Technology Articles

2019-03 Power STMicroelectronics

[Mar 31 2019] St's STEVAL-FKI001V1 dual RF development kit supports Bluetooth Low Energy (BLE) and Sub-1GHz parallel wireless communication, significantly improving the design, development efficiency and connectivity flexibility of iot devices, such as, Smart sensors, detectors and trackers that enable configuration, update, remote monitoring and tracking through a variety of network topologies, protocols and ...

2019-03 Power Vishay

[Mar 30 2019] In the past decade, the third generation semiconductor technology has become mature. As an important representative of the third generation semiconductor devices, silicon carbide has been widely used in industrial, automotive and national defense and other fields. Basic semiconductor follows the pace of The Times, adopts the international leading silicon carbide design and production process, and ...

2019-03 Connectors Maxim Integrated

[Mar 29 2019] Maxim announced the launch of its new biosensor module, the MAX86150, consisting of an LED, photodetector, and ECG Analog Front End (AFE), which is the industry's first high-precision, FDA-approved PPG and ECG product for compact, energy-efficient designs, widely used in mobile phones, laptops, tablets, and smart speakers. Now, designers can make photoelectric volumetry (PPG) and electrocardiogra ...

2019-03 Power Silicon Labs

[Mar 28 2019] Silicon Labs has announced that its Bluetooth Mesh technology has been selected by Xiaomi (01810.HK) for use in the smart home products released by the company. The products produced by Xiaomi Eco-Chain and using Silicon Labs Bluetooth Mesh technology - covering intelligent lighting products such as smart bulb, smart candle bulb, smart downlight and smart spotlight, which can be controlled by dev ...

2019-03 Power Flex Power Modules

[Mar 27 2019] Flex Power Modules is now launching new DC-DC power modules for the industrial and rail industries, meeting the growing demand in these areas by expanding its product range and offering additional versions of existing products with different input/output voltage ranges. These modules are packaged in a sealed plastic seal to ensure reliable operation when subjected to dust, moisture, violent vibra ...

2019-03 Optoelectronics ams

[Mar 26 2019] Ams introduces a tiny spectral sensor chip that provides laboratory-grade, multi-channel color analysis for portable mobile devices. In end products such as mobile phones or accessories, the new AS7341 from AMS offers more accurate spectral measurements in a wider range of lighting conditions than competing products. The small size of the new sensor makes it easier to integrate it into mobile pho ...

2019-03 Connectors Toshiba Semiconductor and Storage

[Mar 25 2019] Toshiba announced the launch of the MG08 series of conventional Magnetic Recording technology (CMR) hard drives with the industry's largest capacity of 16TB. Compatible with the widest range of applications and operating systems, the MG08 16TB hard drive offers 33% more capacity than today's widely adopted 12TB hard drives and 14% more capacity than previous 14TB models for hybrid random read and ...

2019-03 Optoelectronics ams

[Mar 24 2019] Ams has announced the TCS3701, an RGB light sensor and infrared proximity sensor IC that accurately measures ambient light intensity behind OLED screens. This feature caters to today's industry design trends to maximize the display area of your smartphone by eliminating the front bezel, which is typically where the ambient light/proximity sensors are located. By developing this "behind the OLED s ...

2019-03 Sensors OmniVision Technologies Inc

[Mar 23 2019] OmniVision Technologies, an industry-leading developer of advanced digital imaging solutions, has announced the OV02K, a new video-centric 2.9-micron 1080P smartphone image sensor. The OV02K is based on OmniVision's PureCel Plus pixel technology, enabling backup cameras in multiple camera configurations to capture high-quality video even in low-light environments. According to TSR, the number of ...

2019-03 Passive Components Yageo

[Mar 22 2019] Yageo, the world's leading manufacturer of passive components, has launched the AQ series of high frequency ceramic stacking capacitors, which use temperature-stable NPO dielectrics, currently available in sizes of 0603, capacity range: 0.2pF~100pF, and rated voltage of 50V. AQ series capacitors have excellent temperature characteristics and small tolerance tolerance, and the design concept of th ...

2019-03 Connectors C&K

[Mar 21 2019] C&K, one of the world's most trusted brands of high-reliability connectors, has announced the launch of its space-grade D-Ultra-small Surface Mount Termination (SMT) series of electrical connectors. The new SMT D-Sub connectors conforming to the CS-FR 053 specification are primarily used in aerospace engineering applications, such as the development of communications and networking ports for sate ...

2019-03 Optoelectronics ams

[Mar 20 2019] Osram Opto Semiconductors GmbH has released two infrared light-emitting diodes (IREDs) that can be used in biometric applications in the automotive industry. Biometrics offers many benefits, not only saving time searching for your car keys, but also preventing emotional frustration if you can't find them. In addition, if multiple people share the same car, it can also automatically complete the p ...