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Technology Articles

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Diodes' PCIe 4.0 Mux/DeMux ReDriver solves the challenge of routing high-speed serial bus signals

2020-10 Connectors Diodes Incorporated
[Oct 10 2020] Diodes Incorporated announced that the PI3EQX16612 and PI3EQX16621 PCIExpress compliant ReDriver devices offer four differential channels with 1:2 (demultiplexing) or 2:1 (multiplexing), respectively. PCIe 4.0 is the preferred serial interface used in high-performance IT devices, including desktops, laptops, and workstations, as well as embedded systems. As microprocessor manufacturers continue t ...
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Supermicro introduces a portfolio of second-generation AMD EPYC(TM) processors

2020-10 Power SPEC Sensors, LLC
[Oct 9 2020] Super Micro, a global leader in enterprise computing, storage, networking solutions and green computing technologies, announced that its industry-leading server portfolio optimized for second-generation AMD EPYC processors has achieved 27 world-record performance benchmarks and scores. In addition to featuring the industry's first Blade platform, Supermicro's new H12 A+ server portfolio features ...
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Sensirion introduces new sensor solutions for ventilators

2020-10 Sensors Sensirion AG
[Oct 9 2020] Sensirion's dedicated R&D team has been working hard in recent weeks to develop a new respiratory device sensor that is both easy to integrate into the ventilator and has excellent scalability. Thanks to the tireless efforts of many team members, the SFM3019 flow sensor has now been successfully launched, which will help ventilator manufacturers realize the production of new equipment to meet the ...
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TE introduces a new waterproof, sealed double-lock signal connector

2020-10 Connectors TE Connectivity
[Oct 8 2020] TE Connectivity, a global leader in connectivity and sensors, announced the introduction of a new waterproof, sealed 2.5mm dual-lock signal connector. The new product provides IP67 rated water and dust resistance to protect applications exposed to harsh environments such as high humidity, water, dust and debris. The TE 2.5mm waterproof, sealed dual lock signal connector supports free-hanging and ...
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Maxim announces the next generation of SIMO power management ics

2020-10 Semiconductors Maxim Integrated
[Oct 8 2020] Maxim Integrated Products announced the MAX77654 Single Inductor Multiple Output (SIMO) power management IC (PMIC), which helps consumer product developers reduce solution size by 50% and extend battery life by 20%. This next generation SIMO PMIC uses only a single inductor to provide three outputs with an efficiency of up to 91%, a 16% improvement over traditional four-chip systems. Due to the d ...
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Qualcomm introduces a new energy-efficient single-mode NB2 (NB-IoT) chipset

2020-10 Semiconductors Qualcomm
[Oct 7 2020] According to the Global System for Mobile Communications Association (GSMA), the number of cellular iot connections worldwide will reach 3.2 billion by 2024. Qualcomm Technologies introduces Qualcomm 212 LTE IoT Modem, the world's leading energy-efficient single-mode NB2 (NB-IoT) chipset, a groundbreaking new product designed to drive cellular iot growth and continue to lead wireless technology i ...
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Renesas Electronics launches open source ventilator system reference design

2020-10 Power Renesas Electronics America
[Oct 7 2020] Renesas Electronics, the world's leading provider of semiconductor solutions, announced a new open source ventilator system reference design to help customers quickly design pre-installed circuit boards for medical ventilators. Many areas are experiencing a severe shortage of ventilators as COVID-19 infection rates continue to rise, causing hospitals to outstrip supply of equipment. Chris Allexan ...
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Semtech's LoRa devices are integrated into Balfong's infrared temperature sensors

2020-10 Sensors Semtech
[Oct 6 2020] Semtech Corporation, a leading provider of high-performance analog and mixed-signal semiconductor products and advanced algorithms, announced: Polysense Technologies Inc. (" Polysense "), an innovative provider of Internet of Things (IoT) solutions for fiber optic and wireless sensing, has developed a series of intelligent temperature monitoring products based on Semtech LoRa devices. The real-ti ...
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Diodes introduces the industry's first DisplayPort 2.0 active switch

2020-10 Power Diodes Incorporated
[Oct 6 2020] Diodes Incorporated announced the industry's first DisplayPort 2.0 (UHBR10) compatible 4-channel, 2:1 active switch, PI3DPX8121 with a multiplexer and ReDriver. The device joins the company's portfolio of DisplayPort switching and signal conditioning solutions designed to meet the design needs of PCS, monitors, set-top boxes and other AV devices. DisplayPort was developed to provide data transmis ...
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Vishay introduces a new series of small snap-on aluminum electrolytic capacitors

2020-10 Passive Components Vishay
[Oct 5 2020] Vishay Intertechnology has announced the introduction of a new series of small clip-on aluminum electrolytic capacitors, the 257 PRM-SI, to increase the design power density. Vishay BCcomponents 257 PRM-SI series capacitors have a 20% increase in ripple current and a 20% reduction in form factor over previous generation solutions, providing up to 5,000 hours of service life at 85 C. With A ripple ...
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Transphorm introduces the fourth-generation GaN platform and SuperGaN Power FETs

2020-10 Semiconductors Transphorm
[Oct 5 2020] The first JEDEC-certified device in Transphorm's SuperGaN family is the TP65H300G4LSG. This is a 650V GaN FET in a PQFN88 package with an on-resistance of 240 milliohm. The second SuperGaN device is the TP65H035G4WS, also a 650V GaN FET, in a TO-247 package with a 35 milliohm on-resistance. These devices are currently in the sample phase and will be released in the second and third quarters, resp ...
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Direct Insight introduces the i.MX8 SoM module

2020-10 Power DLP Design Inc.
[Oct 4 2020] System integrator Direct Insight has introduced the QS8M welding module, produced by its long-time partner Ka-Ro Electronics Materials based in Aachen, which integrates NXP I.M8M quad-core or dual-core Cortex-A53 64-bit processors, as well as RAM, flash memory and power management. The module features a QFN-style pin arrangement that provides excellent miniaturization, thermal efficiency and EMI ...