Technology Articles

2019-03 Power Power Integrations

[Mar 12 2019] PI introduces a new plug and play gate driver that can be used with Infineon's PrimePACK™3+ and similar IGBT modules from Fujifilm for two - and three-level applications. The SCALE-2™ 2SP0430T2XX gate driver board is suitable for industrial, traction, UPS and renewable energy applications and provides reinforced insulation for 1200 V and 1700 V IGBT modules. The 2SP0430T2XX product family integra ...

2019-03 Connectors Diodes Incorporated

[Mar 11 2019] Diodes Corporation is a leading global manufacturer and supplier of high-quality, application-specific standard products for a broad range of markets, including standalone, logic, analog and mixed-signal semiconductors. The company introduced the PI4ULS5V108. The device is an 8-channel, high-speed bidirectional potential converter designed for cross-IC communication between devices operating on d ...

2019-03 Power Qualcomm

[Mar 10 2019] New generation multi-mode LPWA modules BG35 and BG17 from Qualcomm 9205 LTE modem. As one of the world's first communication module suppliers scheduled to deliver the new chip platform, Yuanyuan will help customers commercialize iot solutions faster and more efficiently. BG35 is a series of multi-mode modules that integrate Cat M1, Cat NB2 and EGPRS as well as GNSS positioning technology, fully c ...

2019-03 Power Semtech

[Mar 9 2019] Semtech Corporation, a leading provider of high-performance analog and mixed-signal semiconductor products and advanced algorithms, announced: EasyReach Solutions, an Indian startup focused on providing smart iot solutions for industrial applications, has incorporated Semtech's LoRa devices and radio frequency technology (LoRa technology) into its industrial and intelligent vehicle monitoring pro ...

2019-03 Connectors TE Connectivity

[Mar 9 2019] TE announced the introduction of MULTI-BEAM Plus connectors, the latest extension to its recognized line of power connectors. The MULTI-BEAM Plus connector uses the same thin design as the power connectors of the preceding products, such as MULTI-BEAM XL, MULTI-BEAM XLE and MULTI-BEAM HD, and has the same ventilation performance. The MULTI-BEAM Plus connector can carry up to 140A per power termin ...

2019-03 Power United Chemi-Con

[Mar 8 2019] U-blox Corporation, a leading provider of global positioning and wireless communications technologies, announced the launch of the NINA-W15 family of multi-NIC/gateway modules that support both Wi-Fi 802.11b /g/n connectivity and dual-mode Bluetooth connectivity. This includes support for Bluetooth Low power and Bluetooth BR/EDR. Thanks to the concurrent support of wireless interface, this series ...

2019-03 Power Xilinx

[Mar 7 2019] Xilinx announced that BYD, the leader in China's electric vehicle manufacturing industry, has adopted Xilinx's Zynq SoC L0/L1 front-facing camera Advanced Driver Assistance System (ADAS) solution in the new generation of commercial and passenger vehicles released in mass production this year. As a result, it became the first Chinese automobile manufacturer in the Chinese market to adopt the Zynq ...

2019-03 Power Silicon Labs

[Mar 6 2019] Silicon Labs has announced the next-generation Z-Wave 700 Series on the Wireless Gecko platform, the industry's most comprehensive Internet of Things (IoT) hardware and software connectivity solution. Following Silicon Labs' strategic acquisition of Z-Wave technology in April 2018, the Z-Wave 700 Series once again demonstrates Silicon Labs' vision and platform integration roadmap. Adam Wright, se ...

2019-03 Semiconductors Vishay

[Mar 5 2019] Vishay Intertechnology, Inc. announced that its optoelectronics division has introduced a new fully integrated automotive-grade proximity and ambient light sensor with four different secondary address options - the VCNL4030X01. Using Filtron technology, the Vishay Semiconductors VCNL4030X01 combines a light detector for proximity and ambient light, a signal conditioning IC, a 16-bit ADC and a hig ...

2019-03 Connectors TE Connectivity

[Mar 4 2019] The M3200 pressure transmitter from TE Connectivity (TE), a global leader in connectivity and sensing technology, uses advanced Microfused technology. As the latest member of TE's large family of pressure transmitters, the M3200 combines micromachined silicon piezoresistive strain gauges with high-temperature glass and stainless steel membranes to create a unique pressure transmitter front end th ...

2019-03 Power Microchip Technology

[Mar 3 2019] The MXT2912TD-A with nearly 3,000 touch sensing nodes and the MXT2113TD-A with support for more than 2,000 nodes give customers the automotive touch screen user experience they've always dreamed of. The new devices are based on Microchip's maXTouch touchscreen technology, which is widely used by manufacturers around the world. Microchip's latest solution provides superior signal-to-noise ratio pe ...

2019-03 Connectors Toshiba Semiconductor and Storage

[Mar 2 2019] Toshiba announced the addition of 12TB[1] and 14TB models to its N300 series NAS hard drives and X300 series high-performance hard drives. The new 12TB and 14TB models feature a helium-sealed hard drive design, enabling a 3.5-inch mechanical design that provides higher storage density and lower hard drive operating power distribution. Toshiba's laser welding technology and hard drive case design ...