLink wireless microcontroller (MCU) and the LMK05318 network synchroni ...

2019-06 Sensors Infineon Technologies

[Jun 25 2019] Infineon presents the fourth-generation REAL3 image sensor IRS2771C. The 3D Time of Flight (ToF) single-chip device is designed to meet the needs of the mobile consumer end market, particularly the need to support higher resolutions with small lenses. A wide range of applications include secure user authentication (such as face recognition or hand recognition) to unlock devices and confirm paymen ...

2019-06 Sensors Vishay

[Jun 24 2019] Vishay extends the IHSR family of high-saturation commercial inductors with the introduction of the latest ultra-thin package of 4 mm x 4 mm 1616 form factor, the IHSR-1616AB-01. The Vishay Dale IHSR-1616AB-01 is designed for multiphase high-current power supplies and filters for computer, industrial, and communications applications, with a DC resistance (DCR) of 50% lower than a typical power in ...

2019-06 Power Daburn Electronics

[Jun 23 2019] DustPhotonicsTM announces that it has conducted a sample inspection of 400G active optical cables of QSFP-DD specification and completed all pre-production procedures. The 400Gbps active optical cable uses DustPhotonics' AuraDPTM optical engine and unique fiber integration and production technology to provide a competitive solution for short-range high-density multimode fiber applications. DustPh ...

2019-06 Sensors ams

[Jun 22 2019] Ams announced the introduction of its new color (RGB) proximity and flicker detection sensor, the TCS3707, which enables mobile phone cameras to take crisp and flawless photos in artificially lit scenes. The sensor has built-in infrared crosstalk suppression for reliable proximity detection when paired with an infrared transmitter. Available in 2.0mm x 2.5mm x 0.5mm OQFN package. A phone camera e ...

2019-06 Power Molex

[Jun 21 2019] Molex, a global electronics solutions provider, has introduced a compact 2.2-5 RF connector system and cable assembly designed to provide both high frequency and low passive intermodulation (PIM) capabilities. Molex worked with the 2.2-5 Consortium to develop the 2.25 form factor by taking the mature 4.3-10 form factor and miniaturizing it. Molex's 2.2-5 RF connector is 53% smaller than the 4.3-1 ...

2019-06 Power Diodes Incorporated

[Jun 20 2019] Diodes introduces the market leading AH356xQ series of fully certified all-pole Hall switches for automotive applications, which also meet AEC-Q100 Class 0 standards. Common applications for these rugged Hall-effect switches include position and proximity sensing, open and closed circuit detection, level detection, and flow metering, with a wide operating voltage range from 3V to 28V and an excel ...

2019-06 Power Microchip Technology

[Jun 19 2019] Microchip introduces the first generation of USB 3.1 SmartHub integrated chips compliant with automotive standards. Compared to existing USB 2.0 solutions, the new generation of USB 3.1 chips can increase data transfer rates by 10 times and reduce indexing time, thereby improving the automotive user experience. To support the USB Type-C interface that is becoming increasingly popular in the smart ...

2019-06 Power Qualcomm

[Jun 18 2019] Qualcomm Technologies announced the launch of Qualcomm Quick Charge technology for wireless charging, bringing the company's years of fast charging technology innovation to the wireless charging industry, and enabling consumers to quickly, safely and efficiently charge their terminals wirelessly. More than 1,000 commercial mobile terminals, accessories and components compatible with Quick Charge ...