Support
sales@oemstron.com
86-755-83232896
English$ USD
Contact Us
TELEPHONE86-755-83232896
E-MAILsales@oemstron.com
SKYPEcondy@oemstron.com
QQ2881672436
MessageLeave Your Message
Top

Technology Articles

Records 5,523
Page 365/461
Article Cover

XP Power introduces the ultra-compact, high-efficiency ECH450 series of power supplies in either bare board or enclosed form

2020-10 Power XP Power
[Oct 14 2020] XP Power has announced the launch of its new ultra-compact, high-efficiency, bare-plate or enclosed ECH450 series power supply. The ECH450 series has an output power of up to 250W when convection cooling, 450W when forced cooling, or 450W when using a closed model with an integral fan. It offers Class B conduction and radiation standards and is certified by ITE and medical safety regulations worl ...
Article Cover

Vishay's new wireless charging coils directly replace discontinued devices

2020-10 Semiconductors Vishay
[Oct 13 2020] Vishay Intertechnology announced the launch of eight new WPC (Wireless Charging Alliance) -compliant wireless charging coils made of iron powder - the IWAS series and IWTX series, directly replacing devices announced to be discontinued in 2017. Vishay Dale receiving and transmitting coils feature a durable construction and high permeability shielding that is more efficient than a wide range of in ...
Article Cover

OmniVision introduces the world's first 0.7 micron /64 megapixel image sensor

2020-10 Sensors OmniVision Technologies Inc
[Oct 13 2020] OmniVision has announced the launch of its latest image sensor, the OV64B. The OV64B is the industry's only 0.7-micron image sensor with 64 megapixel resolution, and is the first to achieve 64 megapixel resolution in 1/2" optical size. OV This new sensor will make the size of smart phones even slimmer. The OV64B sensor, combined with OmniVision's PureCel Plus stacked chip technology, supports 4K ...
Article Cover

Nexperia has announced a range of MOSFETs for mobile and portable product applications

2020-10 Connectors Nexperia
[Oct 12 2020] Nexperia, a high-capacity production specialist in the production of semiconductor basic components, has announced a range of MOSFET products in an ultra-small DFN0606 package for mobile and portable product applications, including wearables. These devices also offer a low on-resistance RDS(on) with the common 0.35 mm pitch, which simplifies the PCB assembly process. The PMH series MOSFETs are pa ...
Article Cover

ST introduces new automotive communication protection devices with integrated common-mode filters and ESD suppression

2020-10 Semiconductors STMicroelectronics
[Oct 12 2020] STMicroelectronics' vehicle certified ECMF04-4HSM10Y and ECMF04-4HSWM10Y high-speed serial bus automotive common Mode Filters (CMF) incorporate low clamp voltage transient suppression diodes that can be used to protect interface chips. Available in 2.6mm x 1.35mm QFN10L package. As the first common-mode filters on the market to be certified for vehicle specification and automotive surge complianc ...
Article Cover

Sensirion introduces S liquid flow sensor

2020-10 Sensors Sensirion AG
[Oct 12 2020] Sensirion, a leading global manufacturer of flow and environmental sensors, announced the launch of a new product in the SLF3x family: the SLF3S-0600F liquid flow sensor. The SLF3S-0600F bidirectional measures very low flow rates up to ±3000 µl/min and has the same outstanding features as existing SLF3S-1300F sensors. This makes this new sensor suitable for a wide range of applications in diagnos ...
Article Cover

Silanna Semiconductor expands its leadership in the integrated active clamp flyback controller market

2020-10 Semiconductors Signal Transformer
[Oct 12 2020] Silanna Semiconductor, a leader in power density technology, today announced the expansion of its industry-leading active Clamp flyback controller (ACF) product line. Silanna Semiconductor is committed to addressing the ultimate challenge of power management by delivering best-in-class power density and efficiency, and is able to deliver unprecedented savings in BoM costs and meet the multiple ne ...
Article Cover

NXP supplied Murata with RF front-end ics for Wi-Fi 6 modules

2020-10 Semiconductors NXP
[Oct 11 2020] NXP Semiconductors has announced a partnership with Murata, a manufacturer of system-level packaging integrators for 5G mobile platforms, to be the first to deliver radio frequency (RF) front-end modules for the new Wi-Fi 6 standard. The two companies will work together to deliver solutions for next-generation Wi-Fi 6 implementations that reduce design time, shorten time to market and save board ...
Article Cover

On Semiconductor expands its product lineup for industrial motor drives

2020-10 Semiconductors ON Semiconductor
[Oct 11 2020] Driving energy efficient innovation, ON Semiconductor continues to expand its product lineup for industrial motor drive applications to further help customers solve their specific design challenges. Motor drive systems are proliferating with industrial automation and robots. These systems require high energy efficiency, accurate measurement, accurate control and high reliability in harsh industri ...
Article Cover

On Semiconductor introduces new series QCS-AX2 for Wi-Fi 6E applications

2020-10 Semiconductors ON Semiconductor
[Oct 11 2020] ON Semiconductor, the company driving energy efficient innovation, announced the availability of samples for the new QCS-AX2 chipset family, which supports the 6 GHz band based on the enhanced Wi-Fi 6E standard. The new product family is designed with a high-performance, flexible architecture to maximize the use of the 6 GHz band, optimized for high-throughput Wi-Fi applications such as access po ...
Article Cover

Power Integrations has announced a new addition to its InnoSwitch 3-MX isolated switching power supply IC product line

2020-10 Power Power Integrations
[Oct 11 2020] Power Integrations, a well-known company in the field of energy-efficient power conversion for high voltage integrated circuits, announced the expansion of its InnoSwitch3-MX isolated switching power supply IC product line with the addition of three new PowiGaN devices. As part of the InnoMux controller IC chipset with Power Integrations, the new switching power supply IC now supports display and ...
Article Cover

Samsung has announced a 600-megapixel image sensor

2020-10 Sensors Samsung
[Oct 10 2020] Yongin Park, executive vice president of Samsung LSI business, said in a statement on the official website that Samsung is ready to develop 600 million pixel (600MP) sensor products, directly breaking the limit of the human eye (about 500 million pixels). Yongin said that our eyes can distinguish around 500 million pixels of resolution, compared to the 40 million pixels provided by most DSLR came ...