Technology Articles

2019-02 Sensors STMicroelectronics

[Feb 12 2019] The ISM330DLC 6-axis IMU (Inertial Measurement Unit) is an extension of STMicroelectronics ultra-low power MEMS industrial-grade sensor product family with high precision and robustness. In a 2.5mm x 3mm x 0.83mm plastic contact array (LGA) system-level package. ISM330DLC integrates a 3-axis accelerometer and a 3-axis gyroscope, full scale users can choose, the highest measurement values are ±16g ...

2019-02 Connectors Littelfuse

[Feb 11 2019] Littelfuse's IXYS Integrated Circuits division introduces the CPC1984Y, a 600V normally open power SIP relay rated for up to 1A DC/1Arms of sustained load current, double the load current of the company's best-selling power relay. This highly reliable device uses optically coupled MOSFET technology to provide 4000Vrms input and output isolation. In fact, the CPC1984Y SIP relay provides the best c ...

2019-02 Connectors Flex Power Modules

[Feb 10 2019] To meet the growing demand for higher levels of energy efficiency in data centers and cloud computing infrastructure, Flex Power Modules is now offering its first generation of direct conversion products. The new BMR481 DC-DC converter is designed for 48-54V nominal power supplies with an input range of 40-60V and offers a programmable output of 0.5-1.35V. The "main" module, in a 12mm x 27.7mm pa ...

2019-02 Power Microchip Technology

[Feb 9 2019] Microchip introduces the industry's most efficient automotive infotainment connectivity solution that supports all data types, including audio, video, control, and Ethernet, with a single data line. Intelligent Network Interface Controller Connectivity (INICnet) technology is a synchronous and scalable solution that significantly simplifies the creation of audio and infotainment systems for seaml ...

2019-02 Semiconductors Renesas Electronics America

[Feb 6 2019] Renesas Electronics announced that Nissan Motor Co., Ltd. has adopted Renesas' innovative high-performance automotive electronics technology for its ProPILOT 2.0 intelligent navigation system, with the unveiling of the new Nissan Skyline on July 16, 2019. The driver assistance system combines a navigation system with fully automated driving in a single lane on the highway, using Renesas R-Car aut ...

2019-02 Sensors Crouzet

[Feb 6 2019] Crocus Technology has introduced a new breakthrough TMR Angle (2D) magnetic sensor, the CT300, to meet a wide range of market needs with extremely low Angle error and high stability over a wide range of temperatures and voltuses. Designed using Crocus' revolutionary Magnetic Logic Unit (MLU™) technology, the CT300 consists of two full-bridge magnetoresistive networks capable of two-dimensional se ...

2019-02 Power Vishay

[Feb 5 2019] Vishay further expands its optoelectronics portfolio with the introduction of two optical thyristor output optocouplers, both in compact flat SOP-4 packages -VOT8024AM and VOT8121AM. Vishay Semiconductors VOT8024AM and VOT8121AM have high stability and noise isolation with 800 V off-state voltage and 1000 V/μs dV/dt, suitable for household appliances and industrial equipment. The optocoupler isol ...

2019-02 Connectors TE Connectivity

[Feb 4 2019] TE's new ERFV RF coaxial connectors enable board-to-board and board-to-filter connections between antennas and RF units at a lower cost, enabling next-generation 5G wireless product design. It can also provide the more reliable and lower-cost customized components needed for the design of future 5G wireless devices to support the expansion of wireless infrastructure around the world. TE Connectiv ...

2019-02 Power Maxim Integrated

[Feb 3 2019] Melexis has announced a major upgrade of its Time of flight (ToF) technology for the automotive industry, cementing Melexis' position as an industry leader in the development and production of time-of-flight sensors for automotive applications. The portfolio now includes the next generation QVGA ToF sensor chipset, the MLX75024, and the upcoming VGA ToF sensor, the MLX75123BA. The latest developm ...

2019-02 Semiconductors ON Semiconductor

[Feb 2 2019] On Semiconductor, driving energy efficiency innovation, has introduced a Bluetooth low-power switch reference design that operates entirely on captured energy, defining a new level of ultra-low power consumption for the Internet of Things (IoT). The platform demonstrates how the RSL10 System-level Package (SIP) can support battery-free and fully self-powered Bluetooth 5 devices without additional ...

2019-02 Power Microchip Technology

[Feb 1 2019] LoRa (Long Distance) technology combines long distance wireless connectivity with low power performance to expand the reach of the Internet of Things (IoT). To accelerate the development of LoRa connectivity solutions, Microchip Technology introduced a highly integrated LoRa System Package (SiP) family of devices that use ultra-low power 32-bit microcontrollers (MCUS), sub-GHz RF LoRa transceiver ...

2019-01 Passive Components Vishay

[Jan 31 2019] Vishay Intertechnology, Inc. announced the introduction of a new line of high-voltage ENYCAP electrolytic double-layer energy storage capacitors, the 230 EDLC-HV ENYCAP, for energy harvesting and power backup applications in harsh environments. The Vishay BCcomponents 230 EDLC-HV ENYCAP capacitor is the industry's first capacitor with a service life of 2000 hours at +85C and a maximum rated volt ...