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Vishay Launches Thin Film Chip Resistors for Industrial and Aerospace Applications
2022-09
Semiconductors
Vishay
[Sep 20 2022] Vishay Intertechnology, Inc. announced the launch of a new high-precision film chip resistor - PEP, which is suitable for industrial and aerospace applications. In addition to the advanced resistance range, Vishay Sfernice PEP's high rated power and small size dimensions are advanced in the industry, which help to miniaturize and reduce the mechanical stress of solder joints, thus improving relia ...
OmniVision released a new high-definition 120Hz touch display driver chip TD4160
2022-09
Power
OmniVision Technologies Inc
[Sep 20 2022] The LCD touch and display integrated driver chip TD4160 made by OmniVision supports HD+resolution, 120Hz display frame rate, and a-Si panel technology to meet consumers' demand for quality experience in human-computer interaction. TD4160 is used for advanced matrix touch panel, which can drive the integration of touch and display drive with HD resolution of a-Si panel. On the basis of 720 RGB * 1 ...
Nexperia introduces new automotive grade CFP2-HP diodes
2022-09
Semiconductors
Nexperia
[Sep 20 2022] Nexperia announced the launch of 14 types of rectifier diodes for power applications, which are packaged with its new CFP2-HP (copper clip bonded FlatPower) package. Standard version and AECQ-101 version are available, including 45 V, 60 V and 100 V Trench Schottky rectifier diodes (with 1 A and 2 A options). For example, PMEG100T20ELXD-Q is a 100V, 2 A Trench Schottky rectifier diode. For applic ...
Infineon Launches CIPOS Tiny IM323-L6G New Intelligent Power Module
2022-09
Semiconductors
Infineon Technologies
[Sep 20 2022] Infineon launched a new product of CIPOS Tiny IM323-L6G 600 V 15 A, further expanding its product portfolio of CIPOS Tiny Intelligent Power Module (IPM) series. This new IPM uses TRENCHSTOP ™ RC-D2 IGBT power switch devices and advanced SOI grid drive technology can maximize efficiency, achieve higher reliability, and minimize overall dimensions and reduce system costs. Integrated packaging of di ...
Qorvo Launches 1200V Fourth Generation SiC FET with Outstanding Quality Factor in the Industry
2022-09
Power
Qorvo US Inc.
[Sep 20 2022] Qorvo announced the launch of a new generation of 1200V silicon carbide (SiC) field effect transistor (FET) series, which have outstanding performance characterization in the industry in terms of on resistance. The new UF4C/SC series 1200V fourth generation SiC FET is very suitable for the mainstream 800V bus structure, which is commonly used in electric vehicle vehicle charger, industrial batter ...
onsemi Launches Energy Efficient USB Power Supply Scheme
2022-09
Semiconductors
ON Semiconductor
[Sep 20 2022] Onsemi launched a set of three new products for USB power supply (PD) design. The new controller and driver provide innovative functions, which can significantly reduce the bill of materials (BOM) content of energy efficient AC-DC power supply, especially in the load range above 100 W. Shane Chilton, senior director of onsemi Power Conversion Solutions Division, said, "USB PD is an important and ...
Onsemi Launches the World's First Toll Package 650 V Silicon Carbide MOSFET
2022-09
Semiconductors
ON Semiconductor
[Sep 19 2022] Onsemi released the world's first silicon carbide (SiC) MOSFET packaged with To Readless (TOLL). The transistor meets the rapidly growing demand for high-performance switching devices suitable for high power density design. Until recently, SiC devices were packaged with D2PAK 7-pin, which obviously required more space. The size of TOLL package is only 9.90 mm x 11.68 mm, which is 30% less than th ...
Power Integrations Launches Automotive IGBT/SiC Module Driver Product Series SCALE EV
2022-09
Power
Power Integrations
[Sep 19 2022] Power Integrations announced the launch of SCALETM EV series gate driver board for Infineon EconoDUALTM modules. The new drive is also applicable to original, imitation and other new derivative modules using SiC. Its applications include electric vehicles, hybrid and fuel cell vehicles (including buses and trucks), high-power vehicles and traction inverters for construction, mining and agricultur ...
Harwin introduced 0.5mm spacing sandwich connector, expanding the product range for ultra compact applications
2022-09
Power
Harwin Inc.
[Sep 19 2022] Harwin has developed this latest compact sandwich connector to meet the growing market demand for smaller, lighter solutions. Archer. 5 is designed for applications with very limited available space. It is the perfect choice for circuit boards, stacks or PCB connectors. Its application fields include compact control and monitoring equipment, embedded computing, sensor modules, camera/lidar units ...
ams OSRAM NanEyeM micro camera, supporting medical endoscope applications
2022-09
Semiconductors
ams
[Sep 19 2022] NanEyeM micro camera module of ams OSRAM. NanEyeM is a super small disposable digital camera module with digital output, which is suitable for medical endoscope applications, ensuring high sterility and reducing the possibility of cross infection.the module's Low Voltage Differential Signaling (LVDS) serial interface provides a high Signal to Noise Ratio (SNR) digital output, which can transmit s ...
Nexperia Launches New Product Portfolio of Special MOSFET (ASFET) for Automatic Airbag
2022-09
Semiconductors
Nexperia
[Sep 19 2022] Nexperia has introduced a new product portfolio of dedicated MOSFET (ASFET) for automatic airbag applications. The BUK9M20-60EL, which focuses on single N-channel 60V, 13 mOhm conduction internal resistance, logic control level MOSFET, is applied to LFPAK33 packaging. ASFET is a MOSFET specially designed and optimized for a certain application. This portfolio is the latest in Nexperia's range of ...
OmniVision Launches Artificial Intelligence ASIC OAX4600
2022-09
Power
OmniVision Technologies Inc
[Sep 19 2022] OmniVision released Advanced Artificial Intelligence Application Specific Integrated Circuits (ASICs) for the automotive industry, which can simultaneously supply power to a dedicated driver/occupant monitoring system (DMS/OMS) in a seamless manner. The product uses a chip stack architecture to provide integrated RGB IR image signal processing (ISP). It uses two artificial intelligence neural pro ...